1
David Mosley Garo Khanarian
Garo Khanarian, David Wayne Mosley: Light emitting device having improved light extraction efficiency and method of making same. Rohm and Haas Company, Jonathan D Baskin, April 21, 2009: US07521727 (16 worldwide citation)

A light emitting device including a multi-layer stack and an encapsulant layer having a patterned encapsulant region in optical proximity to a luminous stack surface of the multi-layer stack is disclosed. A method of making that encapsulant layer and of affixing that encapsulant layer to a luminous ...


2
David Mosley Garo Khanarian
Garo Khanarian, David Wayne Mosley: Heat stable aryl polysiloxane compositions. Rohm and Haas Company, Jonathan D Baskin, March 27, 2012: US08142895 (2 worldwide citation)

A curable aryl siloxane composition is disclosed. A heat stable cured aryl polysiloxane composition is further disclosed, along with a method of making that heat stable cured aryl polysiloxane composition from the curable aryl siloxane composition. An encapsulated semiconductor device, and a method ...


3
David Mosley Garo Khanarian
David Wayne Mosley, Garo Khanarian: Aryl (thio)ether aryl polysiloxane composition and methods for making and using same. Rohm and Haas Company, Jonathan D Baskin, October 4, 2011: US08029904 (1 worldwide citation)

A curable aryl (thio)ether aryl silicon composition is disclosed. A cured aryl (thio)ether aryl polysiloxane composition is further disclosed, along with a method of making that cured aryl (thio)ether aryl polysiloxane composition from the curable aryl (thio)ether aryl silicon composition. An encaps ...


4
David Mosley Garo Khanarian
Kathleen A Auld, David M Conner, Garo Khanarian, David Wayne Mosley: Phenoxyphenyl polysiloxane composition and method for making and using same. Rohm and Haas Company, Jonathan D Baskin, January 28, 2014: US08637627

A curable phenoxyphenyl polysiloxane composition is disclosed. A cured phenoxyphenyl polysiloxane composition is further disclosed, along with a method of making that cured phenoxyphenyl polysiloxane composition from the curable phenoxyphenyl silicon composition. An encapsulated semiconductor device ...


5
David Mosley Garo Khanarian
Kathleen A Auld, David M Conner, Garo Khanarian, David Wayne Mosley: Phenoxyphenyl polysiloxane composition and method for making and using same. Rohm and Haas Company, Jonathan D Baskin, Rohm and Haas Electronic Materials, June 11, 2009: US20090146324-A1

A curable phenoxyphenyl polysiloxane composition is disclosed. A cured phenoxyphenyl polysiloxane composition is further disclosed, along with a method of making that cured phenoxyphenyl polysiloxane composition from the curable phenoxyphenyl silicon composition. An encapsulated semiconductor device ...


6
Dana Gronbeck Jeffrey Calvert
Michael K Gallagher, Dana A Gronbeck, Timothy G Adams, Jeffrey M Calvert: Electronic devices having air gaps. Rohm and Haas Electronic Materials, Jonathan D Baskin, May 25, 2010: US07723850 (3 worldwide citation)

A method of forming air gaps within a solid structure is provided. In this method, a sacrificial material is covered by an overlayer. The sacrificial material is then removed through the overlayer to leave an air gap. Such air gaps are particularly useful as insulation between metal lines in an elec ...


7
David Sherrer
David W Sherrer, Noel A Heiks: Optoelectronic component with encapsulant. Rohm and Haas Electronic Materials, Jonathan D Baskin, April 24, 2007: US07208725 (150 worldwide citation)

Provided are optoelectronic components which include a substrate having a front surface, a back surface and a trench in the front surface, an optoelectronic device in the trench, and an encapsulant filling the trench frush to the front surface, wherein the encapsulant provides an optical surface.


8
David Sherrer
David W Sherrer, Noel A Heiks: Wafer-level optoelectronic device substrate. Rohm and Haas Electronic Materials, Jonathan D Baskin, October 30, 2007: US07288758 (148 worldwide citation)

Provided are optoelectronic components which include an optoelectronic device and a structure for self-aligning the optoelectronic device. Also provided are optoelectronic modules and methods of forming optoelectronic components.


9
David Sherrer
David W Sherrer: Microstructures comprising silicon nitride layer and thin conductive polysilicon layer. Shipley Company L L C, Niels Haun, Jonathan D Baskin, March 2, 2004: US06698295 (96 worldwide citation)

Surface micromachined structures having a relatively thick silicon nitride layer and a relatively thin conductive polysilicon layer bonded together. Preferably, the silicon nitride layer and conductive polysilicon layer are made in the same low pressure chemical vapor deposition (LPCVD) step. The po ...


10
David Sherrer
David W Sherrer, John J Fisher: Coaxial waveguide microstructures and methods of formation thereof. Rohm and Haas Electronic Materials, Jonathan D Baskin, March 14, 2006: US07012489 (87 worldwide citation)

Provided are coaxial waveguide microstructures. The microstructures include a substrate and a coaxial waveguide disposed above the substrate. The coaxial waveguide includes: a center conductor; an outer conductor including one or more walls, spaced apart from and disposed around the center conductor ...



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