1
J Fleming Dias, Ganapati R Mauze: Noninvasive blood chemistry measurement method and system. Hewlett Packard Co, John L Imperato, October 27, 1998: US05827181 (179 worldwide citation)

A noninvasive blood chemistry measurement method and system isolate measurement contributions due to a patient's blood to accurately measure blood chemistry. In accordance with a first preferred embodiment of the present invention a noninvasive blood chemistry measurement method decreases the blood ...


2
Rodney J Solomon, Hubert K Yeung: Bending neck for use with invasive medical devices. Hewlett Packard Company, John L Imperato, May 12, 1998: US05749828 (162 worldwide citation)

In the present invention, an easily assembled, reliable bending neck is formed for use with invasive medical devices. The bending neck comprises a series of pivotally hinged segments, each having a central lumen. The segments are positioned end-to-end, while the lumens collectively provide a shaft t ...


3
Brian G Connor: Ultrasound probe having interchangeable accessories. Hewlett Packard Company, John L Imperato, September 30, 1997: US05671747 (112 worldwide citation)

In the present invention, an intraoperative ultrasound transducer probe, or intraoperative probe, has a housing, to which, interchangeable accessories may be attached. The interchangeable accessories adapt the intraoperative probe's shape to provide access to a patient's body parts in confined space ...


4
David V Blackham, Jason Chodora, Joel P Dunsmore: Error correction method for reflection measurements of reciprocal devices in vector network analyzers. Hewlett Packard Company, John L Imperato, May 9, 2000: US06060888 (109 worldwide citation)

An error correction method improves measurement accuracy of a vector network analyzer by reducing reflection measurement errors for a broad class of devices, such as filters, switches, cables, couplers, attenuators, and other passive devices tested by vector network analyzers (VNAs) that are recipro ...


5
Paul Cartier, Wojtek Sudol, Gregory G Vogel: Multiconductor shielded transducer cable. Hewlett Packard Company, John L Imperato, September 3, 1996: US05552565 (57 worldwide citation)

A low cost shielded transducer cable provides electrical connection between an ultrasound transducer and a display processor. A wound transducer cable is constructed in a first embodiment using two layers of stripline assemblies helically wound in opposite directions around a flexible core. The laye ...


6
Ron Barnett, John F Casey: Distributed lossy capacitive circuit element with two resistive layers. Hewlett Packard Company, John L Imperato, August 4, 1998: US05789999 (53 worldwide citation)

A lossy capacitive circuit element, or DC scrubber, is printed on a circuit substrate and absorptively filters high frequency signals in circuit modules. A top conductor of the DC scrubber is separated from a ground conductor by a layer of high dielectric material. A resistive layer, positioned eith ...


7
William K Antle, Michael K Lam, James W Stewart: Light emitting diode assembly having integrated electrostatic discharge protection. Hewlett Packard Company, John L Imperato, June 22, 1999: US05914501 (53 worldwide citation)

A light-emitting diode assembly incorporates a power shunting element that provides electrical over-stress protection to a light-emitting diode (LED) and prevents damage to the LED from electrostatic discharge (ESD). The power shunting element is coupled in parallel to the LED within the LED assembl ...


8
Roger Lee Jungerman, David M Braun: Optical cross-connect switch using a pin grid actuator. Hewlett Packard Company, John L Imperato, November 24, 1998: US05841917 (51 worldwide citation)

An optical cross-connect switch incorporates a pin grid actuator to selectively position optical elements relative to optical beams in the switch. A high density array of aligned, optically reflective elements is attached to the ends of independently selectable and moveable pins in the pin grid actu ...


9
Chandrakant Patel: Thermal interface for a heat sink and a plurality of integrated circuits mounted on a substrate. Hewlett Packard Company, John L Imperato, December 24, 1996: US05587882 (46 worldwide citation)

A referencing scheme provides a thermal interface between a heat sink and chips within a MultiChip Module (MCM). The referencing scheme comprises a heat sink with a support ring that penetrates a trough formed within a substrate of the MCM. A thermal transfer medium positioned between the heat sink ...


10
Michael Peszynski: Rotatable ultrasound transducer finger probe. Hewlett Packard Company, John L Imperato, February 4, 1997: US05598846 (45 worldwide citation)

A rotatable finger probe provides rotation of an image plane about an image axis in interoperative and intra cavity ultrasound imaging applications. A finger clip attaches the rotatable finger probe to a physician's finger and by movement of the finger, the imaging axis is aimed at a patient's body ...