1
Kerry S Wesley, Bradley S Cline deceased: Shape memory wire latch mechanism. TRW, James M Steinberger, Sol L Goldstein, July 14, 1992: US05129753 (54 worldwide citation)

A shape memory wire latch mechanism for releasably connecting two separable structural members. The latch mechanism utilizes the unique material properties of shape memory alloys as a means for releasing the structural members. The latch mechanism includes a pair of mating latch elements and a shape ...


2
Robert Smolley: Apparatus for testing I.C. chip. TRW, James M Steinberger, Sol L Goldstein, Robert J Stern, March 22, 1988: US04733172 (44 worldwide citation)

An improved test probe card for testing unpackaged integrated-circuit (IC) chips prior to installation of the chips in some type of electronic device. The test probe card includes a chip insulating board having openings at positions corresponding to contact areas of an IC chip and a test circuit boa ...


3
Robert Smolley: Backplane interconnection system. TRW, James M Steinberger, Ronald L Taylor, May 28, 1991: US05019945 (38 worldwide citation)

A backplane interconnection system for interconnecting an array of electronic components, such as integrated-circuit (IC) chip packages mounted on multilayer printed circuit boards. The backplane interconnection system includes an interface board and one or more interconnecting circuit board and a p ...


4
Luis Figueroa, Charles B Morrison, Lawrence M Zinkiewicz, Joseph W Niesen: Angled stripe superluminescent diode. TRW, James M Steinberger, Sol L Goldstein, August 8, 1989: US04856014 (30 worldwide citation)

A semiconductor light-emitting device structured similarly to an index-guided laser, but having waveguide channels that are formed at a selected small angle of inclination with respect to a direction normal to cleaved facets formed in the structure. The angle of inclination should be as least half t ...


5
Joseph D Leibowitz: Multilayer printed circuit board for ceramic chip carriers. TRW, James M Steinberger, Sol L Goldstein, March 21, 1989: US04814945 (29 worldwide citation)

A multilayer printed circuit board in which multiple layers of a composite material, fabricated by the lay-up of an aramid fiber tape, are employed to provide a circuit board with a desired coefficient of thermal expansion. Tape lay-up of aramid fibers provides a composite layer having a lower therm ...


6
Chung K Chan, Emanuel Tward: Multistage pulse tube cooler. TRW, James M Steinberger, Sol L Goldstein, April 28, 1992: US05107683 (29 worldwide citation)

A multistage pulse tube cooler in which a portion of the heat from each successively lower-temperature pulse tube cooler is rejected to a heat sink other than the preceding higher-temperature pulse tube cooler, thus substantially improving the overall efficiency of the multistage cooler. Multistage ...


7
Kenneth H Rourke, Raymond J Hart: Multipurpose modular spacecraft. TRW, James M Steinberger, Sol L Goldstein, November 14, 1989: US04880187 (28 worldwide citation)

A multipurpose modular spacecraft is adaptable quickly and easily for performing a variety of short- and long-range space missions, such as on-orbit maintenance missions and the like. The multipurpose modular spacecraft comprises a fully integrated short-range space vehicle including one or more rel ...


8
George G Pinneo, Marijan D Grgas: Hermetically sealed aluminum package for hybrid microcircuits. TRW, James M Steinberger, G Gregory Schivley, Ronald L Taylor, June 29, 1993: US05223672 (26 worldwide citation)

A hybrid package in which Kovar feedthroughs are friction welded to an aluminum housing. Friction welding produces a very strong weld joint which resists the thermal stresses induced between the aluminum housing and Kovar feedthroughs by the large difference in their coefficients of thermal expansio ...


9
John M Thole, Michael S Kelly: Modular solid-propellant launch vehicle and related launch facility. TRW, James M Steinberger, Sol L Goldstein, June 8, 1993: US05217188 (26 worldwide citation)

A family of modular solid-propellant launch vehicles and a related launch facility for placing a wide range of payloads in earth orbit at greatly reduced costs compared to present day launch systems. The basic family of modular solid-propellant launch vehicles is constructed from only two sizes of m ...


10
Jane J J Yang, William W Simmons, Michael Jansen, Jaroslava Z Wilcox, Moshe Sergant: Ion milling method. TRW, James M Steinberger, September 26, 1989: US04869780 (26 worldwide citation)

An ion milling method is disclosed that provides a manufacturing technique for mass producing microscopic surface features using a wide variety of media that includes semiconductors, metals, and glasses. In the preferred embodiment, vertical and 45 degree mirrors are formed simultaneously in semicon ...