1
Paul P Lee, Robert M Guidash, Teh Hsuang Lee, Eric G Stevens: Active pixel sensor integrated with a pinned photodiode. Eastman Kodak Company, James D Leimbach, April 29, 1997: US05625210 (260 worldwide citation)

The optimization of two technologies (CMOS and CCD) wherein a pinned photodiode is integrated into the image sensing element of an active pixel sensor. Pinned photodiodes are fabricated with CCD process steps into the active pixel architecture. Charge integrated within the active pixel pinned photod ...


2
Mark Marshall Meyers: Compact digital camera with segmented fields of view. Eastman Kodak Company, James D Leimbach, October 24, 2000: US06137535 (248 worldwide citation)

A compact digital camera is formed with a lenslet array comprised of a plurality of lenslets, each lenslet has a decentration corresponding to its radial position in the lenslet array so that the axial ray of each lenslet views a different segment of a total field of view. A photosensor array compri ...


3
Keith Holden Sheridan: Image distribution method and system. Eastman Kodak Company, Gordon M Stewart, James D Leimbach, June 2, 1998: US05760917 (246 worldwide citation)

A distribution system and method which can be executed by such a system. The system comprises: first terminal remote from a hub station, having: a selection from among a plurality of possible access rights to generate a granted access right set which contains a set of access rights to a remotely sto ...


4
Bryan A Beaman, Julie K Gerstenberger, David M Orlicki: Imager package substrate. Eastman Kodak Company, James D Leimbach, October 13, 1998: US05821532 (181 worldwide citation)

An image head assembly comprising: a substrate with at least a pair of apertures formed in the substrate; an optical assembly having at least a pair of pins that mate with the apertures within the substrate, the pins to the optical assembly being fixedly secured to the apertures within the substrate ...


5
Mark Marshall Meyers: Compact image capture device. Eastman Kodak Company, James D Leimbach, October 31, 2000: US06141048 (143 worldwide citation)

The image capture device incorporates an array of photodetectors, utilizing an integral current mirror formed at each photodetector location to increase photodetector current output. A correlated double sampling circuit is also formed at each photodetector location to sum the current generated by th ...


6
Robert M Guidash, Paul P Lee, Teh Hsuang Lee: Color active pixel sensor with electronic shuttering, anti-blooming and low cross-talk. Eastman Kodak Company, James D Leimbach, November 16, 1999: US05986297 (126 worldwide citation)

An active pixel sensor architecture comprising a semiconductor substrate having a plurality of pixels formed, thereon, incorporating microlens and lightshields into the pixel architecture. Each of the pixels further comprising: a photodetector region upon which incident light will form photoelectron ...


7
David William Dellert, Stephen L Shaffer, Maja Aniela Gruszynski, Gregory Richard Bryniarski, Brian Neil Westrich: Index imaging system. Eastman Kodak Company, James D Leimbach, November 28, 2000: US06154755 (117 worldwide citation)

An index imaging system includes: a scanner for scanning a plurality of photographic images to produce a corresponding plurality of digital images; a computer connected to the scanner for receiving the digital images and generating a corresponding plurality of thumbnail digital images and containing ...


8
Robert M Guidash: Active pixel image sensor with shared amplifier read-out. Eastman Kodak Company, James D Leimbach, August 22, 2000: US06107655 (100 worldwide citation)

An image sensor having a plurality of pixels arranged in a series of row and columns comprising: a semiconductor substrate having a plurality of pixels formed in rows and columns with at least two row adjacent pixels and at least two column adjacent pixels formed within the substrate; and at least o ...


9
Dean A Johnson, William R Laubengayer, Stephen G Richardson: Multiple circuit board assembly having an interconnect mechanism that includes a flex connector. Eastman Kodak Company, James D Leimbach, June 29, 1999: US05917709 (97 worldwide citation)

A multiple circuit board assembly comprising: a first circuit board having a first predetermined set of conductive traces on a surface; a second circuit board having a second predetermined set of conductive traces on a surface; an interconnect mechanism having a third set of traces that mate the fir ...


10
George J Kelen: Surface ECG frequency analysis system and method based upon spectral turbulence estimation. Del Mar Avionics, Derrick M Reid, James D Leimbach, W D English, March 3, 1992: US05092341 (97 worldwide citation)

Frequency domain ECG signal processing systems and methods plot spectral maps and compute statistical parameters from surface electrocardiographic signals, which plots and parameters reveal abnormalities of electrical conduction within the hearts of patients at risk of ventricular tachycardia. Fouri ...