1
Jack E Olson, Thomas G Price: System and method for database update replication. J Scott Denko, Fulbright & Jaworski L, November 30, 1999: US05995980 (159 worldwide citation)

The present invention provides a new, high-performance system and method for updating databases or other data compilations with changes entered in a source database or data compilation. Updates are preprocessed to reduce system update demands while increasing update flexibility for remote processing ...


2
David L Roper, James W Cady, James Wilder, James Douglas Wehrly Jr, Jeff Buchle, Julian Dowden: Pitch change and chip scale stacking system. Staktek Group, Andrews Kurth L, J Scott Denko, May 30, 2006: US07053478 (108 worldwide citation)

The present invention stacks integrated circuits into modules that conserve board surface area. In a two-high stack or module devised in accordance with a preferred embodiment of the present invention, a pair of integrated circuits is stacked, with one integrated circuit above the other. The two int ...


3
Russell Rapport, Jeff Buchle: Clock driver with instantaneously selectable phase and method for use in data communication systems. Staktek Group, J Scott Denko, George &plus Donaldson, August 28, 2001: US06282210 (88 worldwide citation)

A clock driver providing a clock signal, from an input clock signal, that has instantaneously selectable phase and methods for synchronizing data transfers in a multi-signal bus communication system. A clock driver of the present invention generates an output clock signal from an input clock signal ...


4
Dan A Marohl, Kenny King Tai Ngan: End effector for semiconductor wafer transfer device and method of moving a wafer with an end effector. Applied Materials, J Scott Denko, Fulbright & Jaworski L, May 5, 1998: US05746460 (82 worldwide citation)

An end effector for a transfer robot used in connection with the manufacture of semiconductor wafers is provided. The end effector is designed to handle very thin (0.005"-0.010") semiconductor wafers which tend to bow during processing. The robot blade or end effector includes a deep pocket for rece ...


5
Carmen D Burns: Method of manufacturing a surface mount package. Staktek Group, J Scott Denko, George & Donaldson L, March 27, 2001: US06205654 (77 worldwide citation)

The present invention provides a method and apparatus for fabricating densely stacked ball-grid-array packages into a three-dimensional multi-package array. Integrated circuit packages are stacked on one another to form a module. Lead carriers provide an external point of electrical connection to bu ...


6
Carmen D Burns, David Roper, James W Cady: Flexible circuit connector for stacked chip module. Staktek Group, J Scott Denko, June 3, 2003: US06572387 (72 worldwide citation)

The present invention provides a flexible circuit connector for electrically coupling IC devices to one another in a stacked configuration. Each IC device includes: (1) a package having top, bottom, and peripheral sides; and (2) external leads that extend out from at least one of the peripheral side ...


7
Russell Rapport: Reflection-control system and method. Staktek Group, Andrews Kurth, J Scott Denko, January 31, 2006: US06992501 (70 worldwide citation)

A termination circuit changes impedance to match a transmission line impedance. The change is made after a signal driver applies a signal through the termination circuit to the transmission line but before a signal reflection returns from an end of the transmission line.


8
Julian Partridge, James Douglas Wehrly Jr, David Roper: Stacked module systems and method. Staktek Group, Andrews Kurth, J Scott Denko, April 25, 2006: US07033861 (66 worldwide citation)

A combination composed from a form standard and a CSP is attached to flex circuitry. Solder paste is applied to first selected locations on the flex circuitry and adhesive is applied to second selected locations on the flex circuitry. The flex circuitry and the combination of the form standard and C ...


9
Carmen D Burns, David Roper, James W Cady: Flexible circuit connector for stacked chip module. Staktek Group, J Scott Denko, June 27, 2006: US07066741 (65 worldwide citation)

The present invention provides a flexible circuit connector for electrically coupling IC devices to one another in a stacked configuration. Each IC device includes: (1) a package having top, bottom, and peripheral sides; and (2) external leads that extend out from at least one of the peripheral side ...


10
James W Cady, Julian Partridge, James Douglas Wehrly Jr, James Wilder, David L Roper, Jeff Buchle: Low profile chip scale stacking system and method. Staktek Group, Andrews Kurth, J Scott Denko, April 11, 2006: US07026708 (64 worldwide citation)

The present invention stacks chip scale-packaged integrated circuits (CSPs) into low profile modules that conserve PWB or other board surface area. Low profile contacts are created by any of a variety of methods and materials. A consolidated low profile contact structure and technique is provided fo ...