21
Emanuele Frank Lopergolo, Lewis Sigmund Goldmann, Joseph Michael Sullivan, Charles Russell Tompkins Jr: High density electrical interconnect apparatus and method. International Business Machines Corporation, Ira D Blecker, Aziz M Ahsan, September 1, 1998: US05800184 (73 worldwide citation)

The present invention relates generally to a new apparatus and method for use in chip, module, card, etc., burn-in and/or test or electrical interconnection. More particularly, the invention encompasses an apparatus that is used as a temporary media between a chip, module, card, etc., that needs to ...


22
James H Hesson, Jay LeBlanc, Stephen J Ciavaglia: Apparatus to dynamically control the out-of-order execution of load-store instructions in a processor capable of dispatching, issuing and executing multiple instructions in a single processor cycle. International Business Machines Corporation, Ira D Blecker, Whitham Curtis Whitham & McGinn, March 25, 1997: US05615350 (73 worldwide citation)

An apparatus to dynamically controls the out-of-order execution of load/store instructions by detecting a store violation condition and avoiding the penalty of a pipeline recovery process. The apparatus permits a load and store instruction to issue and execute out of order and incorporates a unique ...


23
John Preston Benedict, David Mark Dobuzinsky, Philip Lee Flaitz, Erwin N Hammerl, Herbert Ho, James F Moseman, Herbert Palm, Seiko Yoshida, Hiroshi Takato: Shallow trench isolation with oxide-nitride/oxynitride liner. International Business Machines Corporation, Ira D Blecker, April 4, 2000: US06046487 (71 worldwide citation)

Disclosed is an improved process and liner for trench isolation which includes either a single oxynitride layer or a dual oxynitride (or oxide)/nitride layer. Such a process and liner has an improved process window as well as being an effective O.sub.2 diffusion barrier and resistant to hot phosphor ...


24
Daniel George Berger, Shaji Farooq, Lester Wynn Herron, James N Humenik, John Ulrich Knickerbocker, Robert William Pasco, Charles H Perry, Krishna G Sachdev: Polymer and ceramic composite electronic substrates. International Business Machines Corporation, Ira D Blecker, March 4, 2003: US06528145 (71 worldwide citation)

A composite electronic and/or optical substrate including polymeric and ceramic material wherein the composite substrate has a dielectric constant less than 4 and a coefficient of thermal expansion of 8 to 14 ppm/°C. at 100° C. The composite substrate may be either ceramic-filled polymeric material ...


25
Peter J Brofman, John U Knickerbocker, Sudipta K Ray, Kathleen A Stalter: Z-axis compressible polymer with fine metal matrix suspension. International Business Machines Corporation, Robert Curcio, Ira D Blecker, DeLio & Peterson, August 7, 2001: US06270363 (66 worldwide citation)

A compressible interposer comprising an interposer sheet having a plurality of apertures filled with a dielectric material having a substantially uniform suspension of conductive particles therein forming a plurality of conductive sites. Preferably, the number of conductive sites on the interposer a ...


26
Herbert R Anderson Jr, Renuka S Divakaruni, Joseph M Dynys, Steven M Kandetzke, Daniel P Kirby, Raj N Master, Jon A Casey: Method of making multilayered ceramic structures having an internal distribution of copper-based conductors. International Business Machines Corporation, Anne V Dougherty, Ira D Blecker, December 5, 1989: US04885038 (65 worldwide citation)

The present invention provides a method for producing multilayered ceramic structures having copper-based conductors therein, wherein the onset of sintering of the copper-based conductor can be adjusted to approach or match that of the ceramic portion of the structure. In addition, methods are provi ...


27
Bernard Auda: Method of forming a via-hole having a desired slope in a photoresist masked composite insulating layer. International Business Machines Corporation, Ira D Blecker, March 21, 1989: US04814041 (64 worldwide citation)

In a dry etching equipment, a variable gas mixture composition provides etch and ash simultaneously. For example, when a SiO.sub.2 /phospho silicate glass composite insulating layer with a respective thickness of about 300 and 600 nm masked by a patterned photoresist layer is to be etched, a CHF.sub ...


28
Charles H Perry, Tibor L Bauer, David C Long, Bruce C Pickering, Pierre C Vittori: Probe card assembly having a ceramic probe card. International Business Machines Corporation, Ira D Blecker, August 13, 1996: US05546012 (63 worldwide citation)

Disclosed is a probe card assembly which includes an interface card having a plurality of contact pads on at least one surface thereof, a probe card having a plurality of contact pads on at least one surface thereof, and a carousel interposed between the interface card and the probe card having a pl ...


29
David W Boss, Timothy W Carr, Derry J Dubetsky, George M Greenstein, Warren D Grobman, Carl P Hayunga, Amanda H Kumar, Walter F Lange, Robert H Massey, Paul H Palmateer, John A Romano, Da Yuan Shih: Sealing and stress relief layers and use thereof. International Business Machines Corporation, Anne V Dougherty, Ira D Blecker, November 14, 1989: US04880684 (56 worldwide citation)

Sealing and stress relief are provided to a low-fracture strength glass-ceramic substrate. Hermeticity is addressed through the use of capture pads in alignment with vias and through polymer overlays with interconnection between the underlying via or pad metallurgy and the device, chip, wire or pin ...


30
Eugene R Atwood, Joseph A Benenati, James J Dankelman, Horatio Quinones, Karl J Puttlitz, Eric J Kastberg: Zero force heat sink. International Business Machines Corporation, Ira D Blecker Esq, McGuireWoods, April 3, 2001: US06212070 (55 worldwide citation)

A heat sink in a heat transfer relationship with a substrate such as an integrated chip, chip carrier, or other electronic package. The heat sink is connected to a frame which is connected to a printed circuit board or other suitable support on which the substrate is positioned. The heat sink, which ...