1
James E Jervis: Medical devices incorporating sim alloy elements. Raychem Corporation, Ira D Blecker, May 19, 1987: US04665906 (1504 worldwide citation)

Medical devices which are currently proposed to use elements made from shape memory alloys may be improved by the use of stress-induced martensite alloy elments instead. The use of stress-induced martensite decreases the temperature sensitivity of the devices, thereby making them easier to install a ...


2
John E Campbell, William T Devine, Kris V Srikrishnan: Method and structure for buried circuits and devices. International Business Machines Corporation, Ira D Blecker, November 28, 2006: US07141853 (180 worldwide citation)

A method and structure for fabricating an electronic device using an SOI technique that results in formation of a buried oxide layer. The method includes fabricating at least one first component of the electronic device and fabricating at least one second component of the electronic device, wherein ...


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Corey J McMills, John S Mattis, James C Milroy: Method and apparatus for sealing a coaxial cable coupling assembly. Raychem Corporation, Dennis E Kovach, Ira D Blecker, June 23, 1987: US04674818 (177 worldwide citation)

A hollow, cylindrically shaped, elastically deformable sealant member is disposed over external threads of a mounting unit, and subsequently a driver element having internal threads matable with the external threads is screwed onto the external threads, an elasticity and inside diameter of the seala ...


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Michael P Belyansky, Dureseti Chidambarrao, Omer H Dokumaci, Bruce B Doris, Oleg Gluschenkov: Structure and method to improve channel mobility by gate electrode stress modification. International Business Machines Corporation, Whitham Curtis & Christofferson P C, Ira D Blecker, December 20, 2005: US06977194 (158 worldwide citation)

In producing complementary sets of metal-oxide-semiconductor (CMOS) field effect transistors, including nFET and pFET), carrier mobility is enhanced or otherwise regulated through the reacting the material of the gate electrode with a metal to produce a stressed alloy (preferably CoSi2, NiSi, or PdS ...


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Mary P Quin: Nickel/titanium/vanadium shape memory alloy. Raychem Corporation, Ira D Blecker, James W Peterson, Herbert G Burkard, March 19, 1985: US04505767 (143 worldwide citation)

Nickel/titanium alloys having a nickel:titanium atomic ratio between about 1:02 and 1:13 and a vanadium content between about 4.6 and 25.0 atomic percent show constant stress versus strain behavior due to stress-induced martensite in the range from about 0.degree. to 60.degree. C.


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William G Bloom, Gary I Geschwind: Bi-Polar electrocautery needle. Raychem Corporation, Ira D Blecker, James W Peterson, Herbert G Burkard, November 20, 1984: US04483338 (124 worldwide citation)

A bi-polar electrocautery needle comprising an inner electrode, an outer electrode and recoverable insulating-locking member for insulating the electrodes from one another and locking them into relative position to one another. And the method of making the bi-polar electrocautery needle in accordanc ...


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Peter J Brofman, Sudipta K Ray, Kathleen A Stalter: Method of interconnecting electronic components using a plurality of conductive studs. International Business Machines Corporation, Peter W Peterson, Ira D Blecker, DeLio & Peterson, July 10, 2001: US06258625 (119 worldwide citation)

A method of interconnecting electronic components by using a plurality of conductive studs on a surface of a first electronic component and a plurality of corresponding conductive vias on the surface of a second electronic component. Camber on the surface of electronic components may be overcome by ...


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Hormazdyar Minocher Dalal, Kenneth Michael Fallon: Direct chip attach circuit card. International Business Machines Corporation, Ira D Blecker, Aziz M Ahsan, August 18, 1998: US05796591 (116 worldwide citation)

A structure and a method is disclosed for making a laminated circuit carrier card for the purpose of making a Direct Chip Attached Module (DCAM) with low cost and high reliability. The carrier is made using an organic or an inorganic laminated carrier having at least one surface available for direct ...


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Raschid J Bezama, Jon A Casey, John B Pavelka, Glenn A Pomerantz: Method of forming a multilayer electronic packaging substrate with integral cooling channels. International Business Machines Corporation, Ira D Blecker, February 16, 1999: US05870823 (114 worldwide citation)

Disclosed is an electronic packaging substrate which includes a sintered ceramic body having at least one internal layer of wiring and at least one cooling channel internal to and integral with the sintered ceramic body for cooling a heat-generating electronic device placed on the sintered body. Als ...