1
Kosuke Azuma: Semiconductor devices having different package sizes made by using common parts. NEC Corporation, Hayes Soloway PC, December 24, 2002: US06498392 (188 worldwide citation)

A semiconductor device having a semiconductor element and a plurality of segments formed by dividing a conductive plate. Some of the segments are electrically coupled with electrodes of said semiconductor element and constitute lead pad portions as mounting electrodes of the semiconductor device. Ot ...


2
John Scott Thomas, Ron McDonald, Tom Little, George Chamberlain: Method and apparatus for testing image sensing circuit arrays. Symagery Microsystems, Hayes Soloway PC, December 3, 2002: US06489798 (158 worldwide citation)

A method and apparatus for testing an image sensor array such as a C-MOS imager which has sensing circuits arranged in rows and columns and wherein the sensing circuits include photosensitive devices is described. A reset voltage is applied to the photosensitive device in each of the sensor circuits ...


3
Wataru Takahashi, Kazuya Kikuchi, Yoshihiro Kuroi: Locking and unlocking mechanism of cable connector and method for locking and unlocking. NEC TOKIN Corporation, Hayes Soloway PC, September 10, 2002: US06447170 (56 worldwide citation)

A locking and unlocking mechanism of a cable connector, consisting of a connector and a housing, and a method for locking and unlocking the cable connector capable of providing a reliable connection of a cable even when a cable connecting operation is carried out by holding the cable. The connector ...


4
Masahiro Yanagisawa: Magnetic disc apparatus and magnetic head in which a recording/reproduction element is mounted on a slider via a piezoelectric element. NEC Corporation, Hayes Soloway PC, November 26, 2002: US06487045 (38 worldwide citation)

A recording/reproduction element is mounted on a magnetic head slider via a piezoelectric element so that a displacement of the piezoelectric element performs fine control of the position of the recording/reproduction, thus enabling fine spacing and high tract positioning accuracy. This improves lin ...


5
Stephen F Nee: Method and apparatus for coupling structures to roofing. Hayes Soloway PC, July 4, 2006: US07069698 (32 worldwide citation)

An apparatus and method of coupling structures to a roof is made up of a multi-layered roofing assembly having a structure with a first portion disposed between the layers and a second portion disposed outside the layers. The structure may be embodied as a snow guard to help maintain snow on a roof ...


6
Richard C Abbott, Gary P Magnant, George Corey, Ole Sandven: Deposited resistive coatings. ThermoCeramiX, Hayes Soloway PC, July 13, 2004: US06762396 (31 worldwide citation)

The present invention involves coatings deposited on a substrate including a layer having a selected resistivity. The resistive layer can serve as a heat source in a variety of applications and can be fabricated using an arc plasma spraying procedure.


7
Mark D Morrison: Animal entertainment device. MPDI, Hayes Soloway PC, September 20, 2005: US06945195 (28 worldwide citation)

An entertainment device for use by animals is disclosed. The entertainment device can have a hollow enclosure with access openings and exit openings. The hollow enclosure may have one or more play items with diameters larger than the access openings and the exit openings within the enclosure. The ho ...


8
Mark D Morrison: Cable retractor for an electronic device. Hayes Soloway PC, December 19, 2006: US07151912 (26 worldwide citation)

A cable retractor assembly is capable of retracting a cable onto a rotatable reel, the rotatable reel being urged to rotate in a predetermined direction by a biasing force. A moveable actuator when located in a first position is capable of overcoming the biasing force that urges the cable to be woun ...


9
Tatsuya Usami: Semiconductor device and method of manufacturing the same. NEC Corporation, Hayes Soloway PC, February 4, 2003: US06514852 (25 worldwide citation)

A method for manufacturing a multi-level interconnection structure in a semiconductor device includes the steps of consecutively forming an anti-diffusion film and an interlevel dielectric film on a first level Cu layer, forming first through third hard mask films on the interlevel dielectric film, ...


10
Christopher J Corcoran, Richard R Fontana: Motor assembly allowing output in multiple degrees of freedom. Engineering Matters, Hayes Soloway PC, June 21, 2005: US06909205 (24 worldwide citation)

A motor allowing multiple degrees of output freedom includes a stator having an interior surface forming at least a portion of a sphere or curved surface and first and second substantially orthogonally positioned stator coils wound on the interior surface. A rotor is fixed to an output shaft and mov ...