1
Amit Gupta, Sriraman Venkataraman, Geoffrey Baehr: Method and apparatus for local advertising. Sun Microsystems, Philip J McKay, Gunnison McKay & Hodgson L, November 26, 2002: US06487538 (519 worldwide citation)

A method and apparatus for local advertising. Internet Service Providers (ISPs) or proxies owned by an ISP insert advertisements transmitted from a web host to a client. The advertisement may be stored in the proxy's cache or may be retrieved from a web server for an advertiser. By providing th ...


2
David Jon Hiner, Ronald Patrick Huemoeller, Sukianto Rusli: Method of manufacturing a semiconductor package. Amkor Technology, Gunnison McKay & Hodgson L, Serge J Hodgson, March 6, 2007: US07185426 (251 worldwide citation)

A semiconductor package including top-surface terminals for mounting another semiconductor package provides a three-dimensional circuit configuration that can provide removable connection of existing grid-array packages having a standard design. A semiconductor die is mounted on an electrically conn ...


3
Christopher Marc Scanlan, Ronald Patrick Huemoeller: Semiconductor package including a top-surface metal layer for implementing circuit features. Amkor Technology, Gunnison McKay & Hodgson L, Serge J Hodgson, December 15, 2009: US07633765 (212 worldwide citation)

A semiconductor package including a top-surface metal layer for implementing circuit features provides improvements in top-surface interconnect density, more flexible routing and mounting of top surface semiconductor packages, dies and passive components or a conformal shield cap implementation. The ...


4
Paul M Agbabian: Security management system including feedback and control. Symantec Corporation, Gunnison McKay & Hodgson L, December 30, 2008: US07472422 (200 worldwide citation)

A system uses automatic feedback and control to secure a network infrastructure by iterative convergence of the network's security structure to meet a security policy. Following initialization, a security feedback control system of the security management system makes dynamic adjustments to the syst ...


5
Matthias Hütsch, Ralf Hofmann, Kai Sommerfeld: Network portal system and methods. Sun Microsystems, Gunnison McKay & Hodgson L, Forrest Gunnison, September 11, 2007: US07269664 (187 worldwide citation)

A network portal system includes a web-top manager and a universal content broker system. The web-top manager is configured to receive a content request from a user device, where the content request includes a content provider identifier. The universal content broker system is coupled to the web-top ...


6
James B Burr: Method for engineering the threshold voltage of a device using buried wells. Sun Microsystems, Philip J McKay, Gunnison McKay & Hodgson L, December 3, 2002: US06489224 (176 worldwide citation)

Buried platform wells are specifically used to electrically interact with the platform transistors of the invention. The dopant concentration distribution of the buried platform wells is used to change the threshold voltage of the platform transistors of the invention by introducing a tail dopant co ...


7
Thomas P Glenn, Steven Webster, Tony Arellano: Wafer scale image sensor package fabrication method. Amkor Technology, Serge J Hodgson, Gunnison McKay & Hodgson L, January 7, 2003: US06503780 (174 worldwide citation)

To form an image sensor package, a series of shallow cuts are made in an interior surface of a window sheet having a plurality of windows. A window support layer is formed on an upper surface of a wafer having a plurality of image sensors. The interior surface of the window sheet is pressed into the ...


8
Thomas P Glenn, Steven Webster, Tony Arellano: Wafer scale image sensor package. Amkor Technology, Serge J Hodgson, Gunnison McKay & Hodgson L, June 18, 2002: US06407381 (173 worldwide citation)

An image sensor package includes an image sensor having bond pads and an active area on an upper surface of the image sensor. The image sensor package further includes a window support on the upper surface of the image sensor. The window support entirely encloses the upper surface including the acti ...


9
Gary L Swiss, Thomas P Glenn: Method for fabricating a snapable multi-package array substrate, snapable multi-package array and snapable packaged electronic components. Amkor Technology, Philips J McKay, Gunnison McKay & Hodgson L, September 3, 2002: US06444499 (171 worldwide citation)

A method for forming a snapable multi-package array substrate, snapable multi-package array and snapable packaged electronic components is disclosed. The snapable multi-package substrate is formed with trenches that separate and define sections where individual packaged electronic components are fab ...


10
Gary D Foster: Software packaging and distribution system. Sun Microsystems, Philip J McKay, Gunnison McKay & Hodgson L, January 6, 2004: US06675382 (166 worldwide citation)

A method and apparatus for packaging and distributing software. Embodiments of the invention comprise a software packaging system that is portable across many platforms. Each package is self-contained in form of a single-file entity that comprises a payload file and a control file. The payload file ...