1
John Rogers, Ralph Nuzzo, Matthew Meitl, Etienne Menard, Alfred J Baca, Michael Motala, Jong Hyun Ahn, Sang II Park, Chang Jae Yu, Heung Cho Ko, Mark Stoykovich, Jongseung Yoon: Optical systems fabricated by printing-based assembly. The Board of Trustees of the University of Illinois, Greenlee Sullivan P C, July 5, 2011: US07972875 (255 worldwide citation)

Provided are optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising ...


2
Ralph G Nuzzo, John A Rogers, Etienne Menard, Keon Jae Lee, Dahl Young Khang, Yugang Sun, Matthew Meitl, Zhengtao Zhu: Methods and devices for fabricating and assembling printable semiconductor elements. The Board of Trustees of the University of Illinois, Greenlee Sullivan P C, July 19, 2011: US07982296 (177 worldwide citation)

The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoe ...


3
Etienne Menard: Reinforced composite stamp for dry transfer printing of semiconductor elements. Semprius, Greenlee Sullivan P C, April 19, 2011: US07927976 (173 worldwide citation)

Provided are reinforced composite stamps, devices and methods of making the reinforced composite stamps disclosed herein. Reinforced composite stamps of certain aspects of the present invention have a composition and architecture optimized for use in printing systems for dry transfer printing of sem ...


4
Ralph G Nuzzo, John A Rogers, Etienne Menard, Keon Jae Lee, Dahl Young Khang, Yugang Sun, Matthew Meitl, Zhengtao Zhu, Heung Cho Ko, Shawn Mack: Printable semiconductor structures and related methods of making and assembling. The Board of Trustees of the University of Illinois, Greenlee Sullivan P C, September 21, 2010: US07799699 (162 worldwide citation)

The present invention provides a high yield pathway for the fabrication, transfer and assembly of high quality printable semiconductor elements having selected physical dimensions, shapes, compositions and spatial orientations. The compositions and methods of the present invention provide high preci ...


5
John A Rogers, Dahl Young Khang, Yugang Sun, Etienne Menard: Stretchable form of single crystal silicon for high performance electronics on rubber substrates. The Board of Trustees of the University of Illinois, Greenlee Sullivan P C, June 12, 2012: US08198621 (138 worldwide citation)

The present invention provides stretchable, and optionally printable, semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise deformed. Stretchable semiconductors and electronic circuits of the present invention preferred for some ...


6
John A Rogers, Ralph G Nuzzo, Matthew Meitl, Heung Cho Ko, Jongseung Yoon, Etienne Menard, Alfred J Baca: Release strategies for making transferable semiconductor structures, devices and device components. The Board of Trustees of the University of Illinois, Greenlee Sullivan P C, April 26, 2011: US07932123 (111 worldwide citation)

Provided are methods for making a device or device component by providing a multilayer structure having a plurality of functional layers and a plurality of release layers and releasing the functional layers from the multilayer structure by separating one or more of the release layers to generate a p ...


7
Ralph G Nuzzo, John A Rogers, Etienne Menard, Keon Jae Lee, Dahl Young Khang, Yugang Sun, Matthew Meitl, Zhengtao Zhu: Pattern transfer printing by kinetic control of adhesion to an elastomeric stamp. The Board of Trustees of the University of Illinois, Greenlee Sullivan P C, May 17, 2011: US07943491 (110 worldwide citation)

The present invention provides methods, systems and system components for transferring, assembling and integrating features and arrays of features having selected nanosized and/or microsized physical dimensions, shapes and spatial orientations. Methods of the present invention utilize principles of ...


8
Ralph G Nuzzo, John A Rogers, Etienne Menard, Keon Jae Lee, Dahl Young Khang, Yugang Sun, Matthew Meitl, Zhengtao Zhu, Heung Cho Ko, Shawn Mack: Printable semiconductor structures and related methods of making and assembling. The Board of Trustees of the University of Illinois, Greenlee Sullivan P C, October 18, 2011: US08039847 (102 worldwide citation)

The present invention provides a high yield pathway for the fabrication, transfer and assembly of high quality printable semiconductor elements having selected physical dimensions, shapes, compositions and spatial orientations. The compositions and methods of the present invention provide high preci ...


9
Ralph G Nuzzo, John A Rogers, Etienne Menard, Keon Jae Lee, Dahl Young Khang, Yugang Sun, Matthew Meitl, Zhengtao Zhu, Heung Cho Ko, Shawn Mack: Printable semiconductor structures and related methods of making and assembling. The Board of Trustees of the University of Illinois, Greenlee Sullivan P C, March 12, 2013: US08394706 (86 worldwide citation)

The present invention provides a high yield pathway for the fabrication, transfer and assembly of high quality printable semiconductor elements having selected physical dimensions, shapes, compositions and spatial orientations. The compositions and methods of the present invention provide high preci ...


10
Edmund G Seebauer, Richard D Braatz, Michael Yoo Lim Jung, Rudiyanto Gunawan: Methods for controlling dopant concentration and activation in semiconductor structures. The Board of Trustees of the University of Illinois, Greenlee Sullivan P C, December 7, 2010: US07846822 (83 worldwide citation)

The present invention provides methods for fabricating semiconductor structures and devices, particularly ultra-shallow doped semiconductor structures exhibiting low electrical resistance. Methods of the present invention use modification of the composition of semiconductor surfaces to allow fabrica ...