1
Eb Eshun
Douglas D Coolbaugh, Ebenezer E Eshun, Alvin J Joseph, Robert M Rassel: Reduced guard ring in schottky barrier diode structure. International Business Machines Corporation, Richard M Kotulak Esq, Greenblum & Bernstein, August 29, 2006: US07098521 (3 worldwide citation)

Schottky barrier diodes use a dielectric separation region to bound an active region. The dielectric separation region permits the elimination of a guard ring in at least one dimension. Further, using a dielectric separation region in an active portion of the integrated circuit device may reduce or ...


2
Eb Eshun
Douglas D Coolbaugh, Ebenezer E Eshun, Terence B Hook, Robert M Rassel, Edmund J Sprogis, Anthony K Stamper, William J Murphy: Heat sink for integrated circuit devices. International Business Machines Corporation, Anthony J Canale, Greenblum & Bernstein, December 18, 2007: US07310036 (1 worldwide citation)

A resistor with heat sink is provided. The heat sink includes a conductive path having metal or other thermal conductor having a high thermal conductivity. To avoid shorting the electrical resistor to ground with the thermal conductor, a thin layer of high thermal conductivity electrical insulator i ...


3
Eb Eshun
Douglas D Coolbaugh, Ebenezer E Eshun, Alvin J Joseph, Robert M Rassel: Reduced guard ring in schottky barrier diode structure. International Business Machines Corporation, Greenblum & Bernstein, April 6, 2006: US20060071292-A1

Schottky barrier diodes use a dielectric separation region to bound an active region. The dielectric separation region permits the elimination of a guard ring in at least one dimension. Further, using a dielectric separation region in an active portion of the integrated circuit device may reduce or ...


4
Eb Eshun
Douglas D COOLBAUGH, Ebenezer E ESHUN, Terence B HOOK, Robert M RASSEL, Edmund J SPROGIS, Anthony K STAMPER, William J MURPHY: Heat sink for integrated circuit devices. International Business Machines Corporation, Greenblum & Bernstein, January 24, 2008: US20080019101-A1

A resistor with heat sink is provided. The heat sink includes a conductive path having metal or other thermal conductor having a high thermal conductivity. To avoid shorting the electrical resistor to ground with the thermal conductor, a thin layer of high thermal conductivity electrical insulator i ...


5
Eb Eshun
Douglas D Coolbaugh, Ebenezer E Eshun, Terence B Hook, Robert M Rassel, Edmund J Sprogis, Anthony K Stamper, William J Murphy: Heat sink for integrated circuit devices. International Business Machines Corporation, Greenblum & Bernstein, February 21, 2008: US20080042798-A1

A resistor with heat sink is provided. The heat sink includes a conductive path having metal or other thermal conductor having a high thermal conductivity. To avoid shorting the electrical resistor to ground with the thermal conductor, a thin layer of high thermal conductivity electrical insulator i ...


6
Eb Eshun
Douglas D Coolbaugh, Ebenezer E Eshun, Terence B Hook, Robert M Rassel, Edmund J Sprogis, Anthony K Stamper, William J Murphy: Heat sink for integrated circuit devices. International Business Machines Corporation, Greenblum & Bernstein, July 13, 2006: US20060152333-A1

A resistor with heat sink is provided. The heat sink includes a conductive path having metal or other thermal conductor having a high thermal conductivity. To avoid shorting the electrical resistor to ground with the thermal conductor, a thin layer of high thermal conductivity electrical insulator i ...


7
Robert Deng
Feng Bao, Huijie Deng: Method of exchanging digital data. Kent Ridge Digital Labs, Greenblum & Bernstein, January 30, 2007: US07171559 (5 worldwide citation)

Party A encrypts unique first digital data and generates an authentication certificate authenticating that the encrypted first data is an encryption of the first data. Party B verifies the encrypted first data using the authentication certificate. When the encrypted first data is verified by B, A ve ...


8
Hiroyoshi Yuasa, Tadashi Satake, Mario Jose Cardona, Hisataka Fujii, Akira Yasuda, Koji Yamashita, Satoru Suzaki, Hideki Ikezawa, Masami Ohno, Akira Matsuzaki, Junichi Suzuki, Junko Nakano: Virtual LAN system. Matsushita Electric Works, Greenblum & Bernstein, July 4, 2000: US06085238 (472 worldwide citation)

A virtual LAN system forms a virtual group which is based on elements having physical attribute or logical attribute and constituting a virtual LAN, sets a client address and priority of the virtual group in a virtual group registration table, and allocates unicast and broadcast traffic bands in gro ...


9
Yasuhiko Hirayama, Haruko Ikata, Satoshi Ojima, Hiromi Matsuzaki: Artificial intervertebral disc. Asahi Kogaku Kogyo Kabushiki Kaisha, Sandler Greenblum & Bernstein, August 7, 1990: US04946378 (397 worldwide citation)

An artificial intervertebral disc comprises a pair of end bodies which are provided, on their outer surfaces, with apatite layers. The disc includes a medical synthetic polymeric intermediate which is held between the end bodies through connecting members.


10
Steven Schraga: Lancet having adjustable penetration depth. Stat Medical Devices, Greenblum & Bernstein, December 5, 2000: US06156051 (346 worldwide citation)

Lancet device having an adjustable penetration depth. The lancet device includes a housing, a cap for covering the housing and for positioning the lancet device relative to a skin surface, a needle holding member for holding a lancet which needle holding member is at least partially contained within ...



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