1
Igor Y Khandros, Gaetan L Mathieu: Flexible contact structure with an electrically conductive shell. FormFactor, David Larwood, Gerald Linden, June 29, 1999: US05917707 (267 worldwide citation)

An interconnection contact structure assembly including an electronic component having a surface and a conductive contact carried by the electronic component and accessible at the surface. The contact structure includes an internal flexible elongate member having first and second ends and with the f ...


2
Igor Y Khandros, Benjamin N Eldridge, Gaetan L Mathieu: Fabricating interconnects and tips using sacrificial substrates. FormFactor, Gerald Linden, Daivd Larwood, November 30, 1999: US05994152 (245 worldwide citation)

Interconnection elements and/or tip structures for interconnection elements may first be fabricated upon sacrificial substrates for subsequent mounting to electronic components. In this manner, the electronic components are not `at risk` during the fabrication process. The sacrificial substrate esta ...


3
Benjamin N Eldridge, Gary W Grube, Igor Y Khandros, Gaetan L Mathieu: Method of mounting resilient contact structures to semiconductor devices. FormFactor, David Larwood, Gerald Linden, November 3, 1998: US05829128 (199 worldwide citation)

Resilient contact structures are mounted directly to bond pads on semiconductor dies, prior to the dies being singulated (separated) from a semiconductor wafer. This enables the semiconductor dies to be exercised (e.g., tested and/or burned-in) by connecting to the semiconductor dies with a circuit ...


4
Benjamin N Eldridge, Gary W Grube, Igor Y Khandros, Gaetan L Mathieu: Method of making contact tip structures. Form Factor, David Larwood, Gerald Linden, February 2, 1999: US05864946 (155 worldwide citation)

Resilient contact structures are mounted directly to bond pads on semiconductor dies, prior to the dies being singulated (separated) from a semiconductor wafer. This enables the semiconductor dies to be exercised (e.g., tested and/or burned-in) by connecting to the semiconductor dies with a circuit ...


5
Igor Y Khandros: Method of making raised contacts on electronic components. Form Factor, David Larwood, Gerald Linden, December 29, 1998: US05852871 (131 worldwide citation)

A method for manufacturing raised contacts on the surface of an electronic component includes bonding one end of a wire to an area, such as a terminal, of the electronic component, and shaping the wire into a wire stem configuration (including straight, bent two-dimensionally, bent three-dimensional ...


6
Igor Y Khandros, Gaetar L Mathieu: Resilient contact structures, electronic interconnection component, and method of mounting resilient contact structures to electronic components. FormFactor, Gerald Linden, David Larwood, February 6, 2001: US06184587 (119 worldwide citation)

An interconnection contact structure assembly including an electronic component having a surface and a conductive contact carried by the electronic component and accessible at the surface. The contact structure includes an internal flexible elongate member having first and second ends and with the f ...


7
Igor Y Khandros: Method of mounting free-standing resilient electrical contact structures to electronic components. FormFactor, Gerald Linden, David Larwood, April 18, 2000: US06049976 (113 worldwide citation)

A method for manufacturing raised contacts on the surface of an electronic component includes bonding one end of a wire to an area, such as a terminal, of the electronic component, and shaping the wire into a wire stem configuration (including straight, bent two-dimensionally, bent three-dimensional ...


8
Benjamin N Eldridge, Gary W Grube, Igor Y Khandros, Gaetan L Mathieu: Method of testing semiconductor. Form Factor, Gerald Linden, David Larwood, December 7, 1999: US05998228 (110 worldwide citation)

Resilient contact structures are mounted directly to bond pads on semiconductor dies, prior to the dies being singulated (separated) from a semiconductor wafer. This enables the semiconductor dies to be exercised (e.g., tested and/or burned-in) by connecting to the semiconductor dies with a circuit ...


9
Benjamin N Eldridge, Gary W Grube, Igor Y Khandros, Gaetan L Mathieu: Method of temporarily, then permanently, connecting to a semiconductor device. FormFactor, Gerald Linden, David Larwood, November 16, 1999: US05983493 (102 worldwide citation)

Resilient contact structures are mounted directly to bond pads on semiconductor dies, prior to the dies being singulated (separated) from a semiconductor wafer. This enables the semiconductor dies to be exercised (e.g., tested and/or burned-in) by connecting to the semiconductor dies with a circuit ...


10
Benjamin N Eldridge, Gary W Grube, Igor Y Khandros, Gaetan L Mathieu: Mounting spring elements on semiconductor devices. Form Factor, Gerald Linden, David Larwood, March 23, 1999: US05884398 (100 worldwide citation)

Resilient contact structures are mounted directly to bond pads on semiconductor dies, prior to the dies being singulated (separated) from a semiconductor wafer. This enables the semiconductor dies to be exercised (e.g., tested and/or burned-in) by connecting to the semiconductor dies with a circuit ...