1
Thomas H Dozier II, Benjamin N Eldridge, Gary W Grube, Igor Y Khandros, Gaetan L Mathieu: Sockets for electronic components and methods of connecting to electronic components. Form Factor, David J Larwood, Gerald E Linden, June 30, 1998: US05772451 (372 worldwide citation)

Surface-mount, solder-down sockets permit electronic components such as semiconductor packages to be releasably mounted to a circuit board. Resilient contact structures extend from a top surface of a support substrate, and solder-ball (or other suitable) contact structures are disposed on a bottom s ...


2
Benjamin N Eldridge, Gary W Grube, Igor Y Khandros, Gaetan L Mathieu: Method of planarizing tips of probe elements of a probe card assembly. FormFactor, David J Larwood, Gerald E Linden, November 2, 1999: US05974662 (326 worldwide citation)

A probe card assembly includes a probe card, a space transformer having resilient contact structures (probe elements) mounted directly to (i.e., without the need for additional connecting wires or the like) and extending from terminals on a surface thereof, and an interposer disposed between the spa ...


3
Igor Y Khandros: Method of manufacturing electrical contacts, using a sacrificial member. Form Factor, Gerald E Linden, December 19, 1995: US05476211 (317 worldwide citation)

A method for manufacturing raised contacts on the surface of an electronic component includes bonding one end of a wire to an area, such as a terminal, of the electronic component, and shaping the wire into a wire stem configuration (including straight, bent two-dimensionally, bent three-dimensional ...


4
Manouchehr Vafai, Michael D Rostoker: Method and apparatus for significantly improving the reliability of multilevel memory architecture. Kawasaki Steel Corporation, Gerald E Linden, August 21, 2001: US06279133 (236 worldwide citation)

Method and apparatus for significantly improving the reliability of multilevel (MLT) memory architecture. Before writing to MLT architecture, each MLT word is encoded into a coded bit stream in such a way that the resultant coded data contains the original word plus additional digits which are a fun ...


5
Igor Y Khandros, Benjamin N Eldridge, Gaetan L Mathieu, Thomas H Dozier, William D Smith: Contact carriers (tiles) for populating larger substrates with spring contacts. FormFactor, Gerald E Linden, Fenwick & West, September 15, 1998: US05806181 (235 worldwide citation)

The invention relates to making temporary, pressure connections between electronic components and, more particularly, to techniques for performing test and burn-in procedures on semiconductor devices prior to their packaging, preferably prior to the individual semiconductor devices being singulated ...


6
Igor Y Khandros, David V Pedersen: Wafer-level burn-in and test. FormFactor, David Larwood, Gerald E Linden, May 16, 2000: US06064213 (218 worldwide citation)

Wafer-level burn-in and test of semiconductor devices under test (DUTs) includes a test substrate having active electronic components (e.g. ASICs) secured to an interconnection substrate, spring contact elements effecting interconnections between the ASICs and the DUTs. This is advantageously perfor ...


7
Chris Jerbic: Method of selectively etching titanium-containing materials on a semiconductor wafer using remote plasma generation. LSI Logic Corporation, Gerald E Linden, July 5, 1994: US05326427 (205 worldwide citation)

A method of selectively etching titanium-containing materials without attacking aluminum or silicon dioxide is describe, wherein an atomic chlorine etching environment is generated using downstream techniques. Atomic chlorine in the absence of ion bombardment (as provided by downstream etching) etch ...


8
Benjamin N Eldridge, Igor Y Khandros, Gaetan L Mathieu, David V Pedersen: Method of making microelectronic spring contact elements. FormFactor, Gerald E Linden, David Larwood, February 6, 2001: US06184053 (185 worldwide citation)

Spring contact elements are fabricated by depositing at least one layer of metallic material into openings defined in masking layers deposited on a surface of a substrate which may be an electronic component such as an active semiconductor device. Each spring contact element has a base end, a contac ...


9
Igor Y Khandros, David V Pedersen: Stacking semiconductor devices, particularly memory chips. Formfactor, Gerald E Linden, David Larwood, December 7, 1999: US05998864 (179 worldwide citation)

High density packaging of semiconductor devices on an interconnection substrate is achieved by stacking bare semiconductor devices atop one another so that an edge portion of a semiconductor device extends beyond the semiconductor device that it is stacked atop. Elongate interconnection elements ext ...


10
Dennis J Ryan, David Finn, Patrick R Comiskey, Norbert Knapich: Multi-interface compact personal token apparatus and methods of use. DPD Patent Trust, Gerald E Linden, Dwight A Stauffer, May 8, 2007: US07213766 (174 worldwide citation)

A compact personal token apparatus (100,120,140,200,220,300,320,500), resembling a conventional USB memory fob in size, shape, and form which can be plugged into a PC and interfaced with the virtual world of the Internet. The apparatus is capable of loading and storing information from the Internet, ...