1
Edwin Chu, Hu Kong Lai: Chip package board having utility rings. ACC Microelectronics Corporation, Thomas Schneck, George B F Yee, September 1, 1998: US05801440 (187 worldwide citation)

A chip package includes a circuit board having a first surface with an inner die-attach region, an outer signal trace region and an intermediate utility region. Within the utility region are a number of traces for providing fixed electrical potentials to an integrated circuit die mounted within the ...


2
Brent A Goetzl: Speedometer for in-line skates. Thomas Schneck, George B F Yee, February 24, 1998: US05721539 (117 worldwide citation)

An in-line roller skate includes a transducer portion capable of sensing the rotary movement of at least one wheel on the roller skate and transmitting information concerning the same to a receiver worn on a user's wrist. In the preferred embodiment, the transducer portion includes a magnet attached ...


3
David J Woodham Jr, William C Woodbury, Daniel Dresdner: System and method for producing video effects on live-action video. Pinnacle Systems, Thomas Schneck, George B F Yee, May 30, 2000: US06069668 (81 worldwide citation)

A digital video effects system for producing live-action video effects in real time includes an address generator having a pair of 2-D tables for providing x-coordinate and y-coordinate offset values. A third 2-D table contains warp activation factors (activators) which are scaled by a clip and gain ...


4
George Wakalopulos: Apparatus and method for a modular electron beam system for the treatment of surfaces. American International Technologies, Thomas Schneck, George B F Yee, John P McGuire Jr, June 1, 1999: US05909032 (60 worldwide citation)

A modular electron beam device is disclosed, the device being housed in a modular enclosure containing a power supply subsystem coupled to provide power to an electron beam tube. The enclosure is shaped to permit stacking of plural such modular units in a way that the stripe-shaped beam emitted from ...


5
Cecil H Kaplinsky: Programmable logic device with partial switch matrix and bypass mechanism. Thomas Schneck, George B F Yee, John P McGuire Jr, August 18, 1998: US05796268 (52 worldwide citation)

A programmable logic device in accordance with the present invention includes a partially populated switch matrix for coupling a plurality of logic blocks. Having a partial switch matrix reduces the silicon area requirement of the device. In addition, the capacitive loading is reduced, which improve ...


6
Martin T Mason, Scott C Evans, Sandeep S Aranake: Method and system for configuring an array of logic devices. Atmel Corporation, Thomas Schneck, George B F Yee, August 31, 1999: US05946219 (47 worldwide citation)

A system and method for partial reconfiguration of a gate array includes generating a netlist by placement and routing of a logic circuit. The netlist is accessed to modify logic cells configurations created by the place and route operation. Based on the modifications, a partial configuration bitstr ...


7
Robert W Bruns: Helical load cell. Sentek Products, Thomas Schneck, George B F Yee, February 3, 1998: US05714695 (47 worldwide citation)

A helical load cell is disclosed which is capable of accurately measuring axially applied forces, whether the force is applied axially within the diameter of the helical coil or outside of the coil diameter. A pair of strain gage modules are disposed on diametrically opposed surfaces of the coil. Ea ...


8
Edwin Chu, Hu Kong Lai: Semiconductor board providing high signal pin utilization. ACC Microelectronics Corporation, Thomas Schneck, George B F Yee, November 11, 1997: US05686699 (40 worldwide citation)

A semiconductor die attach arrangement which provides an increase in signal availability to and from the die without compromising the physical integrity of signal traces and integrity of the conducted signal. In a preferred embodiment, a circuit board includes a die-attach region surrounded by a bou ...


9
Jesus A Ortiz: Adjustable support apparatus for wave soldering of printed circuit boards. Innovative Soldering Technologies, Thomas Schneck, George B F Yee, October 13, 1998: US05820013 (24 worldwide citation)

A fixture for supporting printed circuit (PC) boards during wave soldering includes a rigid frame having a ledge formed along the inner perimeter of the frame. The ledge supports a PC board along a peripheral portion of the board. Channels are formed atop the frame for receiving slidably removable c ...


10
Alan M Dawes: Modulation compensated clamp circuit. Atmel Corporation, Thomas Schneck, George B F Yee, September 29, 1998: US05815355 (23 worldwide citation)

A radio frequency identification (RFID) tag includes a tank circuit for receiving a power signal transmitted on a radio frequency (RF) carrier by a remote interrogator unit. Information is conveyed from the tag to the interrogator by varying a resistive load placed across the tank circuit as a funct ...