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Denis O&apos Leary, Vincent D&apos Agostino, S Richard Re, Jessica Burney, Adam Hoffman: Method and system for processing internet payments using the electronic funds transfer network. The Chase Manhattan Bank, Dickstein Shapiro Morin & Oshinsky, August 19, 2003: US06609113 (497 worldwide citation)

A system and method for effectuating Electronic Funds Transfer credit messages. The main structural components of the system include a Payment Portal Processor (PPP), an Internet Pay Anyone (IPA) Account, a Virtual Private Lockbox (VPL) and an associated Account Reporter, the existing EFT networks, ...


2
Yuji Nagao, Keiji Yano: Gaming system that pays out a progressive bonus using a lottery. Sega Enterprises, Dickstein Shapiro Morin & Oshinsky, July 8, 1997: US05645486 (475 worldwide citation)

A progressive gaming system pays out a progressively increasing bonus to a player who wins a game with a predetermined winning combination. The progressive gaming system includes a plurality of gaming controllers which detect when a player gets one of a plurality of predetermined winning combination ...


3
Laura A Ensel, William E Rykowsky, Louis A Fuertes: Electronic account presentation and response system and method. The Chase Manhattan Bank, Dickstein Shapiro Morin & Oshinsky, December 10, 2002: US06493685 (333 worldwide citation)

An Information Interface Provider (IIP) acting as the interface between a biller and its customers for both the presentment of electronic bills to the customers and for the processing of payments from the biller's customers. The IIP creates and electronically publishes bills to the biller' ...


4
David J Corisis: Semiconductor package. Micron Technology, Dickstein Shapiro Morin & Oshinsky, February 6, 2001: US06184465 (314 worldwide citation)

A semiconductor package is provided which includes a substrate having a plurality of semiconductor dice mounted thereon. The substrate is divided into segments by grooves formed in the bottom surface of the substrate. Each semiconductor die is electrically connected to the substrate by electrical co ...


5
Thomas Cahill, Louise A McNulty, John J McMonagle, Richard H Sferra, Glenn Levine, Saul Goldfisher, Philip Wilson, Vladimir Koroteyev: Electronic check image storage and retrieval system. The Chase Manhattan Bank, Dickstein Shapiro Morin & Oshinsky, June 3, 2003: US06574377 (266 worldwide citation)

A method and apparatus for storing and retrieving images of documents, e.g. checks. The method comprises placing a plurality of documents in a document imaging machine and forming an electronic image of each document, storing each electronic image in an electronic storage device, providing at least ...


6
Howard E Rhodes: CMOS imager with storage capacitor. Micron Technology, Dickstein Shapiro Morin & Oshinsky, March 20, 2001: US06204524 (260 worldwide citation)

A CMOS imager having an improved signal to noise ratio and improved dynamic range is disclosed. The CMOS imager provides improved charge storage by fabricating a storage capacitor in parallel with the photocollection area of the imager. The storage capacitor may be a flat plate capacitor formed over ...


7
Brent Gilgen: Method for fabricating a small area of contact between electrodes. Micron Technology, Dickstein Shapiro Morin & Oshinsky, November 14, 2000: US06147395 (253 worldwide citation)

An electrode structure for use in a chalcogenide memory is disclosed. The electrode has a substantially frusto-conical shape, and is preferably formed by undercut etching a polysilicon layer beneath an oxide pattern. With this structure, improved current densities through the chalcogenide material c ...


8
Scott Corey Miller, Krishan Kumar Sabnani, Thomas Yat Chung Woo: Wireless multi-media messaging communications method and apparatus. Lucent Technologies, Dickstein Shapiro Morin & Oshinsky, July 16, 2002: US06421707 (253 worldwide citation)

A wireless multimedia messaging communications method and apparatus that permits a subscriber to a wireless telecommunications service to receive and generate multimedia messages from known wireless personal communications devices, i.e., cellular/PCS telephones. A multimedia message may be received ...


9
Salman Akram, Warren M Farnworth: Integrated circuit package and method of fabrication. Micron Technology, Dickstein Shapiro Morin & Oshinsky, February 22, 2000: US06028365 (252 worldwide citation)

The present invention is directed to a semiconductor package and its method of manufacture. Conductors mounted on a flexible polymer tape are used to connect a semiconductor chip to a substrate. The flexible polymer tape can be folded back under the chip to reduce the size necessary for mounting the ...


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