1
Levi A Campbell, Richard C Chu, Michael J Ellsworth Jr, Keith E Fogel, Madhusudan K Iyengar, Roger R Schmidt, Robert E Simons: Thermally conductive composite interface, cooled electronic assemblies employing the same, and methods of fabrication thereof. International Business Machines Corporation, Dennis Jung Esq, Kevin P Radigan Esq, Heslin Rothenberg Farley & Mesiti P C, June 28, 2011: US07967062 (73 worldwide citation)

A composite interface and methods of fabrication are provided for coupling a cooling assembly to an electronic device. The interface includes a plurality of thermally conductive wires formed of a first material having a first thermal conductivity, and a thermal interface material at least partially ...


2
Levi A Campbell, Richard C Chu, Michael J Ellsworth Jr, Madhusudan K Iyengar, Michael R Rizzolo, Robert E Simons: Liquid-cooled electronics apparatus and methods of fabrication. International Business Machines Corporation, Dennis Jung Esq, Kevin P Radigan Esq, Heslin Rothenberg Farley & Mesiti P C, September 27, 2011: US08027162 (67 worldwide citation)

Liquid-cooled electronics apparatuses and methods are provided. The cooled electronics apparatuses include a liquid-cooled cold rail and an electronics subassembly. The liquid-cooled cold rail has a thermally conductive structure and a coolant-carrying channel extending within and cooling the therma ...


3
Levi A Campbell, Richard C Chu, Michael J Ellsworth Jr, Madhusudan K Iyengar, Robert E Simons: System and method for standby mode cooling of a liquid-cooled electronics rack. International Business Machines Corporation, Dennis Jung Esq, Kevin P Radigan Esq, Heslin Rothenberg Farley & Mesiti P C, March 15, 2011: US07907406 (47 worldwide citation)

System and method are provided for cooling an electronics rack. A modular cooling unit (MCU) is associated with the rack to provide system coolant to an electronics subsystem and a bulk power assembly. The MCU includes a liquid-to-liquid heat exchanger, and defines portions of facility and system co ...


4
Matthew R Archibald, Richard C Chu, Hendrik F Hamann, Madhusudan K Iyengar, Roger R Schmidt: Method of laying out a data center using a plurality of thermal simulators. International Business Machines Corporation, Dennis Jung Esq, Kevin P Radigan Esq, Heslin Rothenberg Farley & Mesiti P C, July 12, 2011: US07979250 (43 worldwide citation)

A method is provided for facilitating installation of one or more electronics racks within a data center. The method includes: placing a plurality of thermal simulators in the data center in a data center layout to establish a thermally simulated data center, each thermal simulator simulating at lea ...


5
Levi A Campbell, Richard C Chu, Michael J Ellsworth Jr, Madhusudan K Iyengar, Robert E Simons: Liquid-cooled electronics rack with immersion-cooled electronic subsystems and vertically-mounted, vapor-condensing unit. International Business Machines Corporation, Dennis Jung Esq, Kevin P Radigan Esq, Heslin Rothenberg Farley & Mesiti PC, January 8, 2013: US08351206 (42 worldwide citation)

Liquid-cooled electronics racks are provided which include: immersion-cooled electronic subsystems; a vertically-oriented, vapor-condensing unit facilitating condensing dielectric fluid vapor egressing from the immersion-cooled subsystems, the vertically-oriented, vapor-condensing unit being sized a ...


6
Levi A Campbell, Richard C Chu, Michael J Ellsworth Jr, Madhusudan K Iyengar, Robert E Simons: Hybrid air and liquid coolant conditioning unit for facilitating cooling of one or more electronics racks of a data center. International Business Machines Corporation, Dennis Jung Esq, Kevin P Radigan Esq, Heslin Rothenberg Farley & Mesiti P C, June 21, 2011: US07963119 (42 worldwide citation)

A hybrid air and liquid coolant conditioning unit is provided for facilitating cooling of electronics rack(s) of a data center. The unit includes a first heat exchange assembly, including a liquid-to-liquid heat exchanger, a system coolant loop and a facility coolant loop, and a second heat exchange ...


7
Levi A Campbell, Richard C Chu, Michael J Ellsworth Jr, Madhusudan K Iyengar, Robert E Simons: System and method for facilitating parallel cooling of liquid-cooled electronics racks. International Business Machines Corporation, Dennis Jung Esq, Kevin P Radigan Esq, Heslin Rothenberg Farley & Mesiti P C, June 26, 2012: US08208258 (40 worldwide citation)

A cooling system and method are provided for facilitating cooling of multiple liquid-cooled electronics racks. The cooling system includes a main system coolant supply loop with a plurality of system coolant supply branch lines for facilitating supply of cooled system coolant to the electronics rack ...


8
Levi A Campbell, Richard C Chu, Michael J Ellsworth Jr, Madhusudan K Iyengar, Vinod Kamath, Robert E Simons: Apparatus and method for facilitating immersion-cooling of an electronic subsystem. International Business Machines Corporation, Dennis Jung Esq, Kevin P Radigan Esq, Heslin Rothenberg Farley & Mesiti P C, June 14, 2011: US07961475 (39 worldwide citation)

Apparatus and method are provided for facilitating immersion-cooling of an electronic subsystem having multiple different types of components to be immersion-cooled. The apparatus includes a container sized to receive the electronic subsystem, and a hermetically sealed electrical connector disposed ...


9
Levi A Campbell, Richard C Chu, Michael J Ellsworth Jr, Madhusudan K Iyengar, Robert E Simons: Cooled electronic module with pump-enhanced, dielectric fluid immersion-cooling. International Business Machines Corporation, Dennis Jung Esq, Kevin P Radigan Esq, Heslin Rothenberg Farley & Mesiti P C, September 6, 2011: US08014150 (39 worldwide citation)

Cooled electronic modules and methods of fabrication are provided with pump-enhanced, dielectric fluid immersion-cooling of the electronic device. The cooled electronic module includes a substrate supporting an electronic device to be cooled. A cooling apparatus couples to the substrate, and include ...


10
Levi A Campbell, Richard C Chu, Michael J Ellsworth Jr, Madhusudan K Iyengar, Robert E Simons: Open flow cold plate for liquid cooled electronic packages. International Business Machines Corporation, Dennis Jung Esq, Kevin P Radigan Esq, Heslin Rothenberg Farley & Mesiti P C, March 29, 2011: US07916483 (37 worldwide citation)

A method and associated assembly is provided for cooling of a computing embodiment having electronic components. The heat generating components are disposed in the vicinity of at least one cold plate providing direct liquid cooling. Coolant is provided to the cold plate which will eventually exit it ...