1
Thomas H Dozier II, Benjamin N Eldridge, Gary W Grube, Igor Y Khandros, Gaetan L Mathieu: Sockets for electronic components and methods of connecting to electronic components. Form Factor, David J Larwood, Gerald E Linden, June 30, 1998: US05772451 (372 worldwide citation)

Surface-mount, solder-down sockets permit electronic components such as semiconductor packages to be releasably mounted to a circuit board. Resilient contact structures extend from a top surface of a support substrate, and solder-ball (or other suitable) contact structures are disposed on a bottom s ...


2
Benjamin N Eldridge, Gary W Grube, Igor Y Khandros, Gaetan L Mathieu: Method of planarizing tips of probe elements of a probe card assembly. FormFactor, David J Larwood, Gerald E Linden, November 2, 1999: US05974662 (326 worldwide citation)

A probe card assembly includes a probe card, a space transformer having resilient contact structures (probe elements) mounted directly to (i.e., without the need for additional connecting wires or the like) and extending from terminals on a surface thereof, and an interposer disposed between the spa ...


3
Brad Taylor: Pld connector for module having configuration of either first PLD or second PLD and reconfigurable bus for communication of two different bus protocols. Giga Operations Corporation, Adam H Tachner, David J Larwood, Crosby Heafey Roach & May, July 9, 1996: US05535342 (169 worldwide citation)

A module for supporting and connecting programmable logic devices through a common interface. A card in the PC Card format is provided with bus interface support for interconnection to other such modules. The module supports one or more programmable logic devices, each of which is connectable to fou ...


4
Benjamin N Eldridge, Gary W Grube, Igor Y Khandros, Gaetan L Mathieu: Method of making temporary connections between electronic components. Form Factor, Gerald E Linden, David J Larwood, November 10, 1998: US05832601 (168 worldwide citation)

Resilient contact structures are mounted directly to bond pads on semiconductor dies, prior to the dies being singulated (separated) from a semiconductor wafer. This enables the semiconductor dies to be exercised (e.g., tested and/or burned-in) by connecting to the semiconductor dies with a circuit ...


5
Thomas H Dozier II, Igor Y Khandros: Solder preforms. Form Factor, David J Larwood, Gerald E Linden, October 13, 1998: US05820014 (122 worldwide citation)

Method and apparatus for forming solder balls on electronic components and for forming solder joints between electronic components is described. A preform is fabricated having relatively large cross-section solder masses connected to one another by relatively small cross-section solder bridges. Upon ...


6
David V James: Processor with sequences of processor instructions for locked memory updates. Apple Computer, David J Larwood, November 12, 1996: US05574922 (112 worldwide citation)

A system and method for executing sequences of instructions which can be used to access a memory location in a locked fashion. The first instruction specifies an address and sets a lock register which disables interrupts until it is cleared. The second instruction specifies an address and clears the ...


7
Benjamin N Eldridge, Gary W Grube, Igor Y Khandros, Gaetan L Mathieu: Method of burning-in semiconductor devices. FormFactor, David J Larwood, Gerald E Linden, March 9, 1999: US05878486 (93 worldwide citation)

Resilient contact structures are mounted directly to bond pads on semiconductor dies, prior to the dies being singulated (separated) from a semiconductor wafer. This enables the semiconductor dies to be exercised (e.g., tested and/or burned-in) by connecting to the semiconductor dies with a circuit ...


8
Stephen Quintero, Jim Smith: Design tool and method for preparing parametric assemblies. Quintero Smith Incorporated, David J Larwood, March 8, 1994: US05293479 (92 worldwide citation)

An expert system is described for use in designing a connected collection of components which are available or can be made in different forms, e.g. which can be described by a selected number of variables. The expert system includes a knowledge base and an inference engine. The knowledge base includ ...


9
Patrick Lai: Video multiplexor-encoder and decoder-converter. RGB Technology D B A RGB Spectrum, David J Larwood, September 27, 1994: US05351129 (73 worldwide citation)

A video multiplexor-encoder and decoder-converter includes a video multiplexor and encoder for selectively receiving, time-division multiplexing and encoding multiple video signals representing multiple video images for transfer and simultaneous display thereof in a selected pattern of multiple vide ...


10
Benjamin N Eldridge, Gaetan L Mathieu: Method of severing bond wires and forming balls at their ends. FormFactor, David J Larwood, Gerald E Linden, June 30, 1998: US05773780 (72 worldwide citation)

The efficacy of electrical discharges for severing bond wires and/or for forming balls at the ends of bond wires (including bond wires already severed by alternative mechanisms) is improved by performing the electrical discharges in the presence of ultraviolet light. A "spark gap" is formed between ...