1
John C Rodgers, Jon D Maimon: Method for manufacturing sidewall contacts for a chalcogenide memory device. BAE Systems Information and Electronic Systems Integration, Daniel J Long, Antony P Ng, Dillon & Yudell, June 21, 2005: US06909107 (196 worldwide citation)

A method for manufacturing sidewall contacts for a chalcogenide memory device is disclosed. A first conductive layer is initially deposited on top of a first oxide layer. The first conductive layer is then patterned and etched using well-known processes. Next, a second oxide layer is deposited on to ...


2
S Ram Ramaswamy, Charles N Alcorn, Arnett J Brown III, Tatia E Butts: Method for providing a fill pattern for an integrated circuit design. Bae Systems Information and Electronic Systems Integration, Daniel J Long, Antony P Ng, Bracewell & Patterson L, August 19, 2003: US06609235 (193 worldwide citation)

A method for providing a fill pattern for integrated circuit designs is disclosed. A keepout file having keepout data is generated from a chip design layout file having chip design layout data. The keepout file includes a map of areas of an integrated circuit design where fill patterns cannot be pla ...


3
Jai P Bansal: Gate array core cell for VLSI ASIC devices. Bae Systems Information and Electronic Systems Integration, Daniel J Long, July 20, 2004: US06765245 (188 worldwide citation)

A very efficient gate array core cell in which the base core cell consists of a group of 6 PMOS transistors and a group of 6 NMOS transistors. It also includes pre-wiring of 2 of the 6 PMOS transistors, with 2 of the 6 NMOS transistors at polysilicon level or at local interconnect level while leavin ...


4
Clifford L Winings, Robert E Marshall, John M Spickler: Low profile double deck connector with improved cross talk isolation. Berg Technology, Brian J Hamilla, Daniel J Long, M Richard Page, May 30, 2000: US06068520 (178 worldwide citation)

A stacked modular jack connector having low cross talk and low combined stack height is disclosed. Low stack height is achieved by disposing contact terminals for stacked pairs of receptacles in a single coplanar array of interleaved terminals. The arrays are located between the receptacles. One rec ...


5
Richard A Elco, David F Fusselman: Low cross and impedance controlled electric connector. Berg Technology, Daniel J Long, M Richard Page, April 21, 1998: US05741144 (147 worldwide citation)

Disclosed is an electrical connector in which the conductive and dielectric elements are arranged in a composite I-beam shaped geometry in which the conductive element is perpendicularly interposed between two parallel dielectric and ground plane elements. Low cross talk and controlled impedance are ...


6
Danny L C Morlion, Ab van Zanten: High density interstitial connector system. Berg Technology, Brian J Hamilla, M Richard Page, Daniel J Long, October 5, 1999: US05961355 (138 worldwide citation)

A novel high density receptacle is disclosed. The receptacle includes a housing portion, having a plurality of openings formed in its front face. A first column containing a first number of contact elements is positioned in relation to the housing so that the receiving portions of the contact elemen ...


7
Mark A Carlson: Covert sensor emplacement using autorotational delivery mechanism. BAE Systems Information and Electronic Systems Integration, Daniel J Long, Robert K Tendler, May 8, 2012: US08172173 (134 worldwide citation)

A method for emplacing sensors, comprising the steps of modifying an existing sensor to attach an autorotational mechanism and deploying said sensor by autorotational means.


8
Richard A Elco: Low cross talk and impedance controlled electrical cable assembly. Berg Technology, Daniel J Long, M Richard Page, October 6, 1998: US05817973 (126 worldwide citation)

An electrical cable assembly in which the conductive and dielectric elements are arranged in a composite with a conductive I-beam shaped geometry in which the conductive element is perpendicularly interposed between two parallel dielectric and ground plane elements. Low cross talk and controlled imp ...


9
Derek Andrews, Bernardus Paagman: Selectively metallized connector with at least one coaxial or twin-axial terminal. Berg Technology, Daniel J Long, M Richard Page, April 28, 1998: US05743765 (120 worldwide citation)

Connector provided with at least two adjacent cavities (5, 6) to accommodate terminals (14), the connector having a selectively metallized plastic structure in order to at least partly shield at least one cavity from the other cavities wherein said connector has at least partly the following housing ...


10
Richard J Blackwell Jr: On-wafer butted microbolometer imaging array. BAE Systems Information and Electronic Systems Integration, Maine Cernota & Rardin, David A Rardin, Daniel J Long, October 23, 2012: US08294099 (113 worldwide citation)

An apparatus and method for assembling a large microbolometer infrared imaging array from sub-arrays, including the step of forming a sub-array assembly of independent imaging arrays on the silicon wafer as the imaging sensor is being processed, whereby seams or gaps in a resulting image are avoided ...