1
James Kraemer Ph.D.
Marcos Dias De Assuncao, James R Kraemer, Fernando Luiz Koch, Marco Aurelio Stelmar Netto: System, method and program product for local client device context-aware shared resource and service management. International Business Machines Corporation, Law Office of Charles W Peterson Jr, Louis J Percello Esq, March 18, 2014: US08676985 (3 worldwide citation)

A system context aware resource management, method of managing shared resources and services and a computer program product therefor. Client devices, e.g., handheld or mobile devices, request resources from provider computers, e.g., in a cloud environment. The provider computers provide cloud-based ...


2
Eb Eshun
Anil K Chinthakindi, Douglas D Coolbaugh, Ebenezer E Eshun, Zhong Xiang He, Anthony K Stamper, Kunal Vaed: Integrated circuit (ic) chip with one or more vertical plate capacitors and method of making the capacitors. Law Office Of Charles W Peterson Jr Burlington, July 24, 2008: US20080173981-A1

An Integrated Circuit (IC) chip with one or more vertical plate capacitors, each vertical plate capacitor connected to circuits on the IC chip and a method of making the chip capacitors. The vertical plate capacitors are formed with base plate pattern (e.g., damascene copper) on a circuit layer and ...


3
Joyce Yue Chai, Sunil Subramanyam Govindappa, Nandakishore Kambhatla, Tetsunosuke Fujisaki, Catherine G Wolf, Dragomir Radkov Radev, Yiming Ye, Wlodek Zadrozny: System, method and program product for interactive natural dialog. International Business Machines, Louis J Percello, Law Office of Charles W Peterson Jr, December 7, 2004: US06829603 (234 worldwide citation)

This patent describes a novel system, method, and program product that are used in interactive natural language dialog. One or more presentation managers operating on a computer system present information from the computer system to one or more users over network interface(s) and accept queries from ...


4
Richard B Booth, Robert H Gephard, Bradley S Gremban, Janet E Poetzinger, David T Shen: Parallel process interposer (PPI). International Business Machines Corporation, Charles W Peterson Jr, April 4, 1995: US05404044 (200 worldwide citation)

A multilayer, high yield and high density integrated circuit (IC) chips interposer and the method of manufacture therefore. A thin polyimide film is circuitized with copper on both sides. One side may be reserved for power or ground with the opposite side being a signal plane. Adhesive is laminated ...


5
Rudolf Maarten Bolle, Arun Hampapur: System and method for measuring similarity between a set of known temporal media segments and a one or more temporal media streams. International Business Machines, Louis J Percello, Law Office of Charles W Peterson Jr, January 6, 2004: US06675174 (171 worldwide citation)

This invention is a scaleable system to perform exact matching or similarity matching between a large store of reference temporal media sequences and a query target temporal media sequence. The system is not limited to finding exact matching media segments but also can find media segments that are s ...


6
Puneet Gupta, Fook Luen Heng, Mark A Lavin: Method of IC fabrication, IC mask fabrication and program product therefor. International Business Machines Corporation, Law Office of Charles W Peterson Jr, Louis J Percello Esq, Brian P Verminski Esq, April 1, 2008: US07353492 (170 worldwide citation)

A method of forming integrated circuit (IC) chip shapes and a method and computer program product for converting an IC design to a mask, e.g., for standard cell design. Individual book/macro physical designs (layouts) are proximity corrected before unnesting and an outer proximity range is determine ...


7
Syed M Alam, Ibrahim M Elfadel, Kathryn W Guarini, Meikei Ieong, Prabhakar N Kudva, David S Kung, Mark A Lavin, Arifur Rahman: Three dimensional integrated circuit. International Business Machines Corporation, Law Office of Charles W Peterson Jr, Louis J Percello Esq, Rafael Perez Piniero Esq, December 25, 2007: US07312487 (117 worldwide citation)

A three dimensional (3D) integrated circuit (IC), 3D IC chip and method of fabricating a 3D IC chip. The chip includes multiple layers of circuits, e.g., silicon insulator (SOI) CMOS IC layers, each including circuit elements. The layers may be formed in parallel and one layer attached to another to ...


8
Henri Lochon, Georges Robert: Method of forming metal contact pads and terminals on semiconductor chips. International Business Machines Corporation, Charles W Peterson Jr, August 11, 1992: US05137845 (114 worldwide citation)

A method of forming metal contact terminals (35) of a determined size having an insulating substrate (17) with a metal land (18) formed thereon and a passivating layer (19) provided with an opening exposing a part of the metal land by forming intermediate metal contact pad (33') in the contact openi ...


9
Howard Leo Kalter, John Edward Barth Jr, Jeffrey Harris Dreibelbis, Rex Ngo Kho, John Stuart Parenteau Jr, Donald Lawrence Wheater, Yotaro Mori: Processor based BIST for an embedded memory. International Business Machines Corporation, Charles W Peterson Jr, October 5, 1999: US05961653 (96 worldwide citation)

An integrated chip having a DRAM embedded in logic is tested by an in-situ processor oriented BIST macro. The BIST is provided with two ROMS, one for storing test instructions and a second, which is scannable, that provides sequencing for the test instructions stored in the first ROM, as well as bra ...


10
Roger L Verkuil: Contactless electrical thin oxide measurements. International Business Machines Corporation, Robert J Haase, Charles W Peterson Jr, January 16, 1996: US05485091 (93 worldwide citation)

A method for measuring the thickness of very thin oxide layers on a silicon substrate. A corona discharge source repetitively deposits a calibrated fixed charge density on the surface of the oxide. The resultant change in oxide surface potential for each charge deposition is measured. By choosing a ...



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