1
Gerald L Ballard, John G Gaudiello: Metallized substrate. International Business Machines Corporation, Bernard Tiegerman, April 1, 1997: US05616422 (75 worldwide citation)

An electroless metal plating bath composition, a corresponding method for electrolessly depositing a metal onto a substrate surface, as well as the resulting, metallized substrate, are disclosed. The inventive bath composition includes water, a soluble source of the metal ions it is desired to chemi ...


2
Brenda D Frey, Charles A Joseph, Francis J Olshefski, James W Wilson: Chip carrier with protective coating for circuitized surface. International Business Machines Corporation, Bernard Tiegerman, September 28, 1993: US05249101 (74 worldwide citation)

A chip carrier is disclosed which includes a chip carrier substrate and at least one semiconductor chip mounted in a flip chip configuration, via solder balls, on a circuitized surface of the chip carrier substrate. The solder balls are encapsulated in a first encapsulant having a composition which ...


3

4
Yutaka Tsukada, Shuhei Tsuchida: Multilayer printed circuit board and method for fabricating same. International Business Machines Corporation, Bernard Tiegerman, September 19, 1995: US05451721 (71 worldwide citation)

A multilayer printed circuit board and a corresponding fabrication method are disclosed, which circuit board achieves a relatively high degree of wiring density and a relatively high degree of wiring design freedom. These advantages are obtained in the inventive printed circuit board by electrically ...


5
Michael Gurvitch, Roland A Levy: Semiconductor devices having superconducting interconnects. American Telephone and Telegraph Company AT&T Bell Laboratories, Bernard Tiegerman, June 6, 1989: US04837609 (62 worldwide citation)

A semiconductor device which includes either a single semiconductor chip bearing an integrated circuit (IC) or two or more electrically interconnected semiconductor chips, is disclosed. This device includes interconnects between device components (on the same chip and/or on different chips), at leas ...


6
Antonius G H Verhulst: Display and pick-up device for stereoscopic picture display. U S Philips Corporation, Bernard Tiegerman, April 16, 1991: US05007715 (60 worldwide citation)

For stereoscopic display arbitrarily formed sub-pictures (for example divided into columns) are mixed. This is possible by covering a light-sensitive pick-up unit (CCD) (23) on which the sub-pictures are projected with an LCD (21) in such a way that a 1:1 relation is created between pixels and stora ...


7
Marek A Sternheim, Willem van Gelder: Interferometric method and apparatus for measuring etch rate and fabricating devices. AT&T Bell Laboratories, Bernard Tiegerman, Bruce S Schneider, June 12, 1984: US04454001 (60 worldwide citation)

A method and apparatus for measuring etch depth during the etching of a device pattern into a nontransparent substrate, is disclosed. The method makes use of the finding that the device patterns etched into substrates produce diffraction patterns when illuminated. Thus, according to the method, a be ...


8
Stephen R Engle, Scott P Moore, Mukund K Saraiya: Ceramic chip carrier with lead frame or edge clip. International Business Machines, Bernard Tiegerman, September 7, 1993: US05243133 (55 worldwide citation)

A ceramic chip carrier is disclosed which includes a ceramic substrate having a circuitized surface, at least one semiconductor chip mounted on the circuitized surface, and a lead frame or edge clip which is mechanically and electrically connected to contact pads on the circuitized surface. Each mec ...


9
David A B Miller: Nonlinear and bistable optical device. American Telephone and Telegraph Company AT&T Bell Laboratories, Bernard Tiegerman, December 29, 1987: US04716449 (53 worldwide citation)

The invention is a nonlinear or bistable optical device having a low switching energy. The invention uses a means responsive to light for generating a photocurrent, a structure having a semiconductor quantum well region, and means responsive to the photocurrent for electrically controlling an optica ...


10
Jeffrey W Rittle, William W Vetter, James R Webb: Fiber optic connector housing. International Business Machines Corporation, Bernard Tiegerman, June 28, 1994: US05325454 (52 worldwide citation)

A new fiber optic connector housing and a new fiber optic receptacle, both of which conform to a new standard proposed by the X3T9.3 committee of the American National Standards Institute, are disclosed. In addition, four accessory devices for electro-optic modules, each of which includes one or mor ...