1
Scott L Jacobs, Perwaiz Nihal, Burhan Ozmat, Henri D Schnurmann: High performance integrated circuit packaging structure. International Business Machines Corporation, Steven J Meyers, Aziz M Ahsan, March 7, 1989: US04811082 (428 worldwide citation)

A high speed, high performance integrated circuit packaging structure that may be used for emulating wafer scale integration structures. The preferred embodiment comprises an interposer having a base substrate having alternating insulation and conductive layers thereon, wherein a plurality of the co ...


2
Kermit Hal Purdy, David G Unger: Method and apparatus for personalization of a public multimedia communications terminal. AT&T, Aziz M Ahsan, Benjamin Lee, Ahsan & Associates, December 2, 2003: US06658254 (186 worldwide citation)

A multimedia call is completed to a mobile user, who registered to receive a multimedia call at a multimedia terminal using a portable intelligent device. A mobile user record including a physical address of a multimedia terminal and a user address is stored. In response to a multimedia call address ...


3
Robert J Hall: System and method for counteracting message filtering. AT&T, Aziz M Ahsan, Ahsan & Associates, November 4, 2003: US06643686 (135 worldwide citation)

A system and method for circumventing schemes that use duplication detection to detect and block unsolicited e-mail (spam.) An address on a list is assigned to one of m sublists, where m is an integer that is greater than one. A set of m different messages are created. A different message from the s ...


4
Christopher P Ausschnitt, William A Muth: Method of measuring bias and edge overlay error for sub-0.5 micron ground rules. International Business Machines Corporation, Peter W DeLio & Peterson Peterson, Aziz M Ahsan, May 26, 1998: US05757507 (130 worldwide citation)

A method of determining bias or overlay error in a substrate formed by a lithographic process uses a pair of straight vernier arrays of parallel elements, a staggered vernier array of parallel elements, and optionally at least one image shortening array on the substrate. The ends of the elements for ...


5
Edward E Kelley, Norman J Dauerer, John U Knickerbocker: Password control via the web. International Business Machines Corporation, Peter W Peterson, Aziz M Ahsan, DeLio & Peterson, December 7, 1999: US06000033 (128 worldwide citation)

A system and process for providing passwords from a client computer to different servers, databases and applications and other services accessed on and inter- or intra-net. A program storage device has a reference table having a listing of a plurality of services accessible on an inter- or intra-net ...


6
Huntington W Curtis, Min Su Fung, Roger L Verkuil: Contactless technique for semicondutor wafer testing. International Business Machines Corporation, William T Ellis, Aziz M Ahsan, March 14, 1989: US04812756 (125 worldwide citation)

A contactless technique for semiconductor wafer testing comprising: depositing charges on the top surface of an insulator layer over the wafer to create an inverted surface with a depletion region and thereby a field-induced junction therebelow in the wafer, with an accumulated guard ring on the sem ...


7
Christopher Perry Ausschnitt, Timothy Allan Brunner: Method of optical metrology of unresolved pattern arrays. International Business Machines Corporation, Peter W Peterson, Aziz M Ahsan, DeLio & Peterson, September 8, 1998: US05805290 (118 worldwide citation)

A process for determining critical dimension bias or overlay error in a substrate formed by a lithographic process initially provides an array of elements on a substrate, the array comprising a plurality of spaced, substantially parallel elements having a length and a width. The sum of the width of ...


8
Hormazdyar Minocher Dalal, Kenneth Michael Fallon: Direct chip attach circuit card. International Business Machines Corporation, Ira D Blecker, Aziz M Ahsan, August 18, 1998: US05796591 (117 worldwide citation)

A structure and a method is disclosed for making a laminated circuit carrier card for the purpose of making a Direct Chip Attached Module (DCAM) with low cost and high reliability. The carrier is made using an organic or an inorganic laminated carrier having at least one surface available for direct ...


9
Evan G Colgan, Peter M Fryer: Method of making Alpha-Ta thin films. International Business Machines Corporation, Aziz M Ahsan, June 22, 1993: US05221449 (115 worldwide citation)

The present invention relates generally to a structure and a method of making Alpha-Ta films, and more particularly, to a structure and a method of making Alpha-Ta in thin films. A seed layer of Ta reactively sputtered in a nitrogen containing environment is grown on the substrate, and using this se ...


10
Gaetano P Messina, Robert A Brewster, Theodore J Kara, Seaho Song: Apparatus for cooling integrated circuit chips. International Business Machines Corporation, Peter W Peterson, Aziz M Ahsan, August 24, 1993: US05239200 (111 worldwide citation)

An apparatus for cooling an array of integrated circuit chips mounted on a substrate comprises a thermally conductive cooling plate which has a plurality of integral, substantially parallel, closed-end channels. A cover which may be made of plastic is adapted to seal the periphery of the cooling mem ...