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Shyam Venkataraman
Raman Vijay Immanuel, Li Yuzhuo, Schade Christian, Venkataraman Shyam Sundar, Yu Shen Eason Su, Usman Ibrahim Sheik Ansar: [fr] COMPOSITION CHIMIQUE DE POLISSAGE MÉCANIQUE COMPRENANT DE LACIDE DE POLYVINYLE PHOSPHONIQUE ET SES DÉRIVÉS, [en] CHEMICAL MECHANICAL POLISHING COMPOSITION COMPRISING POLYVINYL PHOSPHONIC ACID AND ITS DERIVATIVES. Raman Vijay Immanuel, Li Yuzhuo, Schade Christian, Venkataraman Shyam Sundar, Yu Shen Eason Su, Usman Ibrahim Sheik Ansar, BASF SE, BASF, June 27, 2013: WO/2013/093557 (2 worldwide citation)

[en] A chemical mechanical polishing (CMP) composition comprising: (A) inorganic particles, organic particles, or a mixture or composite thereof, (B) at least one type of an organic polymeric compound as a dispersing agent or charge reversal agent comprising a phosphonate (P(=O)(OR1)(OR2) ) or phosp ...


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Shyam Venkataraman
KLIPP Andreas, RAMAN Vijay Immanuel, VENKATARAMAN Shyam Sundar, MELLIES Raimund, ZHONG Mingjie: COMPOSITION DE NETTOYAGE AQUEUSE SANS AZOTE, SA PRÉPARATION ET SON UTILISATION, AQUEOUS, NITROGEN-FREE CLEANING COMPOSITION, PREPARATION AND USE THEREOF. BASF SE, BASF, KLIPP Andreas, RAMAN Vijay Immanuel, VENKATARAMAN Shyam Sundar, MELLIES Raimund, ZHONG Mingjie, FITZNER Uwe, September 27, 2012: WO/2012/127336 (1 worldwide citation)

Aqueous, nitrogen-free cleaning composition, preparation and use thereof are provided. The composition having a pH of from 5 to 8 comprises (A) an amphiphilic nonionic, water-soluble or water-dispersible surfactant and (B) a metal chelating agent selected from polycarboxylic acids having at least 3 ...


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Shyam Venkataraman
VENKATARAMAN Shyam Sundar, YU SHEN Eason Su: [fr] PROCÉDÉ DE FABRICATION DUNE COMPOSITION DE POLISSAGE CHIMICO-MÉCANIQUE (CMP) ET SON APPLICATION, [en] METHOD FOR MANUFACTURING CMP COMPOSITION AND APPLICATION THEREOF. VENKATARAMAN Shyam Sundar, YU SHEN Eason Su, BASF SE, BASF, June 27, 2013: WO/2013/093556

[en] Provided is a process for the manufacture of semiconductor devices comprising the chemical mechanical polishing of borophosphosilicate glass (BPSG) material in the presence of a chemical mechanical polishing (CMP) composition which comprises: (A) inorganic particles, organic particles, or a mix ...


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Shyam Venkataraman
LI Yuzhuo, VENKATARAMAN Shyam Sundar, PINDER Harvey Wayne: PROCÉDÉ DE POLISSAGE MÉCANO-CHIMIQUE DE SUBSTRATS CONTENANT DES FILMS DIÉLECTRIQUES DOXYDE DE SILICIUM ET DES FILMS DE POLYSILICIUM ET/OU DE NITRURE DE SILICIUM, PROCESS FOR CHEMICALLY MECHANICALLY POLISHING SUBSTRATES CONTAINING SILICON OXIDE DIELECTRIC FILMS AND POLYSILICON AND/OR SILICON NITRIDE FILMS. BASF SE, LI Yuzhuo, VENKATARAMAN Shyam Sundar, PINDER Harvey Wayne, BASF, March 15, 2012: WO/2012/032467

CMP process for substrates containing silicon oxide dielectric films and polysilicon and/or silicon nitride films comprising the steps of (1 ) contacting the substrate with an aqueous composition containing (A) abrasive particles which are positively charged when dispersed in an aqueous medium havin ...