1
Richard J Pommer, John Chiechi: Spring grid array interconnection for active microelectronic elements. UniStructure, Knobbe Martens Olson & Bear, May 1, 1990: US04922376 (107 worldwide citation)

A mechanical and electrical interconnection of an active integrated circuit to a passive substrate. The interconnection includes a contact retainer having resilient elements disposed in apertures which extend through the retainer so that the elements are radially compressed. The retainer is disposed ...


2
Busby Michael W, Pommer Richard J, Johnson Tony K, Waxweiler Jeffrey J, Camen Martin: Beam lead and semiconductor device structure and method for fabricating integrated structure. Unistructure, DEVEZA Robert R, December 13, 1990: WO/1990/015438

Beams leads (10) are epitaxially grown on a semiconductor chip (12) separated from a wafer, forming an integral structure. The beam leads (10) are embedded within a dielectric material (20) for protection and strength. The dielectric material (20) covers the active circuit side (14) as well as edges ...


3
Busby Michael W, Pommer Richard J, Johnson Tony K, Waxweiler Jeffrey J, Camen Martin: Protected lead frame and method for fabricating lead frames. Unistructure, SIMPSON Andrew H, December 28, 1989: WO/1989/012911

An interconnecting circuit for semiconductor and like integrated circuit devices has leads (20) fabricated embedded within a flexible dielectric layer (30) or layers, the leads (20) having inner contact pads (22) or points protruding through to the surface of the dielectric for conductive connection ...