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Mustanir, Maria Cristina T Santillan, Debie Agung Setiawan, Yulia Natilova, Gunarto Wibowo: Lead frames with wettable flanks. UNISEM, Wiggin and Dana, Gregory S Rosenblatt, Andrew D Bochner, May 8, 2018: US09966326

A method of producing wettable fillets in electronic packages. A matrix of unsingulated lead frames is provided, each including a plurality of lead elements and a chip pad. Chips are attached to the chip pads and terminals on the chips are electrically connected to lead portions of the lead elements ...


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Romarico Santos San Antonio, Anang Subagio, Shafidul Islam: Lead frame routed chip pads for semiconductor packages. Unisem, Wiggin and Dana, November 6, 2012: US08304864

A redistributed lead frame for use in a molded plastic semiconductor package is formed from an electrically conductive substrate by a sequential metal removal process. The process includes patterning a first side of the substrate to form an array of lands separated by channels; disposing a first mol ...


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Ramos Mary Jean Bajacan, San Antonio Romarico Santos, Subagio Anang: No lead package with heat spreader. Unisem Mauritius Holdings, November 12, 2008: EP1989735-A2

A no-lead electronic package including a heat spreader and method of manufacturing the same. This method includes the steps of selecting a matrix or mapped no-lead lead frame with die receiving area and leads for interconnect; positioning an integrated circuit device within the central aperture and ...


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Byung Il Lee, Byung Kwon Yim, Yun Hag Oh, Sung Jin Jung, Man Su Lee, Chang Wook Jeong, Tae Sang Yoon, Geun Sik Lee: Apparatus and method for pretreating effluent gases in a wet environment. UNISEM, Oblon Spivak Mcclelland Maier & Neustadt PC, November 27, 2003: US20030219361-A1

An apparatus and method for wet pre-treatment of an effluent gas derived from upstream semiconductor or LCD manufacturing tools before the effluent gas is processed in an effluent gas treatment system in provided. The apparatus comprises an atomizing spray nozzle for atomizing a reagent and a proces ...


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Andrew Wye Choong Low, Mee Sing Tiong: Semiconductor package. Unisem, Jacobson Holman Pllc, October 2, 2008: US20080237857-A1

There is disclosed a method of making an electronic package (10) by: forming a metal base (50) on which to build the components of an electronic package; applying a mask layer (60) on the base to an area that is not to be occupied by interconnection pads (200) or die attachment pads (201) of the pac ...


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Siong Cho Lau, May Nee Lim, Soi Yoke See Thoh, Wai Nam Leong: Stress buffer to protect device features. Unisem Advanced Technologies Sdn Bhd, April 7, 2011: US20110079908-A1

Disclosed is a stress buffer structure intended to be disposed adjacent a face of a semiconductor substrate. The stress buffer structure includes at least one polymer layer formed on the face of the semiconductor substrate and a plurality of metal plates disposed over the polymer layer, wherein the ...


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Siong Cho Lau, Tze Peng Theng: Solder bump UBM structure. Unisem Advanced Technologies Sdn Bhd a company incorporated in Malaysia, Wiggin And Dana, August 26, 2010: US20100213608-A1

Disclosed is an under bump metallization structure including a plurality of metal or metal alloy layers formed on chip bond pads. The disclosed UBM structure has a stress improvement on the semiconductor device because the thickness of the copper-base layer is reduced to between about 0.3 and 10 mic ...


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Romarico S San Antonio, Michael H McKerreghan, Anang Subagio, Allan C Toriaga: Semiconductor device package with electromagnetic shielding. Unisem, May 24, 2012: US20120126378-A1

A package for a semiconductor device includes shielding from RF interference. The package has a lead frame with a lead and a connecting bar. The lead has an inner end for connecting to the device and an outer end having an exposed surface at the package side face. The connecting bar also has an end ...


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