11
Romarico S San Antonio, Michael H McKerreghan, Anang Subagio, Allan C Toriaga: Partially patterned lead frames and methods of making and using the same in semiconductor packaging. Unisem, White & Case, August 7, 2012: US08236612 (8 worldwide citation)

A method of making a lead frame and a partially patterned lead frame package with near-chip scale packaging lead-count, wherein the method lends itself to better automation of the manufacturing line and improved quality and reliability of the packages produced therefrom. A major portion of the manuf ...


12
Siong Cho Lau, Tze Peng Theng: Solder bump UBM structure. Unisem Advanced Technologies SDN BHD, Wiggin and Dana, Gregory S Rosenblatt, Wanli Wu, March 29, 2011: US07915741 (8 worldwide citation)

Disclosed is an under bump metallization structure including a plurality of metal or metal alloy layers formed on chip bond pads. The disclosed UBM structure has a stress improvement on the semiconductor device because the thickness of the copper-base layer is reduced to between about 0.3 and 10 mic ...


13
Shafidul Islam, Romarico Santos San Antonio, Anang Subagio: Lead frame routed chip pads for semiconductor packages. Unisem, Wiggin and Dana, October 26, 2010: US07820480 (5 worldwide citation)

A redistributed lead frame for use in a molded plastic semiconductor package (38) is formed from an electrically conductive substrate by a sequential metal removal process. The process includes: (a) patterning a first side of an electrically conductive substrate to form an array of lands separated b ...


14
Shafidul Islam, Romarico S San Antonio: Reversible leadless package and methods of making and using same. Unisem, Wiggin and Dana, November 15, 2011: US08058104 (5 worldwide citation)

A method for manufacturing a semiconductor device package including an electrically conductive lead frame having a plurality of posts disposed at a perimeter of the package. Each of the posts has a first contact surface at the first package face and a second contact surface at the second package fac ...


15
Ramos Mary Jean, Subagio Anang, Simporios, Guirit Lynn, San, Antonio Romarico Santos: Partially patterned lead frames and methods of making and using the same in semiconductor packaging. Unisem, Unisem, Ramos Mary Jean, Subagio Anang, Simporios, Guirit Lynn, San, Antonio Romarico Santos, GENOVA John M, May 15, 2008: WO/2008/057770 (5 worldwide citation)

A method of making a lead frame and a partially patterned lead frame package with near-chip scale packaging lead-count, wherein the method lends itself to better automation of the manufacturing line and improved quality and reliability of the packages produced therefrom. A major portion of the manuf ...


16
Lee Byeong Il, Lee Dae U: Semiconductor wafer bake apparatus having thermal compensation function. Unisem, August 21, 2002: KR1020010007323 (4 worldwide citation)

PURPOSE: A semiconductor wafer bake apparatus having a thermal compensation function is provided to equally keep a temperature of a wafer surface by preventing a temperature decrease of a wafer edge portion. CONSTITUTION: A semiconductor wafer bake apparatus having a thermal compensation comprises a ...


17
Romarico S San Antonio, Anang Subagio: Leadless semiconductor package and method of manufacture. Unisem, Wiggin and Dana, May 17, 2011: US07943431 (3 worldwide citation)

A package to encase a semiconductor package is manufactured by the following steps. First, an electrically conductive frame is provided. This frame has a plurality of leadframes arranged in a matrix with each leadframe having a plurality of spaced leads extending outwardly from a central aperture. T ...


18
Andrew Wye Choong Low, Mee Sing Tiong: Semiconductor package. Unisem, Jacobson Holman PLLC, June 9, 2009: US07544541 (3 worldwide citation)

There is disclosed a method of making an electronic package (10) by: forming a metal base (50) on which to build the components of an electronic package; applying a mask layer (60) on the base to an area that is not to be occupied by interconnection pads (200) or die attachment pads (201) of the pac ...


19
Shafidul Islam, Romarico Santos San Antonio, Lenny Christina Gultom: Taped lead frames and methods of making and using the same in semiconductor packaging. Unisem, White & Case, October 21, 2008: US07439097 (2 worldwide citation)

The invention provides a taped lead frame for use in manufacturing electronic packages. The taped lead frame is composed of a tape and a lead frame formed from a plurality of individual metal features attached to the tape and arranged in a footprint pattern. The method of making the invention enable ...


20
Michael H McKerreghan, Shafidul Islam, Romarico S San Antonio: Package having exposed integrated circuit device. Unisem, Wiggin and Dana, June 30, 2009: US07554180 (2 worldwide citation)

A package (10) includes an integrated circuit device (12) having an electrically active surface (16) and an opposing backside surface (14). A dielectric molding resin (26) at least partially encapsulates the integrated circuit die and the plurality of electrically conductive leads (20) with the back ...