1
Timothy Leung, Mary Jean Bajacan Ramos, Gan Kian Yeow, Kyaw Ko Lwin, Romarico Santos San Antonio, Anang Subagio: Method of making thermally enhanced substrate-base package. Unisem, Wiggin and Dana, June 22, 2010: US07741158 (55 worldwide citation)

An array-type package encasing one or more semiconductor devices. The package includes a dielectric substrate having opposing first and second sides with a plurality of electrically conductive vias and a centrally disposed aperture extending from the first side to the second side. A heat slug has a ...


2
Mary Jean Ramos, Anang Subagio, Lynn Simporios Guirit, Romarico Santos San Antonio: Partially patterned lead frames and methods of making and using the same in semiconductor packaging. Unisem, White & Case, September 7, 2010: US07790500 (52 worldwide citation)

A method of making a lead frame and a partially patterned lead frame package with near-chip scale packaging lead-count, wherein the method lends itself to better automation of the manufacturing line and improved quality and reliability of the packages produced therefrom. A major portion of the manuf ...


3
Mary Jean Ramos, Romarico Santos San Antonio, Anang Subagio: Partially patterned lead frames and methods of making and using the same in semiconductor packaging. Unisem, White & Case, September 21, 2010: US07799611 (23 worldwide citation)

A method of making a lead frame and a partially patterned lead frame package with near-chip scale packaging (CSP) lead-counts is disclosed, wherein the method lends itself to better automation of the manufacturing line as well as to improving the quality and reliability of the packages produced ther ...


4
Shafidul Islam, Romarico S San Antonio: Reversible leadless package and methods of making and using same. Unisem, Wiggin and Dana, May 4, 2010: US07709935 (23 worldwide citation)

A semiconductor device package includes an electrically conductive lead frame having a plurality of posts disposed at a perimeter of the package. Each of the posts has a first contact surface disposed at the first package face and a second contact surface disposed at the second package face. The lea ...


5
Shafidul Islam, Romarico Santos San Antonio: Partially patterned lead frames and methods of making and using the same in semiconductor packaging. Unisem, White & Case, November 24, 2009: US07622332 (22 worldwide citation)

A method of making a lead frame and a partially patterned lead frame package with near-chip scale packaging (CSP) lead-counts is accomplished by performing a major portion of the manufacturing process steps with a partially patterned strip of metal formed into a web-like lead frame on one side, so t ...


6
Romarico S San Antonio, Michael H McKerreghan, Anang Subagio, Allan C Toriaga, Lenny Christina Gultom: RF shielding for a singulated laminate semiconductor device package. Unisem, Wiggin and Dana, December 27, 2011: US08084300 (20 worldwide citation)

A method for manufacturing a semiconductor device package to provide RF shielding. The device is mounted on a laminated substrate having conducting pads on its top surface. A molding compound covers the substrate top surface and encapsulates the devices. The substrate is disposed on a tape; the mold ...


7
Brian Keith Stevenson: Fixed frequency switching regulator with improved dynamic response. Unisem, Gene Scott Patent Law & Venture Group, March 6, 2001: US06198265 (15 worldwide citation)

An electrical circuit provides a fixed frequency switching regulator, having improved dynamic response, and a low count of external discrete elements. The circuit can be used at 100% duty cycle and does not require a minimum load or the components usually found in such circuits for compensation. A c ...


8
Shafidul Islam, Daniel K Lau, Romarico S San Antonio, Anang Subagio, Michael H McKerreghan, Edmunda G O Litilit: Semiconductor device package and method for manufacturing same. Unisem, Wiggin and Dana, July 21, 2009: US07563648 (14 worldwide citation)

A lead frame (52, 100, 112) for a semiconductor device (die) package (50, 102, 110) is described. Each of the leads (60) in the lead frame (52, 100, 112) includes an interposer (64) having one end (66) disposed proximate the outer face (58) of the package (50, 102, 110) and another end (68) disposed ...


9
Romarico Santos San Antonio, Anang Subagio, Glenn Macaraeg, Mary Jean Bajacan Ramos: Method of making flip-chip package with underfill. Unisem, Wiggin and Dana, April 20, 2010: US07700414 (10 worldwide citation)

A method for the manufacture of a package to encapsulate at least one integrated circuit device includes the steps of: (1) providing a dielectric substrate having a first plurality of bond pads formed on a first side thereof and at least one aperture; (2) electrically interconnecting the integrated ...


10
Shafidul Islam, Romarico Santos San Antonio, Anang Subagio: Lead frame routed chip pads for semiconductor packages. Unisem, Wiggin and Dana, September 14, 2010: US07795710 (9 worldwide citation)

A redistributed lead frame for use in molded plastic semiconductor package (38) is formed from an electrically conductive substrate by a sequential metal removal process. The process includes: (a) patterning a first side of an electrically conductive substrate to form an array of lands separated by ...