1
Too Seah Sun, Khan Mohammad, Hayward James, Diep Jacquana: Integrated circuit packaging. Advanced Micro Devices, Too Seah Sun, Khan Mohammad, Hayward James, Diep Jacquana, DRAKE Paul S, December 13, 2007: WO/2007/142721 (15 worldwide citation)

Various integrated circuit package elements are provided. In one aspect, an integrated circuit package device is provided that includes a lid (20) for covering an integrated circuit (12). The lid (20) has a convex surface (40) for applying pressure on the integrated circuit (12) when the Hd (20) is ...


2
Too Seah Sun, Master Raj N, Diep Jacquana, Khan Mohammad: Integrated circuit socket. Advanced Micro Devices, Too Seah Sun, Master Raj N, Diep Jacquana, Khan Mohammad, DRAKE Paul S, September 25, 2008: WO/2008/115453

Various sockets for packaged integrated circuits and methods of making the same are provided. In one aspect, a method of mounting a semiconductor chip (105) is provided that includes providing a package (110) that has a base substrate (115) with a first side and a second side opposite the first side ...


3
Too Seah Sun, Master Raj N, Diep Jacquana, Khan Mohammad: Reduction of damage to thermal interface material due to asymmetrical load. Advanced Micro Devices, Too Seah Sun, Master Raj N, Diep Jacquana, Khan Mohammad, DRAKE Paul S, February 21, 2008: WO/2008/021072

Various method and apparatus for packaging an integrated circuit (52) are provided. In one aspect, a method of packaging an integrated circuit (32) is provided that includes coupling an integrated circuit (52) to a substrate (54), mixing an adhesive (58) with a plurality of particles (82), and coupl ...