1
Hiroyuki Iwai, Tamotsu Tanifuji, Takanobu Asano, Ryoichi Okura: Treatment apparatus. Tokyo Electron Kabushiki Kaisha, Tokyo Electron Tohoku Kabushiki Kaisha, Beveridge DeGrandi Weilacher & Young L, October 8, 1996: US05562383 (115 worldwide citation)

A treatment apparatus comprises a treatment chamber for performing a treatment for a workpiece W, a loading chamber connected to the treatment chamber, for loading and unloading a holding member which contains the workpiece into and from the treatment chamber, and an input/output chamber for inputti ...


2
Hirotsugu Shiraiwa: Conveyor apparatus. Tokyo Electron Kabushiki Kaisha, Tokyo Electron Tohoku Kabushiki Kaisha, Beveridge DeGrandi Weilacher & Young, April 11, 1995: US05404894 (106 worldwide citation)

A thermal processing station is provided with a first conveyor that conveys a wafer from a first conveyor access portion and a second conveyor that conveys another wafer from a second conveyor access opening portion. The wafer conveyed from the first conveyor is conveyed along a route consisting of ...


3
Tetsu Ohsawa: Heat treating apparatus. Tokyo Electron Kabushiki Kaisha, Tokyo Electron Tohoku Kabushiki Kaisha, Beveridge DeGrandi Weilacher & Young, November 7, 1995: US05464313 (96 worldwide citation)

A heat treatment apparatus for semiconductor wafers is provided with a number, such as two, of heat treatment units which are arranged horizontally and which load wafer boats containing wafers from below. A wafer delivery section is provided to correspond to each of the two heat treatment units, and ...


4
Yuji Ono, Katsuhiko Mihara: Treatment system including a plurality of treatment apparatus. Tokyo Electron Kabushiki, Tokyo Electron Tohoku Kabushiki Kaisha, Beveridge DeGrandi Weilacher & Young, June 18, 1996: US05527390 (61 worldwide citation)

A treatment system is disclosed, which has a treatment apparatus for performing a predetermined treatment for a planar workpiece contained in a carrier, and a first air-tight carrier storage chamber for storing the carrier. The treatment apparatus has an air-tight second carrier storage chamber. An ...


5
Wataru Ohkase: Thermal processing apparatus with heat shielding member. Tokyo Electron Kabushiki Kaisha, Tokyo Electron Tohoku Kabushiki Kaisha, Beveridge DeGrandi Weilacher & Young, May 28, 1996: US05520742 (56 worldwide citation)

A heat shielding member is provided on an object-to-be-processed holder for loading/unloading an object to be processed to/from a thermal processing position. The heat shielding member can cover a space below the processing position. As a result, leakage of radiation heat from the processing positio ...


6
Katsuhiko Iwabuchi, Eiichirou Takanabe: Wafer processing apparatus. Tokyo Electron Kabushiki Kaisha, Tokyo Electron Tohoku Kabushiki Kaisha, Beveridge DeGrandi Weilacher & Young, December 16, 1997: US05697749 (54 worldwide citation)

The present invention refers to a wafer transfer robot for a wafer boat of a wafer processing apparatus wherein a turntable within a chamber of a turntable apparatus is provided with a prescribed number of stations formed thereon. Each of the stations is provided with protrusions that hold a wafer c ...


7
Eiichiro Takanabe, Takeo Suzuki, Tadataka Noguchi: Vertical heat-treating apparatus and heat-treating process by using the vertical heat-treating apparatus. Tokyo Electron Tohoku Kabushiki Kaisha, Beveridge DeGrandi Weilacher & Young, February 14, 1995: US05388944 (52 worldwide citation)

A wafer loading and unloading chamber is provided at the bottom of a reaction tube of a heat treatment section, a robot chamber and cassette chamber are coupled via gate valves to the wafer loading and unloading chamber, the robot chamber comprises a first load lock chamber while the wafer loading a ...


8
Kenichi Yamaga, Toshiki Kobayashi: Apparatus for heat treating semiconductors at normal pressure and low pressure. Tokyo Electron Kabushiki Kaisha, Tokyo Electron Tohoku Kabushiki Kaisha, Beveridge DeGrandi Weilacher & Young, November 26, 1996: US05578132 (46 worldwide citation)

A heat treating unit for semiconductor processing is adapted to conduct normal pressure high temperature processing and low pressure thermal processing using corrosive gases. The unit includes an inner tube for receiving a boat which carries objects to be processed, an outer tube concentrically disp ...


9
Wataru Okase: Thermal treatment apparatus utilizing heated lid. Tokyo Electron Kabushiki Kaisha, Tokyo Electron Tohoku Kabushiki Kaisha, Beveridge DeGrandi Weilacher & Young, July 12, 1994: US05329095 (39 worldwide citation)

A heater body or a circulation path for a heating gas is provided in an inner surface of a lid body that opens and closes an opening portion of a process tube. The circulation path is formed in such a manner that it passes through a gap between the lid body and the shaft of a rotation mechanism that ...


10
Kenji Homma, Koichi Yomiya: Processing furnace for oxidizing objects. Tokyo Electron Kabushiki Kaisha, Tokyo Electron Tohoku Kabushiki Kaisha, Beveridge DeGrandi Weilacher & Young L, July 7, 1998: US05777300 (35 worldwide citation)

The present invention comprises a processing furnace for oxidizing object to be processed at a high temperature, pressure reducing means for evacuating the interior of the processing furnace, a burning apparatus disposed outside the processing furnace for burning hydrogen gas and oxygen gas to gener ...



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