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Belgacem Haba Belgacem (Bel) Haba
Vage Oganesian, Guilian Gao, Belgacem Haba, David Ovrutsky: Microelectronic assemblies having compliancy and methods therefor. Tessera Technologies Hungary Kft, Tessera, LERNER DAVID et al, June 26, 2008: US20080150121-A1

A method of making a microelectronic assembly includes providing a semiconductor wafer having contacts accessible at a first surface, forming compliant bumps over the first surface and depositing a sacrificial layer over the compliant bumps. The method includes grinding the sacrificial layer and the ...


2
Belgacem Haba Belgacem (Bel) Haba
Vage Oganesian, David Ovrutsky, Charles Rosenstein, Belgacem Haba, Giles Humpston: Wafer-level fabrication of lidded chips with electrodeposited dielectric coating. Tessera Technologies Hungary Kft, Tessera, LERNER DAVID et al, May 1, 2008: US20080099900-A1

A method is provided for fabricating a unit including a semiconductor element such as a sensor unit, e.g., for optical imaging. A semiconductor element has plurality of conductive features exposed at the front surface and semiconductive or conductive material exposed at least one of the front and re ...


3
Belgacem Haba Belgacem (Bel) Haba
Moshe Kriman, Osher Avsian, Belgacem Haba, Giles Humpston, Dmitri Burshtyn: Stacked microelectronic assemblies having vias extending through bond pads. Tessera Technologies Hungary Kft, Tessera, LERNER DAVID et al, September 16, 2010: US20100230795-A1

A stacked microelectronic assembly is provided which includes first and second stacked microelectronic elements. Each of the first and second microelectronic elements can include a conductive layer extending along a face of such microelectronic element. At least one of the first and second microelec ...


4
Gil Zilber, Julia Aksenton, Vage Oganesian: Methods and apparatus for packaging integrated circuit devices. Tessera Technologies Hungary Kft, Lerner David Littenberg Krumholz & Mentlik, March 20, 2007: US07192796 (66 worldwide citation)

An integrally packaged integrated circuit device including an integrated circuit die including a crystalline substrate having first and second generally planar surfaces and edge surfaces and semiconductor circuitry formed over the first generally planar surface, at least one chip scale packaging lay ...


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Gil Zilber, Reuven Katraro, Doron Teomim: Methods for producing packaged integrated circuit devices and packaged integrated circuit devices produced thereby. Tessera Technologies Hungary Kft, Lerner David Littenberg Krumholz & Mentlik, April 25, 2006: US07033664 (59 worldwide citation)

A crystalline substrate based device including a crystalline substrate having formed thereon a microstructure and at least one packaging layer which is formed over the microstructure and defines therewith at least one gap between the crystalline substrate and the at least one packaging layer and at ...


6
Gil Zilber, Reuven Katraro, Julia Aksenton, Vage Oganesian: Methods and apparatus for packaging integrated circuit devices. Tessera Technologies Hungary Kft, Lerner David Littenberg Krumholz & Mentlik, September 4, 2007: US07265440 (56 worldwide citation)

An integrally packaged integrated circuit device including an integrated circuit die including a crystalline substrate having first and second generally planar surfaces and edge surfaces and an active surface formed on the first generally planar surface, at least one chip scale packaging layer forme ...


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Avner Badehi: Integrated circuit device. Tessera Technologies Hungary Kft, Lerner David Littenberg Krumholz & Mentlik, January 2, 2007: US07157742 (42 worldwide citation)

An integrally packaged optronic integrated circuit device (310) including an integrated circuit die (322) containing at least one of a radiation emitter and radiation receiver and having top and bottom surfaces formed of electrically insulative and mechanically protective material, at least one of t ...


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Avner Pierre Badehi: Methods for producing packaged integrated circuit devices and packaged integrated circuit devices produced. Tessera Technologies Hungary Kft, Lerner David Littenberg Krumholz & Mentlik, December 5, 2006: US07144745 (40 worldwide citation)

A method of producing a crystalline substrate based device includes forming a microstructure on a crystalline substrate. At least one packaging layer is sealed over the microstructure by an adhesive and defines therewith at least one gap between the crystalline substrate and the at least one packagi ...


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Gil Zilber, Julia Aksenton, Vage Oganesian: Methods and apparatus for packaging integrated circuit devices. Tessera Technologies Hungary Kft, Lerner David Littenberg Krumholz & Mentlik, February 24, 2009: US07495341 (39 worldwide citation)

An integrally packaged integrated circuit device including an integrated circuit die including a crystalline substrate having first and second generally planar surfaces and edge surfaces and semiconductor circuitry formed over the first generally planar surface, at least one chip scale packaging lay ...


10
Vage Oganesian, Andrey Grinman, Charles Rosenstein, Felix Hazanovich, David Ovrutsky, Avi Dayan, Yulia Aksenton, Ilya Hecht: Wafer-level fabrication of lidded chips with electrodeposited dielectric coating. Tessera Technologies Hungary Kft, Lerner David Littenberg Krumholz & Mentlik, October 5, 2010: US07807508 (35 worldwide citation)

A method is provided for fabricating a unit including a semiconductor element such as a sensor unit, e.g., for optical imaging. A semiconductor element has plurality of conductive features exposed at the front surface and semiconductive or conductive material exposed at at least one of the front and ...