1
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Brian Marcucci: Microelectronic assembly with impedance controlled wirebond and conductive reference element. Tessera Research, Lerner David Littenberg Krumholz & Mentlik, April 12, 2011: US07923851 (10 worldwide citation)

A microelectronic assembly can include a microelectronic device having device contacts exposed at a surface thereof and an interconnection element having element contacts and having a face adjacent to the microelectronic device. Conductive elements, e.g., wirebonds connect the device contacts with t ...


2
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Philip Damberg, Philip R Osborn: Microelectronic assembly with joined bond elements having lowered inductance. Tessera Research, Lerner David Littenberg Krumholz & Mentlik, August 30, 2011: US08008785 (3 worldwide citation)

A microelectronic assembly includes a semiconductor chip having chip contacts exposed at a first face and a substrate juxtaposed with a face of the chip. A conductive bond element can electrically connect a first chip contact with a first substrate contact of the substrate, and a second conductive b ...


3
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Brian Marcucci: Microelectronic assembly with impedance controlled wirebond and conductive reference element. Tessera Research, April 28, 2011: US20110095408-A1

A microelectronic assembly can include a microelectronic device having device contacts exposed at a surface thereof and an interconnection element having element contacts and having a face adjacent to the microelectronic device. Conductive elements, e.g., wirebonds connect the device contacts with t ...


4
Belgacem Haba Belgacem (Bel) Haba
Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Craig Mitchell, Piyush Savalia: Multi-function and shielded 3d interconnects. Tessera Research, March 22, 2012: US20120068327-A1

A microelectronic unit includes a semiconductor element consisting essentially of semiconductor material and having a front surface, a rear surface, a plurality of active semiconductor devices adjacent the front surface, a plurality of conductive pads exposed at the front surface, and an opening ext ...


5
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Philip Damberg, Philip R Osborn: Microelectronic assembly with joined bond elements having lowered inductance. Tessera Research, June 23, 2011: US20110147953-A1

A microelectronic assembly includes a semiconductor chip having chip contacts exposed at a first face and a substrate juxtaposed with a face of the chip. A conductive bond element can electrically connect a first chip contact with a first substrate contact of the substrate, and a second conductive b ...


6
Belgacem Haba Belgacem (Bel) Haba
Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Piyush Savalia, Craig Mitchell: Simultaneous wafer bonding and interconnect joining. Tessera Research, June 21, 2012: US20120153488-A1

Disclosed are a microelectronic assembly of two elements and a method of forming same. A microelectronic element includes a major surface, and a dielectric layer and at least one bond pad exposed at the major surface. The microelectronic element may contain a plurality of active circuit elements. A ...


7
Belgacem Haba Belgacem (Bel) Haba
Vage Oganesian, Ilyas Mohammed, Craig Mitchell, Belgacem Haba, Piyush Savalia: Microelectronic elements having metallic pads overlying vias. Tessera Research, January 26, 2012: US20120018868-A1

A microelectronic unit, an interconnection substrate, and a method of fabricating a microelectronic unit are disclosed. A microelectronic unit can include a semiconductor element having a plurality of active semiconductor devices therein, the semiconductor element having a first opening extending fr ...


8
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Ilyas Mohammed: Pin attachment. Tessera Research, June 14, 2012: US20120146206-A1

A microelectronic package includes a substrate having a first region, a second region, a first surface, and a second surface remote from the first surface. At least one microelectronic element overlies the first region on the first surface. First electrically conductive elements are exposed at one o ...


9
Belgacem Haba Belgacem (Bel) Haba
Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Piyush Savalia, Craig Mitchell: Void-free wafer bonding using channels. Tessera Research, June 21, 2012: US20120153426-A1

A method of bonding first and second microelectronic elements includes pressing together a first substrate containing active circuit elements therein with a second substrate, with a flowable dielectric material between confronting surfaces of the respective substrates, each of the first and second s ...


10
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Ellis Chau, Wael Zohni, Philip Damberg, Richard Dewitt Crisp: Impedance controlled packages with metal sheet or 2-layer rdl. Tessera Research, March 22, 2012: US20120068338-A1

A microelectronic assembly is disclosed that is capable of achieving a desired impedance for raised conductive elements. The microelectronic assembly may include an interconnection element, a surface conductive element, a microelectronic device, a plurality of raised conductive elements, and a bond ...