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Belgacem Haba Belgacem (Bel) Haba
Young Kim, Belgacem Haba, Vernon Solberg: Stacked microelectronic assembly and method therefor. Tessera, Lerner David Littenberg Krumholz & Mentlik, May 1, 2001: US06225688 (230 worldwide citation)

A stacked microelectronic assembly and its resulting structure includes a flexible substrate having a plurality of attachment sites, test contacts and conductive terminals, and including a wiring layer with leads extending to the attachment sites. The assembly includes a plurality of microelectronic ...


2
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Anthony B Faraci: Method of making a connection to a microelectronic element. Tessera, Lerner David Littenberg Krumholz & Mentlik, August 6, 2002: US06428328 (109 worldwide citation)

A connector for microelectronic elements includes a sheetlike dielectric layer having a plurality of through holes desirably arranged in a rectangular grid pattern. Each hole is provided on one major surface with a generally laminar contact having at least one projection extending inwardly over the ...


3
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba: Lidless socket and method of making same. Tessera, Lerner David Littenberg Krumholz & Mentlik, September 14, 1999: US05951305 (103 worldwide citation)

A socket for use with a semiconductor chip assembly having conductive joining units such as solder balls thereon. The socket includes a flexible dielectric element such as a polyimide sheet having a plurality of apertures extending through it. A backing element disposed beneath the dielectric elemen ...


4
Belgacem Haba Belgacem (Bel) Haba
John W Smith, Belgacem Haba: Flexible lead structures and methods of making same. Tessera, Lerner David Littenberg Krumholz & Mentlik, September 12, 2000: US06117694 (100 worldwide citation)

A microelectronic component, such as a connector or a packaged semiconductor device is made by connecting multiple leads between a pair of elements and moving the elements away from one another so as to bend the leads toward a vertically extensive disposition. One of the elements includes a temporar ...


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Belgacem Haba Belgacem (Bel) Haba
Masud Beroz, Belgacem Haba: Components with conductive solder mask layers. Tessera, Lerner David Littenberg Krumholz & Mentlik, December 11, 2001: US06329605 (100 worldwide citation)

A component for forming solder connections includes a diectric base having a non solder-wettable surface, a plurality of solder-wettable pads exposed to said surface, and an electrically conductive potential plane element having a non solder-wettable surface overlying the surface of the base in prox ...


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Anthony B Faraci: Low insertion force connector for microelectronic elements. Tessera, Lerner David Littenberg Krumholz & Mentlik, March 13, 2001: US06200143 (90 worldwide citation)

A connector for microelectronic elements includes a sheetlike dielectric layer having a plurality of through holes desirably arranged in a rectangular grid pattern. Each hole is provided on one major surface with a generally laminar contact having at least one projection extending inwardly over the ...


7
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba: Forming microelectronic connection components by electrophoretic deposition. Tessera, Lerner David Littenberg Krumholz & Mentlik, December 10, 2002: US06492201 (82 worldwide citation)

An electrically conductive article such as a sheet having holes therein is coated with a dielectric polymer using a multi-stage electrophoretic deposition process. A coating of uncured polymer is deposited electrophoretically and then cured. After the first polymer is cured, the part is subject to a ...


8
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba: Stacked microelectronic assemblies with central contacts. Tessera, Lerner David Littenberg Krumholz & Mentlik, June 13, 2006: US07061121 (82 worldwide citation)

A stacked microelectronic assembly includes a dielectric element and a first and second microelectronic element stacked one on top of the other with the first microelectronic element underlying at least a portion of the second microelectronic element. The first microelectronic element and the second ...


9
Belgacem Haba Belgacem (Bel) Haba
John W Smith, Belgacem Haba: Flexible lead structures and methods of making same. Tessera, Lerner David Littenberg Krumholz & Mentlik, December 7, 2004: US06828668 (80 worldwide citation)

An interconnect component comprises a compliant layer having a first surface and a plurality of electrically conductive leads having first ends and extending through the compliant layer. The first ends extend generally parallel to said first surface.


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Ilyas Mohammed, Vage Oganesian, David Ovrutsky, Laura Wills Mirkarimi: Reconstituted wafer level stacking. Tessera, Lerner David Littenberg Krumholz & Mentlik, March 8, 2011: US07901989 (66 worldwide citation)

A stacked microelectronic assembly is fabricated from a structure which includes a plurality of first microelectronic elements having front faces bonded to a carrier. Each first microelectronic element may have a first edge and a plurality of first traces extending along the front face towards the f ...



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