1
David L Roper, James W Cady, James Wilder, James Douglas Wehrly Jr, Jeff Buchle, Julian Dowden: Pitch change and chip scale stacking system. Staktek Group, Andrews Kurth L, J Scott Denko, May 30, 2006: US07053478 (108 worldwide citation)

The present invention stacks integrated circuits into modules that conserve board surface area. In a two-high stack or module devised in accordance with a preferred embodiment of the present invention, a pair of integrated circuits is stacked, with one integrated circuit above the other. The two int ...


2
James W Cady, James Wilder, David L Roper, James Douglas Wehrly Jr, Julian Dowden, Jeff Buchle: Chip scale stacking system and method. Staktek Group, June 10, 2003: US06576992 (105 worldwide citation)

The present invention stacks chip scale-packaged integrated circuits (CSPs) into modules that conserve board surface area. In a two-high CSP stack or module devised in accordance with a preferred embodiment of the present invention, a pair of CSPs is stacked, with one CSP above the other. The two CS ...


3
Harlan R Isaak, Andrew C Ross, Glen E Roeters: Panel stacking of BGA devices to form three-dimensional modules. Staktek Group, Andrews Kurth L, April 12, 2005: US06878571 (98 worldwide citation)

A chip stack comprising at least one base layer including a base substrate having a first conductive pattern disposed thereon. The chip stack further comprises at least one interconnect frame having a second conductive pattern disposed thereon which is electrically connected to the first conductive ...


4
Russell Rapport, Jeff Buchle: Clock driver with instantaneously selectable phase and method for use in data communication systems. Staktek Group, J Scott Denko, George &plus Donaldson, August 28, 2001: US06282210 (88 worldwide citation)

A clock driver providing a clock signal, from an input clock signal, that has instantaneously selectable phase and methods for synchronizing data transfers in a multi-signal bus communication system. A clock driver of the present invention generates an output clock signal from an input clock signal ...


5
Paul Goodwin: High capacity thin module system and method. Staktek Group, Fish & Richardson P C, January 29, 2008: US07324352 (84 worldwide citation)

Multiple DIMM circuits or instantiations are presented in a single module. In some embodiments, memory integrated circuits (preferably CSPs) and accompanying AMBs, or accompanying memory registers, are arranged in two ranks in two fields on each side of a flexible circuit. The flexible circuit has e ...


6
Carmen D Burns: Method of manufacturing a surface mount package. Staktek Group, J Scott Denko, George & Donaldson L, March 27, 2001: US06205654 (77 worldwide citation)

The present invention provides a method and apparatus for fabricating densely stacked ball-grid-array packages into a three-dimensional multi-package array. Integrated circuit packages are stacked on one another to form a module. Lead carriers provide an external point of electrical connection to bu ...


7
Russell Rapport, James W Cady, James Wilder, David L Roper, James Douglas Wehrly Jr, Jeff Buchle: Memory expansion and chip scale stacking system and method. Staktek Group, Andrews Kurth, July 5, 2005: US06914324 (73 worldwide citation)

The present invention stacks chip scale-packaged integrated circuits (CSPs) into modules that conserve PWB or other board surface area. In another aspect, the invention provides a lower capacitance memory expansion addressing system and method and preferably with the CSP stacked modules provided her ...


8
Carmen D Burns: High density integrated circuit module. Staktek Group, Andrews Kurth, July 19, 2005: US06919626 (72 worldwide citation)

The present invention provides a method and apparatus for fabricating densely stacked ball-grid-array packages into a three-dimensional multi-package array. Integrated circuit packages are stacked on one another to form a module. Lead carriers provide an external point of electrical connection to bu ...


9
Carmen D Burns, David Roper, James W Cady: Flexible circuit connector for stacked chip module. Staktek Group, J Scott Denko, June 3, 2003: US06572387 (72 worldwide citation)

The present invention provides a flexible circuit connector for electrically coupling IC devices to one another in a stacked configuration. Each IC device includes: (1) a package having top, bottom, and peripheral sides; and (2) external leads that extend out from at least one of the peripheral side ...


10
Russell Rapport: Reflection-control system and method. Staktek Group, Andrews Kurth, J Scott Denko, January 31, 2006: US06992501 (70 worldwide citation)

A termination circuit changes impedance to match a transmission line impedance. The change is made after a signal driver applies a signal through the termination circuit to the transmission line but before a signal reflection returns from an end of the transmission line.