1
Charles C Nolan, Stuart Sahr: Temperature conditioner for tests of unpackaged semiconductors. Signatone Corporation, Linval B Castle, July 4, 1989: US04845426 (92 worldwide citation)

A prober for the electrical testing of unpackaged integrated circuits on a semiconductor wafer can test these devices between subfreezing to elevated temperatures without generating atmospheric fog or frost on the wafer or associated equipment by directing an enclosed tubular curtain of dry gas, suc ...


2
Robert C Lutz, Lloyd B Dickson, Ralph James Eddington: Semiconductor wafer electrical testing with a mobile chiller plate for rapid and precise test temperature control. Lucas Signatone Corporation, Law Offices of Thomas E Schatzel, August 3, 2004: US06771086 (26 worldwide citation)

A semiconductor-wafer chuck for heating and cooling a device-under-test includes a heat-spreader plate with a clamping surface for a semiconductor wafer. A heater is disposed within the heat-spreader plate. A chiller heat-exchanger provides for heat removal. A motion control system is used to move t ...


3
Robert C Lutz, Lloyd B Dickson, Ralph James Eddington: Hot/cold chuck system. Lucas Signatone Corporation, Law Offices Of Thomas E Schartzel, A Professional Corporation, August 21, 2003: US20030155939-A1

A semiconductor-wafer chuck for heating and cooling a device-under-test includes a heat-spreader plate with a clamping surface for a semiconductor wafer. A heater is disposed within the heat-spreader plate and provides for temperature elevations. A chiller heat-exchanger independent of the heat-spre ...



Click the thumbnails below to visualize the patent trend.