1
Maricela Morales Charles Szmanda
Charles R Szmanda, George G Barclay, Peter Trefonas, Wang Yueh: Polymer and photoresist compositions. Shipley Company, S Matthew Cairns, c o EDWARDS & ANGELL, October 31, 2002: US20020160302-A1 (1 worldwide citation)

Disclosed are spirocyclic olefin polymers, methods of preparing spirocyclic olefin polymers, photoresist compositions including spirocyclic olefin resin binders and methods of forming relief images using such photoresist compositions.


2
Maricela Morales Charles Szmanda
Charles R Szmanda, George G Barclay, Peter Trefonas, Wang Yueh: Polymer and photoresist compositions. Shipley Company, Edwards & Angell, Dike Bronstein Roberts & Cushman IP Group, November 21, 2002: US20020173680-A1 (1 worldwide citation)

Disclosed are spirocyclic olefin polymers, methods of preparing spirocyclic olefin polymers, photoresist compositions including spirocyclic olefin resin binders and methods of forming relief images using such photoresist compositions.


3
Maricela Morales Charles Szmanda
Peter Trefonas, Gary N Taylor, Charles R Szmanda: Novel polymers and photoresist compositions for short wavelength imaging. Shipley Company, Peter F Corless, Edwards & Angell, May 2, 2002: US20020051938-A1

This invention relates to resins and photoresist compositions that comprise such resins. Preferred polymers of the invention comprise adjacent saturated carbon atoms, either integral or pendant to the polymer backbone, that have a substantially gauche conformation. Polymers of the invention are part ...


4
Maricela Morales Charles Szmanda
Charles R Szmanda, George G Barclay, Peter Trefonas, Wang Yueh: Polymer and photoresist compositions. Shipley Company, Dike Bronstein Roberts & Cushman IP Group, c o EDWARDS & ANGELL, October 24, 2002: US20020155380-A1

Disclosed are spirocyclic olefin ploymers, methods of preparing spirocyclic olefin polymers, photoresist compositions including spirocyclic olefin resin binders and methods of forming relief images using such photoresist compositions.


5
David Sherrer
David W Sherrer: Microstructures comprising silicon nitride layer and thin conductive polysilicon layer. Shipley Company L L C, Niels Haun, Jonathan D Baskin, March 2, 2004: US06698295 (96 worldwide citation)

Surface micromachined structures having a relatively thick silicon nitride layer and a relatively thin conductive polysilicon layer bonded together. Preferably, the silicon nitride layer and conductive polysilicon layer are made in the same low pressure chemical vapor deposition (LPCVD) step. The po ...


6
Charles Szmanda
Gary N Taylor, Charles R Szmanda: Polymers and photoresist compositions. Shipley Company L L C, Darryl P Frickey, Peter F Corless, May 2, 2000: US06057083 (41 worldwide citation)

The present invention provides novel polymers and chemically-amplified positive-acting photoresist compositions that contain such polymers as a resin binder component. Preferred polymers of the invention include one or more structural groups that are capable of reducing the temperature required for ...


7
David Sherrer
David W Sherrer, Noel Heiks, Dan Steinberg: Inductive magnetic recording head having inclined magnetic read/write pole and method of making same. Shipley Company L L C, Brown Rudnick Berlack Israels, December 31, 2002: US06501619 (31 worldwide citation)

A thin film magnetic read/write head which has a return pole and a read/write pole adjacent to the return pole. The return pole has a vertical sidewall which has a predetermined height and is perpendicular to a substrate. An insulating layer is disposed on the sidewall between the return pole and re ...


8
David Sherrer
Dan A Steinberg, David W Sherrer, Mindaugas F Daurtartas, Robert G Schinazi: Fiber array with V-groove chip and mount. Shipley Company L L C, Johnthan D Baskin, November 16, 2004: US06819858 (29 worldwide citation)

A molded mount of non-crystalline polymer material is configured to have a channel for retaining a silicon chip having a plurality of juxtaposed V-groove formed in a top surface between right and left side portions, thereof, a recessed area being provided in the channel behind the chip for accommoda ...


9

10
David Sherrer
David W Sherrer, Gregory A TenEyck: Single mask lithographic process for patterning multiple types of surface features. Shipley Company L L C, Jonathan D Baskin, November 2, 2004: US06811853 (21 worldwide citation)

A method for patterning different types of surface features on a semiconductor substrate (e.g. metal pads, etched pits and grooves) where the features are accurately located by a single mask. First, a dielectric layer is formed on the substrate. Next, an etch-resistant metal layer is formed on the d ...