1
Masatoshi Akagawa, Mitsutoshi Higashi, Hajime Iizuka, Takehiko Arai: Semiconductor device having an element with circuit pattern thereon. Shinko Electric, Staas & Halsey, November 10, 1998: US05834844 (274 worldwide citation)

A process for making a chip sized semiconductor device, in which a semiconductor chip is prepared so as to have electrodes on one of surfaces thereof and an electrically insulating passivation film formed on the one surface except for areas where the electrodes exist. An insulation sheet is prepared ...


2
Fumio Kuraishi, Kazuhito Yumoto, Mamoru Hayashi: Semiconductor device having tab tape lead frame with reinforced outer leads. Shinko Electric, January 12, 1999: US05859471 (213 worldwide citation)

In a lead frame adapted to be used for a semiconductor device, a plurality of inner leads are made of a thin conductive material for easily forming a fine pattern of the inner leads. A plurality of outer leads are integrally formed with the respective inner leads. The outer leads are coated with met ...


3
Hirofumi Fujii, Yoshiki Takeda, Mitsuharu Shimizu: Metal plane support for multi-layer lead frames and a process for manufacturing such frames. Shinko Electric, Intel Corporation, Staas & Halsey, April 25, 1995: US05410180 (166 worldwide citation)

A metal plane support structure of a semiconductor device multi-layer lead frame having one or more metal planes, of different types, arranged in stacked and aligned relationship with and adhered to a corresponding lead frame. Metal planes of a common type are defined in a corresponding metal strip, ...


4
Katsuya Fukase, Takahiro Iijima, Masao Nakazawa, Shinichi Wakabayashi: Lead frame and method for manufacturing same. Shinko Electric, Staas & Halsey, July 1, 1997: US05643433 (142 worldwide citation)

A method for manufacturing a lead frame employing a resist pattern formed on a matrix and having a cavity therein, in which an electro-deposition pattern is formed. A connecting cavity portion interconnects tip ends of inner lead cavity portions such that a connecting portion interconnects the tip e ...


5
Hajime Iizuka: Semiconductor device. Shinko Electric, Pennie & Edmonds, October 29, 2002: US06472745 (142 worldwide citation)

A semiconductor device in which a plurality of semiconductor chips are consolidated into one and which is provided with at least a set of rerouting wiring lines formed so as to interconnect electrodes of the respective semiconductor chips, the electrodes having a function which is common to the resp ...


6
Yuji Nishikawa, Masanori Onishi: Travel control method, travel control device, and mobile robot for mobile robot systems. Shinko Electric, Loeb & Loeb, October 22, 1996: US05568030 (135 worldwide citation)

In the travel control method in the mobile robot system including a plurality of mobile robots and the control station for controlling these mobile robot, the control station directs one of a plurality of mobile robots to the destination robot, responding to the direction, searches the route to the ...


7
Fujii Tomoji, Okamura Shigeru, Higuchi Tsutomu, Akagawa Masatoshi, Nishiguchi Aiko: Semiconductor device and its manufacture. Shinko Electric, January 30, 2001: JP2001-028036 (126 worldwide citation)

PROBLEM TO BE SOLVED: To provide a small-sized semiconductor device equipped with a communication antenna and to use it for various purposes.SOLUTION: The semiconductor device has its antenna for signal transmission and reception connected electrically to a semiconductor element 40; and an antenna s ...


8
Naohiro Mashino, Mitsutoshi Higashi: Semiconductor device and method of production of same. Shinko Electric, Staas & Halsey, March 9, 2004: US06703310 (115 worldwide citation)

A semiconductor device, enabling reliable electrical connection of a main electrode pad with an interconnection pattern without separate provision of a via use electrode pad in addition to the existing main electrode pad, provided with a silicon substrate (semiconductor substrate), an electronic ele ...


9
Yoshihiro Yoneda: Flip-chip mount board and flip-chip mount structure with improved mounting reliability. Shinko Electric, Staas & Halsey, May 8, 2001: US06229711 (108 worldwide citation)

A flip-chip mount board includes a circuit board provided with a plurality of conductor patterns to which a plurality of bumps provided on an electronic component can be connected via a connection medium provided on the conductor patterns. The conductor pattern includes at least one wiring pattern a ...


10
Yuji Nishikawa, Masanori Onishi: Travel control method, travel control device, and mobile robot for mobile robot systems. Shinko Electric, Spensley Horn Jubas & Lubitz, January 12, 1993: US05179329 (95 worldwide citation)

A plurality of mobile robots forming part of a travel control system are controlled by a travel control station. The travel control station directs each of the mobile robots to a destination where it performs selected operations. The robot, in response to instructions from the travel control station ...



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