1
Blaine G Lowthorp: Tactile touch switch panel. Sheldahl, Orrin M Haugen, Thomas J Nikolai, November 28, 1978: US04127752 (193 worldwide citation)

A touch panel diaphragm-type switch array providing improved tactile feedback. A rigid substrate having a printed circuit conductor pattern thereon, with the pattern defining a plurality of switch locations, each including first and second separate electrical contacts is provided and superimposed th ...


2
Jahn J Stopperan: Rigid-flex board with anisotropic interconnect and method of manufacture. Sheldahl, Merchant Gould Smith Edell Welter & Schmidt, June 27, 1995: US05428190 (149 worldwide citation)

A multilayer rigid-flex circuit board having two or more conductive layers, with at least one rigid circuit board electrically connected to at least one flexible jumper connector or intercircuit connector circuit board, is disclosed. A conductive layer of each of the rigid circuit boards is connecte ...


3
Brent N Sweitzer: Method for interconnecting a flip chip to a printed circuit substrate. Sheldahl, Merchant Gould Smith Edell Welter & Schmidt P A, April 1, 1997: US05615477 (128 worldwide citation)

A printed circuit assembly and a method of manufacturing therefor are provided for directly connecting unpackaged integrated circuit chips such as flip chips to a footprint of active contact pads on a printed circuit substrate. A reduction in packaging density is obtained by electrically interconnec ...


4
Jahn J Stopperan: Printed circuit assembly with fine pitch flexible printed circuit overlay mounted to printed circuit board. Sheldahl, Merchant Gould Smith Edell Welter & Schmidt P A, February 17, 1998: US05719749 (111 worldwide citation)

A printed circuit assembly includes a fine pitch flexible printed circuit overlay bonded to a normal pitch printed circuit board. The fine pitch flexible printed circuit overlay may provide increased packaging density, direct chip attachment and/or complex routing with a minimal cost impact on the o ...


5
Keith L Casson, Kelly D Habeck, Eugene T Selbitschka: Direct application of unpackaged integrated circuit to flexible printed circuit. Sheldahl, Merchant Gould Smith Edell Welter & Schmidt, November 16, 1993: US05261593 (104 worldwide citation)

A method is described for electrically connecting flip chips to a flexible printed circuit substrate. The method comprises (1) providing solder paste to a plurality of active contact pads located on the flexible printed circuit substrate, (2) placing the flip chips on the substrate such that solder ...


6
Keith L Casson, Carol Myers, Kenneth B Gilleo, Deanna Suilmann, Edward Mahagnoul, Marion Tibesar: Method for electrically and mechanically connecting at least two conductive layers. Sheldahl, Merchant Gould Smith Edell Welter & Schmidt, April 2, 1996: US05502889 (85 worldwide citation)

A multilayer circuit board having three or more conductive layers, with at least two conductive layers electrically and mechanically connected by an interconnecting adhesive layer, is disclosed. The interconnecting adhesive layer comprises a conductive adhesive material having a plurality of deforma ...


7
David A Anderson, Carol R Myers, Matthew J Saari: Flexible multilayer printed circuit boards and methods of manufacture. Sheldahl, Merchant Gould Smith Edell Welter & Schmidt, June 18, 1996: US05527998 (81 worldwide citation)

Flexible multilayer printed circuit boards are disclosed which utilize adhesiveless laminates interconnected in a generally superposed relationship by a conductive adhesive. In one embodiment, the adhesiveless laminates have relatively thin conductive layers and metallized through holes which exhibi ...


8
Jay Desai: Rigid flex printed circuit configuration. Sheldahl, Haugen and Nikolai, April 2, 1991: US05004639 (70 worldwide citation)

A process for fabricating a multi-layer flex and rigid-flex board and the board disclosed which substantially reduces the amount of expansion in the direction perpendicular to the plane of the board which occurs between laminated pattern circuit layers in a manner that substantially reduces the tend ...


9
Keith L Casson, Carol Myers, Kenneth B Gilleo, Deanna Suilmann, Edward Mahagnoul, Marion Tibesar: Multilayer electronic circuit having a conductive adhesive. Sheldahl, Merchant Gould Smith Edell Welter & Schmidt P A, November 18, 1997: US05688584 (62 worldwide citation)

A multilayer circuit board having three or more conductive layers, with at least two conductive layers electrically and mechanically connected by an interconnecting adhesive layer, is disclosed. The interconnecting adhesive layer comprises a conductive adhesive material having a plurality of deforma ...


10
Frederick W LaMarche: Composite top membrane for flat panel switch arrays. Sheldahl, Orrin M Haugen, Thomas J Nikolai, March 24, 1981: US04258096 (55 worldwide citation)

A composite top membrane designed for use with membrane-type switch arrays which is substantially smooth and ripple free. The composite membrane comprises: