1
Kyung Tae Kim, Bong Girl Min: Light emitting diode package. Samsung Electro-Mechanics, McDermott Will & Emery, May 4, 2010: US07709857 (267 worldwide citation)

Provided is a light emitting diode package in accordance with the present invention including a lead frame composed of at least a pair of lead terminals; a mold receiving a part of the lead frame therein and equipped with an irradiation window opened to radiate light, and further including one or mo ...


2
Young Suk Han, Sung Wook Kim, Suk Kil Yoon: Nitride semiconductor light emitting device and method for manufacturing the same. Samsung Electro-Mechanics, Lowe Hauptman Ham & Berner, January 15, 2008: US07319044 (248 worldwide citation)

A nitride semiconductor light emitting device includes a substrate, an n-type nitride semiconductor layer formed on the substrate and provided with an electrode region of a predetermined area adjacent to a center of one lateral side of the top surface of the substrate, an n-type electrode formed on ...


3
Young Suk Han, Sung Wook Kim, Suk Kil Yoon: Nitride semiconductor light emitting device and method for manufacturing the same. Samsung Electro-Mechanics, Lowe Hauptman & Berner, December 26, 2006: US07154124 (241 worldwide citation)

A nitride semiconductor light emitting device includes a substrate, an n-type nitride semiconductor layer formed on the substrate and provided with an electrode region of a predetermined area adjacent to a center of one lateral side of the top surface of the substrate, an n-type electrode formed on ...


4
Seong Yeon Han, Seon Goo Lee, Chang Ho Song, Jung Kyu Park, Young Sam Park, Kyung Taeg Han: Light emitting diode package with diffuser and method of manufacturing the same. Samsung Electro-Mechanics, McDermott Will & Emery, March 10, 2009: US07501656 (237 worldwide citation)

The invention relates to an LED package for facilitating color mixing using a diffuser and a manufacturing method of the same. The LED package includes a substrate with an electrode formed thereon, and an LED chip mounted on the substrate. The LED package also includes an encapsulant applied around ...


5
Sun Woon Kim, Dong Hyun Cho, Je Won Kim, Kyu Han Lee, Jeong Tak Oh, Dong Joon Kim: Nitride based semiconductor device. Samsung Electro-Mechanics, Volpe And Koenig PC, August 1, 2006: US07084420 (237 worldwide citation)

The present invention provides a nitride based semiconductor device comprising an active layer having a quantum well layer and a quantum barrier layer, wherein the device includes an electron emitting layer formed of at least two repeats of a first nitride semiconductor layer and a second nitride se ...


6
Kyung Sub Song, Jong Pil Cheon: Light emission diode package. Samsung Electro-Mechanics, Lowe Hauptman Gilman & Berner, March 16, 2004: US06707069 (147 worldwide citation)

An LED package, made of ceramic substrates and having a reflective metal plate, has a first ceramic substrate, which has a chip mounting area on its top surface, and is provided with a predetermined conductive pattern formed around the chip mounting area. One or more LED chips are seated on the chip ...


7
Ci moo Song, Chul woo Lee, Han ki Cho: Mirror driving method and apparatus of micro-mirror array. Samsung Electro-Mechanics, Burns Doane Swecker & Mathis L, May 5, 1998: US05748172 (138 worldwide citation)

In a mirror driving method of a micro-mirror array and an apparatus thereof, each of a plurality of mirrors is pivotally supported by hinges fixed to a substrate, and a permanent magnet is attached beneath the substrate to form a magnetic field about the mirrors. A coiled conductive layer is formed ...


8
Yong Tae Kim: Flat type vibration motor. Samsung Electro-Mechanics, Ladas & Parry, July 24, 2012: US08227946 (126 worldwide citation)

There is provided a flat type vibration motor 100 that includes a bracket 150 with a shaft 140 of which one end is inserted into and fixed to the center thereof, a printed circuit board 110 having a terminal portion 130 receiving external electricity and disposed on the side of the bracket 150, a st ...


9
Sang Hoon Hwang, Kyung Joon Han, Tah Joon Park: Wireless power transmission system and method of controlling the same. Samsung Electro-Mechanics, NSIP Law, November 3, 2015: US09178389 (115 worldwide citation)

Disclosed herein is a wireless power transmission system, including: a transmission unit generating and transmitting power for charging a battery; a reception unit receiving the transmitted power and charging the battery with power; and a transmission control unit detecting a charging status of the ...


10
Sung Ho Lim: Asymmetrical duty cycle flyback converter. Samsung Electro-Mechanics, Ladas & Parry, September 28, 1999: US05959850 (114 worldwide citation)

An asymmetrical duty cycle flyback converter comprising a main transformer for transforming an input voltage at a desired ratio, the main transformer including a primary winding connected to an input stage and a secondary winding connected to an output stage, a switching circuit for switching the in ...