1
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Donald V Perino, Sayeh Khalili: Redistributed bond pads in stacked integrated circuit die package. Rambus, Pennie & Edmonds, April 23, 2002: US06376904 (140 worldwide citation)

A semiconductor module having a first integrated circuit die having a planar surface. The first integrated circuit die has a first conductive pad disposed substantially on the planar surface and a redistributed conductive pad electrically connected to the first conductive pad. The redistributed cond ...


2
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Sayeh Khalili, Donald R Mullen, Nader Gamini: Multi-channel memory architecture. Rambus, Lee & Hayes PLLC, February 8, 2005: US06853557 (118 worldwide citation)

A memory architecture includes a first substrate containing multiple memory devices and a first channel portion extending across the first substrate. The architecture further includes a second substrate containing multiple memory devices and a second channel portion extending across the second subst ...


3
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba: Semiconductor module with imbedded heat spreader. Rambus, Pennie & Edmonds, September 10, 2002: US06449159 (117 worldwide citation)

The invention provides a semiconductor module comprising a heat spreader, at least two semiconductors thermally coupled to the heat spreader, and a plurality of electrically conductive leads electrically connected to the semiconductors. The leads may form part of a flexible circuit at least partiall ...


4
Belgacem Haba Belgacem (Bel) Haba
Haba Belgacem: Semiconductor module with serial bus connection to multiple dies. Rambus, Morgan Lewis & Bockius, December 21, 2004: US06833984 (113 worldwide citation)

A semiconductor module is provided which includes a beat spreader, at least two semiconductors thermally coupled to the heat spreader, and a plurality of electrically conductive leads electrically connected to the semiconductors. At least one of the electrically conductive leads is common to both of ...


5
Belgacem Haba Belgacem (Bel) Haba
Ravindranath T Kollipara, David Nguyen, Belgacem Haba: Clock routing in multiple channel modules and bus systems. Rambus, Lee & Hayes PLLC, July 8, 2003: US06590781 (54 worldwide citation)

An apparatus is provided, which includes a memory interface circuit, a clock signal generating circuit, and a plurality of memory circuits. The memory circuits are operatively coupled and arranged in an order on a plurality of memory modules, such that the memory module positioned at the beginning o ...


6
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Richard E Perego, David Nguyen, Billy W Garrett Jr, Ely Tsern, Craig E Hampel, Wai Yeung Yip: Multiple channel modules and bus systems using same. Rambus, July 20, 2004: US06765800 (46 worldwide citation)

Various module structures are disclosed which may be used to implement modules having 1 to N channels. Bus systems may be formed by the interconnection of such modules.


7
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Donald V Perino, Sayeh Khalili: Redistributed bond pads in stacked integrated circuit die package. Rambus, Pennie & Edmonds, February 4, 2003: US06514794 (46 worldwide citation)

A semiconductor module having a first integrated circuit die having a planar surface. The first integrated circuit die has a first conductive pad disposed substantially on the planar surface and a redistributed conductive pad electrically connected to the first conductive pad. The redistributed cond ...


8
Belgacem Haba Belgacem (Bel) Haba
Donald V Perino, Belgacem Haba, Sayeh Khalili: Multiple channel modules and bus systems using same. Rambus, April 8, 2003: US06545875 (41 worldwide citation)

Various module structures are disclosed which may be used to implement modules having 1 to N channels. Bus systems may be formed by the interconnection of such modules.


9
Belgacem Haba Belgacem (Bel) Haba
Donald V Perino, Belgacem Haba, Sayeh Khalili: Multiple channel modules and bus systems using same. Rambus, Pennie & Edmonds, December 2, 2003: US06657871 (40 worldwide citation)

Various module structures are disclosed which may be used to implement modules having 1 to N channels. Bus systems may be formed by the interconnection of such modules.


10
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Richard E Perego, David Nguyen, Billy W Garrett Jr, Ely Tsern, Craig E Hampel, Wai Yeung Yip: Multiple channel modules and bus systems using same. Rambus, Hunton & Williams, May 24, 2005: US06898085 (37 worldwide citation)

Various module structures are disclosed which may be used to implement modules having 1 to N channels. Bus systems may be formed by the interconnection of such modules.