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Shyam Venkataraman
LI Yuzhuo, VENKATARAMAN Shyam Sundar, PINDER Harvey Wayne: PROCÉDÉ DE POLISSAGE MÉCANO-CHIMIQUE DE SUBSTRATS CONTENANT DES FILMS DIÉLECTRIQUES DOXYDE DE SILICIUM ET DES FILMS DE POLYSILICIUM ET/OU DE NITRURE DE SILICIUM, PROCESS FOR CHEMICALLY MECHANICALLY POLISHING SUBSTRATES CONTAINING SILICON OXIDE DIELECTRIC FILMS AND POLYSILICON AND/OR SILICON NITRIDE FILMS. BASF SE, LI Yuzhuo, VENKATARAMAN Shyam Sundar, PINDER Harvey Wayne, BASF, March 15, 2012: WO/2012/032467

CMP process for substrates containing silicon oxide dielectric films and polysilicon and/or silicon nitride films comprising the steps of (1 ) contacting the substrate with an aqueous composition containing (A) abrasive particles which are positively charged when dispersed in an aqueous medium havin ...


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