1
Phan Khoi A, Rangarajan Bharath, Singh Bhanwar, Subramanian Ramkumar: Refractive index system monitor and control for immersion lithography. Advanced Micro Devices, Phan Khoi A, Rangarajan Bharath, Singh Bhanwar, Subramanian Ramkumar, COLLOPY Daniel R, March 3, 2005: WO/2005/019935 (355 worldwide citation)

A system and/or method are disclosed for measuring (250) and/or controlling (260) refractive index (n) and/or lithographic constant (k) of an immersion medium (210) utilized in connection with immersion lithography. A known grating structure (602) is built upon a substrate (220). A refractive index ...


2
Subramanian Ramkumar, Singh Bhanwar, Phan Khoi A: Use of supercritical fluid to dry wafer and clean lens in immersion lithography. Advanced Micro Devices, Spansion, Subramanian Ramkumar, Singh Bhanwar, Phan Khoi A, DRAKE Paul S, January 11, 2007: WO/2007/005362 (12 worldwide citation)

Disclosed are immersion lithography methods and systems involving irradiating a photoresist through a lens and an immersion liquid of an immersion lithography tool, the immersion liquid in an immersion space contacting the lens and the photoresist; removing the immersion liquid from the immersion sp ...


3
Phan Khoi A, Rangarajan Bharath, Singh Bhanwar: Multi-layer overlay measurement and correction technique for ic manufacturing. Advanced Micro Devices, Phan Khoi A, Rangarajan Bharath, Singh Bhanwar, DRAKE Paul S, September 15, 2005: WO/2005/086223

A system facilitating measurement and correction of overlay between multiple layers of a wafer (402) is disclosed. The system comprises an overlay target (406) that represents overlay between three or more layers of a wafer (402) and a measurement component (408) that determines overlay error existe ...


4
Phan Khoi A, Rangarajan Bharath, Singh Bhanwar: Pattern recognition and metrology structure for an x-initiative layout design. Advanced Micro Devices, Phan Khoi A, Rangarajan Bharath, Singh Bhanwar, COLLOPY Daniel R, March 10, 2005: WO/2005/022269

The present invention relates to inspection methods and systems utilized to provide a best means for inspection of a wafer (900, 1250). The methods and systems include wafer-to-reticle alignment, layer-to-layer alignment and wafer surface feature inspection. The wafer (900, 1250)-to-reticle (1226) a ...



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