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Ivo Koutsaroff 掘露 伊保龍
Koutsaroff Ivoyl P, Vandermeulen Mark, Cervin Lawry Andrew, Patel Atin J: Multi-level thin film capacitor on a ceramic substrate and method of manufacturing the same. Gennum Corporation, Koutsaroff Ivoyl P, Vandermeulen Mark, Cervin Lawry Andrew, Patel Atin J, PERRY Stephen J, June 9, 2005: WO/2005/053026

In accordance with the teachings described herein, a multi-level thin film capacitor on a ceramic substrate and method of manufacturing the same are provided. The multi-level thin film capacitor (MLC) may include at least one high permittivity dielectric layer between at least two electrode layers, ...


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Hawke Robert E, Patel Atin J, Binapal Sukhminder S, Divita Charles, Mcneil Lynn, Fletcher Thomas G: Three-dimensional packaging configuration for multi-chip module assembly. Gennum Corporation, Hawke Robert E, Patel Atin J, Binapal Sukhminder S, Divita Charles, Mcneil Lynn, Fletcher Thomas G, BERESKIN 40th floor40 King Street WestToronto Ontario M5H 3Y2, April 22, 1999: WO/1999/019911

A muti-chip module (MCM) assembly has three stacked integrated circuit (IC) layers. The first IC layer is electrically flip-chip connected to a substrate. The back of the second IC layer may be glued to the back of the first IC layer, and the second and third IC layers are electrically flip-chip con ...