1
Koji Taniguchi, Hiroyuki Tada, Junichi Sato, Takao Yamaguchi: Content processing apparatus and content display apparatus based on location information. Panasonic Corporation, Greenblum & Bernstein, December 9, 2008: US07461528 (138 worldwide citation)

The present invention receives list content providing location conditions in a list organized by location conditions in which a reference destination of location-dependent content, being content assigned correspondence to geographical location information, is compiled for each location condition, se ...


2
Philippe Morin, David Kryze, Luca Rigazio, Peter Veprek: Virtual keypad systems and methods. Panasonic Corporation, Harness Dickey & Pierce, November 22, 2011: US08065624 (112 worldwide citation)

Accordingly, a virtual keypad system for inputting text is provided. A virtual keypad system includes a remote controller having at least one touchpad incorporated therein and divided into a plurality of touch zones. A display device is in data communication with the remote controller and is operabl ...


3
Kiyoshi Arita, Hiroshi Haji: Method for fabricating semiconductor chip. Panasonic Corporation, Pearne & Gordon, August 3, 2010: US07767551 (108 worldwide citation)

After a film layer 6 formed from a die attach film 4 and a UV tape 5 has been provided as a mask on a semiconductor wafer 1, boundary trenches 7 for partitioning semiconductor elements 2 formed on a circuit pattern formation surface 1a are formed in the film layer 6, thereby making a surface 1c of a ...


4
Kiyoshi Arita, Atsushi Harikai: Method of manufacturing semiconductor chip using laser light and plasma dicing. Panasonic Corporation, Pearne & Gordon, March 15, 2011: US07906410 (106 worldwide citation)

In a method in which a semiconductor wafer 1 having integrated circuits 3 formed in a plurality of chip regions and test patterns 4 formed in scribe lines 2a is divided by a plasma etching process so as to manufacture individual semiconductor chips, in the semiconductor wafer 1, a protection sheet 5 ...


5
Osamu Kusumoto, Makoto Kitabatake, Kunimasa Takahashi, Kenya Yamashita, Ryoko Miyanaga, Masao Uchida: Semiconductor device and method for manufacturing same. Panasonic Corporation, McDermott Will & Emery, March 24, 2009: US07507999 (105 worldwide citation)

An accumulation-mode MISFET comprises: a high-resistance SiC layer 102 epitaxially grown on a SiC substrate 101; a well region 103; an accumulation channel layer 104 having a multiple δ-doped layer formed on the surface region of the well region 103; a contact region 105; a gate insulating film 108; ...


6
Satoshi Shida, Shinji Kanayama, Shunji Onobori, Shuichi Hirata, Mamoru Nakao, Kunio Oe, Akira Kugihara, Shoriki Narita, Yoshitaka Etoh, Hiroshi Haji: Component mounting apparatus. Panasonic Corporation, Wenderoth Lind & Ponack L, September 21, 2010: US07797820 (105 worldwide citation)

In component mounting process for a plurality of components to be mounted onto a board, a plurality of bump electrode portions formed on mounting-side surfaces of the components to be mounted onto the board are brought into contact with a bonding-assistant agent so that the bonding-assistant agent i ...


7
Hiroshi Haji, Kiyoshi Arita, Teruaki Nishinaka: Manufacturing method for semiconductor devices, and formation apparatus for semiconductor wafer dicing masks. Panasonic Corporation, Wenderoth Lind & Ponack L, December 8, 2009: US07629228 (103 worldwide citation)

On a mask placement-side surface of a semiconductor wafer in which a plurality of semiconductor devices are formed, a mask is placed, while dicing lines for dicing the semiconductor wafer into the respective separate semiconductor devices are defined and a surface of a flawed semiconductor device am ...


8
Kiyoshi Arita, Akira Nakagawa: TEG removing method in manufacturing method for semiconductor chips. Panasonic Corporation, Wenderoth Lind & Ponack L, March 16, 2010: US07678670 (101 worldwide citation)

A semiconductor chip manufacturing process includes sticking a protective sheet onto a first surface of a semiconductor wafer so that the sheet comes in contact with the TEG, placing a mask on a second surface that is a surface opposite from the first surface, performing plasma etching on the second ...


9
Kakuya Yamamoto, Hideaki Nakaoka: Display apparatus and method for hands free operation that selects a function when window is within field of view. Panasonic Corporation, Wenderoth Lind & Ponack L, April 19, 2011: US07928926 (100 worldwide citation)

The present invention provides a display apparatus which enables high-accuracy, hands-free operation, while adopting a low-cost configuration. The display apparatus according to the present invention includes: an obtainment unit that obtains a display element which is information to be displayed to ...


10
Nobutaka Kodama, Hisao Koga: Power-line carrier communication apparatus. Panasonic Corporation, Dickinson Wright PLLC, December 6, 2011: US08072323 (99 worldwide citation)

The invention provides a power-line carrier communication apparatus including a transmission unit with a signal point mapping device for mapping a plurality of bit streams produced from transmission data, a wavelet inverse transforming device for modulating the respective sub-carriers by wavelet wav ...



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