1
Koji Taniguchi, Hiroyuki Tada, Junichi Sato, Takao Yamaguchi: Content processing apparatus and content display apparatus based on location information. Panasonic Corporation, Greenblum & Bernstein, December 9, 2008: US07461528 (121 worldwide citation)

The present invention receives list content providing location conditions in a list organized by location conditions in which a reference destination of location-dependent content, being content assigned correspondence to geographical location information, is compiled for each location condition, se ...


2
Kiyoshi Arita, Hiroshi Haji: Method for fabricating semiconductor chip. Panasonic Corporation, Pearne & Gordon, August 3, 2010: US07767551 (93 worldwide citation)

After a film layer 6 formed from a die attach film 4 and a UV tape 5 has been provided as a mask on a semiconductor wafer 1, boundary trenches 7 for partitioning semiconductor elements 2 formed on a circuit pattern formation surface 1a are formed in the film layer 6, thereby making a surface 1c of a ...


3
Kiyoshi Arita, Atsushi Harikai: Method of manufacturing semiconductor chip using laser light and plasma dicing. Panasonic Corporation, Pearne & Gordon, March 15, 2011: US07906410 (93 worldwide citation)

In a method in which a semiconductor wafer 1 having integrated circuits 3 formed in a plurality of chip regions and test patterns 4 formed in scribe lines 2a is divided by a plasma etching process so as to manufacture individual semiconductor chips, in the semiconductor wafer 1, a protection sheet 5 ...


4
Hiroshi Haji, Kiyoshi Arita, Teruaki Nishinaka: Manufacturing method for semiconductor devices, and formation apparatus for semiconductor wafer dicing masks. Panasonic Corporation, Wenderoth Lind & Ponack L, December 8, 2009: US07629228 (90 worldwide citation)

On a mask placement-side surface of a semiconductor wafer in which a plurality of semiconductor devices are formed, a mask is placed, while dicing lines for dicing the semiconductor wafer into the respective separate semiconductor devices are defined and a surface of a flawed semiconductor device am ...


5
Kiyoshi Arita, Akira Nakagawa: TEG removing method in manufacturing method for semiconductor chips. Panasonic Corporation, Wenderoth Lind & Ponack L, March 16, 2010: US07678670 (89 worldwide citation)

A semiconductor chip manufacturing process includes sticking a protective sheet onto a first surface of a semiconductor wafer so that the sheet comes in contact with the TEG, placing a mask on a second surface that is a surface opposite from the first surface, performing plasma etching on the second ...


6
Philippe Morin, David Kryze, Luca Rigazio, Peter Veprek: Virtual keypad systems and methods. Panasonic Corporation, Harness Dickey & Pierce, November 22, 2011: US08065624 (88 worldwide citation)

Accordingly, a virtual keypad system for inputting text is provided. A virtual keypad system includes a remote controller having at least one touchpad incorporated therein and divided into a plurality of touch zones. A display device is in data communication with the remote controller and is operabl ...


7
Osamu Kusumoto, Makoto Kitabatake, Kunimasa Takahashi, Kenya Yamashita, Ryoko Miyanaga, Masao Uchida: Semiconductor device and method for manufacturing same. Panasonic Corporation, McDermott Will & Emery, March 24, 2009: US07507999 (87 worldwide citation)

An accumulation-mode MISFET comprises: a high-resistance SiC layer 102 epitaxially grown on a SiC substrate 101; a well region 103; an accumulation channel layer 104 having a multiple δ-doped layer formed on the surface region of the well region 103; a contact region 105; a gate insulating film 108; ...


8
Yoshio Urabe, Kenji Miyanaga, Kazuhiro Ando, Chalermphol Apichaichalermwongse, Tsutomu Mukai: Wireless communication apparatus and wireless communication method. Panasonic Corporation, Wenderoth Lind & Ponack L, May 13, 2014: US08724524 (81 worldwide citation)

When communicating with a second wireless station, a first wireless station judges, based on link-related information received from the second wireless station and link-related information extracted from a signal transmitted by a fourth wireless station, whether a transmission link from the third wi ...


9
Tetsuzo Ueda, Daisuke Ueda: Method for dividing substrate. Panasonic Corporation, Greenblum & Bernstein, December 2, 2008: US07459377 (81 worldwide citation)

The present invention aims at providing a method for dividing a substrate that is capable of dividing each substrate into chips in the same square-like form without causing chip breaking and capable of forming all cleaved facets flat. In the method for dividing a substrate of the present invention, ...


10
Sou Tamura: Portable information terminal device. Panasonic Corporation, McDermott Will & Emery, December 2, 2008: US07460108 (81 worldwide citation)

In the portable information terminal device 1a, when a second display portion 9 is flipped over to the front of the portable information terminal device 1a, a first display portion 3 and the second display portion 9 are visible from a user at the same time. The display layouts of the first display p ...



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