1
Tadatomo Suga: Interconnect structure for stacked semiconductor device. Oki Electric, Sanyo Electric, Sony Corporation, Kabushiki Kaisha Toshiba, NEC Corporation, Sharp Kabushiki Kaisha, Hitachi, Fujitsu, Matsushita Electronics Corporation, Mitsubishi Denki Kabushiki Kaisha, Rohm, Sonnenschein Nath & Rosenthal, October 15, 2002: US06465892 (280 worldwide citation)

In a multi-layer interconnection structure, the wiring length is to be reduced, and the interconnection is to be straightened, at the same time as measures need to be taken against radiation noise. To this end, there is disclosed a semiconductor device in which plural semiconductor substrates, each ...


2
Tadatomo Suga: Method for manufacturing an interconnect structure for stacked semiconductor device. Oki Electric, Sanyo Electric, Sony Corporation, Kabushiki Kaisha Toshiba, NEC Corporation, Sharp Kabushiki Kaisha, Hitachi, Fujitsu, Matsushita Electronics Corporation, Mitsubishi Denki Kabushiki Kaisha, Rohm, Sonnenschein Nath & Rosenthal, October 29, 2002: US06472293 (263 worldwide citation)

In a multi-layer interconnection structure, the wiring length is to be reduced, and the interconnection is to be straightened, at the same time as measures need to be taken against radiation noise. To this end, there is disclosed a semiconductor device in which plural semiconductor substrates, each ...


3
Toru Mori: Transaction processing system. Oki Electric, Spencer & Frank, October 31, 1989: US04877947 (226 worldwide citation)

A transaction processing system using a prepaid microchip card includes a customer's microchip card reader/writer for communicating with a customer's microchip card in which a balance is recorded, and a vendor's microchip card reader/writer that can be electrically coupled to the customer's microchi ...


4
Tadashi Yamaguchi: Semiconductor device having a particular conductive lead structure. Oki Electric, Edward D Manzo, October 20, 1992: US05157475 (190 worldwide citation)

A thin semiconductor device comprises a die pad (52) having a first thickness, a semiconductor chip (51) mounted on the die pad (52), a plurality of conductive leads (54) each having at least a portion having a second thickness greater than the first thickness, and conductors (53) interconnecting th ...


5
Takaaki Sasaki: Semiconductor package for three-dimensional mounting, fabrication method thereof, and semiconductor device. Oki Electric, Rabin & Berdo PC, May 25, 2004: US06740964 (186 worldwide citation)

A semiconductor package for three-dimensional mounting is provided. The package includes a wiring substrate having a first surface on which a first wiring pattern is formed and a second surface on which a second wiring pattern is formed, the first wiring pattern and second wiring pattern being elect ...


6
Junichi Nishizawa, Hitoshi Abe, Soubei Suzuki: Process for forming a thin film of silicon. Research Development Corporation of Japan, Junichi Nishizawa, Oki Electric, Soubei Suzuki, Darby & Darby, March 15, 1994: US05294286 (176 worldwide citation)

The thickness of a thin film of an element semiconductor may be determined by counting the number of cycles of gaseous component introductions within a crystal growth vessel. Each cycle permits at most one monolayer of growth since the pressure in the vessel during gaseous component introduction is ...


7
Jie Yi: Speech recognition method and system using triphones, diphones, and phonemes. Oki Electric, Edward D Manzo, Ted K Ringsred, March 26, 1996: US05502790 (167 worldwide citation)

A speech recognition system starts by training hidden Markov models for all triphones, diphones, and phonemes occurring in a small training vocabulary. Hidden Markov models of a target vocabulary are created by concatenating the triphone, diphone, and phoneme models, using triphone models if availab ...


8
Shinji Ohuchi, Yasushi Shiraishi, Hiroshi Kawano, Etsuo Yamada: Semiconductor device, manufacturing method thereof and aggregate type semiconductor device. Oki Electric, Rabin & Champagne P C, March 27, 2001: US06208021 (162 worldwide citation)

A resin sealing type semiconductor device, a manufacturing method thereof and a packaging structure thereof are capable of downsizing the semiconductor device and attaining high-density packaging. For this, the resin sealing type semiconductor device with leads exposed in an outer surface, is provid ...


9
Michael J Barnaby, Abe Mammen: Priority encoding and decoding for memory architecture. OKI Electric Industry Co, Rabin & Champagne P C, December 21, 1999: US06006303 (151 worldwide citation)

A shared resource access priority encoding/decoding and arbitration scheme takes into account varying device requirements, including latency, bandwidth and throughput. These requirements are stored and are dynamically updated based on changing access demand conditions.


10
Shinya Kamagami, Takashi Yajima, Ienobu Takizawa: Apparatus for and method of discriminating bill. Oki Electric, Spencer Frank & Schneider, April 6, 1993: US05199543 (147 worldwide citation)

A bill discriminating device includes sensor circuitry for scanning and reading all the printed patterns of a bill to be discriminated and producing discriminated data including bill scale data, the bill scale data representing the density of the printed patterns. A data storage memory stores the di ...