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Hideaki Taki, Wataru Kimura, Noritaka Yoshida, Naohito Sato, Mitsugu Onoda, Hiroyuki Kawaji: Ultrasonic transducer which is either crimped or welded during assembly. NGK Spark Plug, Sughrue Mion PLLC, January 25, 2011: US07876030 (106 worldwide citation)

An ultrasonic transducer includes: piezoelectric elements; a pair of clamping members which clamp said piezoelectric elements; and a cover member which is crimped to at least one of said pair of clamping members in a state where said cover member cooperates with said pair of clamping members to surr ...


2
Kouki Ogawa, Eiji Kodera: Capacitor-built-in type printed wiring substrate, printed wiring substrate, and capacitor. NGK Spark Plug, Sughrue Mion PLLC, October 4, 2005: US06952049 (85 worldwide citation)

A capacitor-built-in-type printed wiring substrate which can reliably eliminate noise and attain extremely low resistance and low inductance in connections between an IC chip and the capacitor, and a printed wiring substrate and capacitor for use in the same. A capacitor-built-in-type printed wiring ...


3
Yoichiro Mizutani, Takenori Sawamura, Masateru Hattori, Masahiko Okuyama: Method of preparing and extruding a chemical agent using a kneader and chemical-agent extrusion assisting tool. NGK Spark Plug, Sughrue Mion PLLC, August 13, 2002: US06431743 (84 worldwide citation)

An assisting tool for pressing a piston while fixing in place a syringe or a similar instrument which contains a highly viscous chemical agent, so as to extrude the chemical agent, as well as a method for extruding a chemical agent using the same. The chemical-agent extrusion assisting-tool includes ...


4
Hideshi Matsubara, Motohiko Itai, Kazuo Kimura: Printed circuit board. NGK Spark Plug, Larson & Taylor, June 3, 2003: US06573458 (84 worldwide citation)

A printed circuit board includes a number of ball-shaped terminals provided on one main surface of the board. Each of the ball-shaped terminals includes a metallic ball brazed on a pad provided on the main surface of the board. A thin gold layer is deposited by plating on the surface of the metallic ...


5
Tetsusyo Yamada: Oxygen sensor. NGK Spark Plug, Fleit Jacobson Cohn & Price, March 19, 1985: US04505807 (71 worldwide citation)

The disclosed oxygen sensor includes three plate-like elements disposed in parallel and a heater, i.e., an oxygen pump element with electrodes and said heater disposed adjacent thereto, an oxygen concentration cell element with electrodes, and an insulating board disposed between the first two eleme ...


6
Katsutoshi Bekki, Kiyoshi Shinjo: Artificial joint. NGK Spark Plug, Finnegan Henderson Farabow Garrett and Dunner, March 3, 1992: US05092898 (71 worldwide citation)

An artificial femoral head having outer casing and generally spherical head inserted therein with a plurality of bearings inserted therebetween, permitting rotation with a coefficient of friction substantially equal to that of human cartilage. An artificial hip joint having a cup-shaped socket, capa ...


7
Hideaki Yagi, Junichi Akiyama: Oxygen enriching apparatus, controller, and recording medium. NGK Spark Plug, Sughrue Mion PLLC, July 18, 2006: US07077133 (66 worldwide citation)

A small oxygen enriching apparatus which can supply oxygen-enriched gas at high flow rate without imparting unnatural sensation to a user, as well as a controller and recording medium therefore. In step 100, a judgment is made as to whether a flow rate set by use of a flow-rate setting unit 45 is eq ...


8
Takafumi Oshima, Kozuka Kazuhiko: Rapid heat-dissipating type spark plug for internal combustion engines. NGK Spark Plug, Cooper & Dunham, May 21, 1991: US05017826 (66 worldwide citation)

A rapid heat-dissipating type spark plug has a metallic shell which is made of material having a tensile stress of more than 40 Kg/mm.sup.2 with a thermal conductivity of more than 60 W/m.multidot.k.


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Ryuji Imai, Rokuro Kanbe: Integrated circuit package having a multilayered wiring portion formed on an insulating substrate. NGK Spark Plug, Finnegan Henderson Farabow Garrett & Dunner, November 21, 1995: US05468997 (63 worldwide citation)

An integrated circuit package in which three conductor columns for connecting an insulating substrate and an integrated circuit are connected in parallel for use as I/O vias. Thereby, the conductor columns in a multilayer wiring portion between an integrated circuit and an insulating substrate is pr ...


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