Hideaki Taki, Wataru Kimura, Noritaka Yoshida, Naohito Sato, Mitsugu Onoda, Hiroyuki Kawaji: Ultrasonic transducer which is either crimped or welded during assembly. NGK Spark Plug, Sughrue Mion PLLC, January 25, 2011: US07876030 (106 worldwide citation)

An ultrasonic transducer includes: piezoelectric elements; a pair of clamping members which clamp said piezoelectric elements; and a cover member which is crimped to at least one of said pair of clamping members in a state where said cover member cooperates with said pair of clamping members to surr ...

Kouki Ogawa, Eiji Kodera: Capacitor-built-in type printed wiring substrate, printed wiring substrate, and capacitor. NGK Spark Plug, Sughrue Mion PLLC, October 4, 2005: US06952049 (85 worldwide citation)

A capacitor-built-in-type printed wiring substrate which can reliably eliminate noise and attain extremely low resistance and low inductance in connections between an IC chip and the capacitor, and a printed wiring substrate and capacitor for use in the same. A capacitor-built-in-type printed wiring ...

Yoichiro Mizutani, Takenori Sawamura, Masateru Hattori, Masahiko Okuyama: Method of preparing and extruding a chemical agent using a kneader and chemical-agent extrusion assisting tool. NGK Spark Plug, Sughrue Mion PLLC, August 13, 2002: US06431743 (84 worldwide citation)

An assisting tool for pressing a piston while fixing in place a syringe or a similar instrument which contains a highly viscous chemical agent, so as to extrude the chemical agent, as well as a method for extruding a chemical agent using the same. The chemical-agent extrusion assisting-tool includes ...

Hideshi Matsubara, Motohiko Itai, Kazuo Kimura: Printed circuit board. NGK Spark Plug, Larson & Taylor, June 3, 2003: US06573458 (84 worldwide citation)

A printed circuit board includes a number of ball-shaped terminals provided on one main surface of the board. Each of the ball-shaped terminals includes a metallic ball brazed on a pad provided on the main surface of the board. A thin gold layer is deposited by plating on the surface of the metallic ...

Tetsusyo Yamada: Oxygen sensor. NGK Spark Plug, Fleit Jacobson Cohn & Price, March 19, 1985: US04505807 (71 worldwide citation)

The disclosed oxygen sensor includes three plate-like elements disposed in parallel and a heater, i.e., an oxygen pump element with electrodes and said heater disposed adjacent thereto, an oxygen concentration cell element with electrodes, and an insulating board disposed between the first two eleme ...

Katsutoshi Bekki, Kiyoshi Shinjo: Artificial joint. NGK Spark Plug, Finnegan Henderson Farabow Garrett and Dunner, March 3, 1992: US05092898 (71 worldwide citation)

An artificial femoral head having outer casing and generally spherical head inserted therein with a plurality of bearings inserted therebetween, permitting rotation with a coefficient of friction substantially equal to that of human cartilage. An artificial hip joint having a cup-shaped socket, capa ...

Hideaki Yagi, Junichi Akiyama: Oxygen enriching apparatus, controller, and recording medium. NGK Spark Plug, Sughrue Mion PLLC, July 18, 2006: US07077133 (66 worldwide citation)

A small oxygen enriching apparatus which can supply oxygen-enriched gas at high flow rate without imparting unnatural sensation to a user, as well as a controller and recording medium therefore. In step 100, a judgment is made as to whether a flow rate set by use of a flow-rate setting unit 45 is eq ...

Takafumi Oshima, Kozuka Kazuhiko: Rapid heat-dissipating type spark plug for internal combustion engines. NGK Spark Plug, Cooper & Dunham, May 21, 1991: US05017826 (66 worldwide citation)

A rapid heat-dissipating type spark plug has a metallic shell which is made of material having a tensile stress of more than 40 Kg/mm.sup.2 with a thermal conductivity of more than 60 W/m.multidot.k.

Ryuji Imai, Rokuro Kanbe: Integrated circuit package having a multilayered wiring portion formed on an insulating substrate. NGK Spark Plug, Finnegan Henderson Farabow Garrett & Dunner, November 21, 1995: US05468997 (63 worldwide citation)

An integrated circuit package in which three conductor columns for connecting an insulating substrate and an integrated circuit are connected in parallel for use as I/O vias. Thereby, the conductor columns in a multilayer wiring portion between an integrated circuit and an insulating substrate is pr ...