1
Claude R Baudoin: Interenterprise electronic mail hub. National Semiconductor Corporation, Townsend and Townsend Khourie and Crew, April 11, 1995: US05406557 (460 worldwide citation)

An interenterprise communications center has a computer hub comprising a common core and a plurality of input and output modules. The input modules connect to a first end user and converts a message sent by the first end user into a universal format. The hub core queues the message and forwards it t ...


2
Charle R Rupp: Reconfigurable computer architecture for use in signal processing applications. National Semiconductor Corporation, Limbach & Limbach L, July 21, 1998: US05784636 (288 worldwide citation)

An architecture for information processing devices which allows the construction of low cost, high performance systems for specialized computing applications involving sensor data processing. The reconfigurable processor architecture of the invention uses a programmable logic structure called an Ada ...


3
Hem P Takiar, Peng Cheng Lin, Luu T Nguyen: Stacked multi-chip modules and method of manufacturing. National Semiconductor Corporation, H Donald Nelson, Richard J Roddy, Limbach & Limbach, June 6, 1995: US05422435 (261 worldwide citation)

A circuit assembly which includes a semiconductor die having substantially parallel opposing first and second surfaces and at least one electrical contact mounted on the first surface. A first element having substantially parallel opposing first and second surfaces and at least one electrical contac ...


4
Gordon Force, Timothy D Davis, Richard L Duncan, Thomas M Norcross, Michael J Shay, Timothy A Short: Programmable distributed personal security. National Semiconductor Corporation, July 2, 1996: US05533123 (260 worldwide citation)

The present invention is embodied in a Secured Processing Unit (SPU) chip, a microprocessor designed especially for secure data processing. By integrating keys, encryption/decryption engines and algorithms in the SPU, the entire security process is rendered portable and easily distributed across phy ...


5
John B Riley: Attachment assembly for integrated circuits. National Semiconductor Corporation, John L Maxin, January 5, 1999: US05856911 (244 worldwide citation)

An integrated circuit package has a top die attach area and a bottom heat spreader thermally coupled to the die for conducting heat generated by the die through a thermal interface in the main circuit board to a heat sink or heat pipe mounted underneath the main circuit board. The preferred thermal ...


6
Shahram Mostafazadeh, Joseph O Smith: Plastic package with exposed die. National Semiconductor Corporation, Edward C Kwok, Skjerven Morrill MacPherson Franklin & Friel, April 13, 1999: US05894108 (242 worldwide citation)

A molded plastic package incorporates a lead frame which includes a plurality of leads radially aligned around a central opening. A die is mounted in the central opening and is electrically connected to the leads by wire bonding. A molded plastic casing is formed over the die, wiring and lead frame ...


7
Yuval Shachar, Chaim Bendelac, Reuven Marko: Method for switching between a data communication session and a voice communication session. National Semiconductor Corporation, Limbach & Limbach, June 9, 1998: US05764736 (222 worldwide citation)

Techniques are described for switching from a data session to a voice session, then back to the data session. A "primary" data connection is established between a user's terminal and a communications network, which provides the user terminal with a tag identifying a voice network address (typically ...


8
Jaime Bayan, Peter Howard Spalding: Multi row leadless leadframe package. National Semiconductor Corporation, Beyer Weaver & Thomas, February 19, 2002: US06348726 (204 worldwide citation)

A packaging arrangement is described that utilizes a conductive panel (such as a leadless leadframe) as its base. The conductive panel has a matrix of device areas that each include a plurality of rows of contacts that are located outside of a die area. Tie bars provide support for the various conta ...


9
Sanjay Popli, Scott Pickett, David Hawley, Shankar Moni, Rafael C Camarota: Configuration features in a configurable logic array. National Semiconductor Corporation, Limbach & Limbach, August 9, 1994: US05336950 (200 worldwide citation)

The present invention is directed to various configuration features of a logic array that includes a plurality of individually configurable logic cells arranged in a matrix. These features include reconfiguration logic for reconfiguring logic cells in a selected portion of the matrix using a window- ...


10
Hem P Takiar, Peng Cheng Lin: Stacked multi-chip modules and method of manufacturing. National Semiconductor Corporation, Limbach & Limbach, February 27, 1996: US05495398 (199 worldwide citation)

A circuit assembly which includes a semiconductor die having substantially parallel opposing first and second surfaces and at least one electrical contact mounted on the first surface. A first element having substantially parallel opposing first and second surfaces and at least one electrical contac ...