1
Wei Cheng Ku, Chih Hao Ho, Shu Kan Lin: Cantilever-type probe card for high frequency application. MPI Corporation, Bacon & Thomas PLLC, September 29, 2009: US07595651 (8 worldwide citation)

A cantilever-type probe card includes a circuit board, a grounding block electrically connected to a zero potential, signal probes, and at least one grounding probe connected to the grounding block. Each signal probe has a probing tip, a connection portion affixed to the circuit board, and a front a ...


2
Wei Cheng Ku, Hsin Hung Lin, Chih Hao Ho, Te Chen Feng: High-frequency probe card and transmission line for high-frequency probe card. MPI Corporation, Browdy and Neimark PLLC, March 23, 2010: US07683645 (5 worldwide citation)

A high-frequency probe card includes a circuit board having signal circuits and grounding circuits, transmission lines each having a bi-wire structure including a first lead wire for transmitting high-frequency signal and a second lead wire connected to the grounding circuits, and signal probes. Hig ...


3
Wei Cheng Ku, Chih Hao Ho, Chia Tai Chang, Ho Hui Lin, Chien Ho Lin: Probe for high frequency signal transmission and probe card using the same. MPI Corporation, Browdy and Neimark PLLC, September 7, 2010: US07791359 (5 worldwide citation)

A probe for high frequency signal transmission includes a metal pin, and a metal line spacedly arranged on and electrically insulated from the metal pin and electrically connected to grounding potential so as to maintain the characteristic impedance of the probe upon transmitting high frequency sign ...


4
Chao Ching Huang, Wen Chi Chen, Chiu Chu Chang: Combined probe head for a vertical probe card and method for assembling and aligning the combined probe head thereof. MPI Corporation, Ding Yu Tan, January 13, 2015: US08933719 (4 worldwide citation)

A combined probe head being disposed in a space transformer of a vertical probe card is provided, in which the combined probe head is used for differentiating or segmenting a layout area of the probes in the vertical probe card. The combined probe head may include a locating plate and sub-probe head ...


5
Chih Chung Chen: Electrical contact device of probe card. MPI Corporation, Browdy and Neimark P L L C, August 25, 2009: US07579857 (2 worldwide citation)

An electrical contact device of a probe card includes a base and probes on the base. The base has a top side with a cavity thereon, and the cavity has sidewalls connected to the top side. Anchored portion are provided on the sidewalls of the cavity. Each of the probes has a first end and a second en ...


6
Wei Cheng Ku, Jun Liang Lai: Probe card of low power loss. MPI CORPORATION, Ming Chow, Sinorica, April 19, 2016: US09316685 (1 worldwide citation)

A probe card, which is used to transmit power signals and test signals from a tester to a DUT, includes a pin base, a plurality of signal pins, a signal conducting circuit and at least one power conducting circuit. The signal pins are made of conductive materials, and each contacts the DUT with an e ...


7
Chia Tai Chang, Chin Yi Tsai, Chiu Kuei Chen, Chen Chih Yu, Chien Chang Lai, Chin Tien Yang, Hui Pin Yang, Keng Shieng Chang, Yun Ru Huang: High frequency probe card. MPI CORPORATION, Muncy Geissler Olds & Lowe P C, December 1, 2015: US09201098 (1 worldwide citation)

A high frequency probe card includes at least one substrate having at least one first opening, an interposing plate disposed on the at least one substrate and having at least one second opening corresponding to the at least one first opening, a circuit board disposed on the interposing plate and hav ...


8
Chung Tse Lee, Chien Chou Wu, Yi Ming Chan: Apparatus for probing die electricity and method for forming the same. MPI CORPORATION, Muncy Geissler Olds & Lowe P C, October 13, 2015: US09157929 (1 worldwide citation)

A method of forming an apparatus for probing die electricity, which determines a reinforcement structure according to features of a converting plate, and combines the converting plate, reinforcement structure and a substrate for forming the apparatus for probing die electricity. In an embodiment, th ...


9
Chien Chou Wu, Ming Chi Chen, Chung Che Li: Probing device and manufacturing method thereof. MPI CORPORATION, Ding Yu Tan, January 12, 2016: US09234917 (1 worldwide citation)

A probing device and manufacturing method thereof are provided. The manufacturing method includes first disposing a plurality of space transformers on a reinforcing plate and the space transformer includes several first pads. Then, the space transformer is fixed on the reinforcing plate. Thereafter, ...


10
Ming Chi Chen, Horng Kuang Fan, Mao Fa Shen, Ming Chu Chueh, Bang Shun Liu, Che Wei Lin: Probe head of probe card and manufacturing method of composite board of probe head. MPI Corporation, Ding Yu Tan, August 18, 2015: US09110130 (1 worldwide citation)

A probe head of vertical probe card and a manufacturing method of a composite board thereof are provided. The probe head includes guide plate, composite board, and probe pin. The composite board includes first board layer and second board layer which are laminated together by joining operation. The ...