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David Joseph Bealka, Pedro Henrique Da Costa: Feedthrough devices. Morgan Advanced Ceramics, Dean W Russell, Kristin D Mallatt, Kilpatrick Stockton, July 1, 2003: US06586675 (48 worldwide citation)

A feedthrough device having a ground wire that is coupled to both a metallic ferrule and to an insulating material and methods of making the device are provided. The ground wire is coupled or brazed between, adjacent to, or otherwise in direct contact with the metallic ferrule and the insulating mat ...


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David Joseph Bealka, Christien Matthew Vaillancourt, Fred Michael Kimock, Emma Claire Gill: Co-fired metal and ceramic composite feedthrough assemblies for use at least in implantable medical devices and methods for making the same. Morgan Advanced Ceramics, Clock Tower Law Group, Erik J Heels, Michael A Bartley, April 15, 2014: US08698006 (19 worldwide citation)

A hermetic interconnect for medical devices is disclosed. In one embodiment, the interconnect includes platinum leads co-fired between alumina substrates to form a monolithic composite that is subsequently bonded into a titanium alloy flange. Both methodology for forming these interconnects as well ...


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David E Slutz, Steven J Finke: CVD diamond-coated composite substrate containing a carbide-forming material and ceramic phases and method for making same. Morgan Advanced Ceramics, Kilpatrick Stockton, May 6, 2008: US07367875 (14 worldwide citation)

The present invention relates to a composite material and the method of making same, which comprises a CVD diamond coating applied to a composite substrate of ceramic material and an unreacted carbide-forming material of various configurations and for a variety of applications. One example of the co ...


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BEALKA DAVID JOSEPH: Co-fired metal and ceramic composite feedthrough assemblies for use at least in implantable medical devices and methods for making the same. MORGAN ADVANCED CERAMICS, Pratt John S, December 9, 2010: WO/2010/141100 (9 worldwide citation)

A hermetic interconnect for medical devices is disclosed. In one embodiment, the interconnect includes platinum leads co-fired between alumina substrates to form a monolithic composite that is subsequently bonded into a titanium alloy flange. Both methodology for forming these interconnects as well ...


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David S Hoover, Ronald R Petkie: CVD diamond enhanced microprocessor cooling system. Morgan Advanced Ceramics, Dean W Russell, Kristin M Crall, Kilpatrick Stockton, March 4, 2008: US07339791 (5 worldwide citation)

Cooling systems for microprocessors are addressed. Some systems may include a chemical vapor deposited (CVD) diamond heatspreader mounted to a base of a heat sink and to a microprocessor chip, while others may include a copper insert mounted within a depression of a heat sink, with the CVD diamond h ...


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John Antalek: Devices and methods for mounting components of electronic circuitry. Morgan Advanced Ceramics, Bruce D Gray, Dean W Russell, Kilpatrick Stockton, March 2, 2004: US06699571 (3 worldwide citation)

Devices and methods for mounting components of electronic circuitry and these mounting devices are capable of surviving repeated thermal cycling. The devices comprise two metal laminate members brazed to a ceramic member on each of the two major surfaces of the ceramic member. The laminates preferab ...


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David Thomas Forrest, Mark Wallace Schauer: Free-standing silicon carbide articles formed by chemical vapor deposition and methods for their manufacture. Morgan Advanced Ceramics, Dean W Russell, Kristin M Crall, Kilpatrick Stockton, November 9, 2010: US07829183 (1 worldwide citation)

Improved methods for manufacturing silicon carbide rings using chemical vapor deposition. Cylindrical tubes are used as deposition substrates and the resulting material deposited on the inside surface of cylindrical tubes or on the outside surface of cylindrical mandrels, or both, is sliced or cut i ...


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Bealka David Joseph, Da Costa Pedro Henrique: Feedthrough devices. Morgan Advanced Ceramics, June 13, 2001: EP1107264-A2 (1 worldwide citation)

A feedthrough device having a ground wire that is coupled to both a metallic ferrule and to an insulating material and methods of making the device are provided. The ground wire is coupled or brazed between, adjacent to, or otherwise in direct contact with the metallic ferrule and the insulating mat ...


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