1
Yoshiaki Asayama: Vehicle-surroundings monitoring apparatus. Mitsubishi Denki Kabushiki Kaisha, Sughrue Mion Zinn Macpeak and Seas, June 13, 1995: US05424952 (362 worldwide citation)

A vehicle-surroundings monitoring apparatus is free from mistakenly identifying a lane marker on a road surface or a guard rail as a vehicle traveling in the blind spot of a nearby lane. A distance detecting section detects the distance up to a vehicle which is traveling in the blind-spot of a nearb ...


2
Yoshiaki Asayama: Obstacle detecting device for a vehicle. Mitsubishi Denki Kabushiki Kaisha, Sughrue Mion Zinn Macpeak & Seas, January 31, 1995: US05386285 (357 worldwide citation)

An obstacle detecting device for a vehicle comprises a pair of image sensors for taking an image of an object surrounding a vehicle, a display image plane for displaying an image data taken by said pair of image sensors as an image, and a plurality of windows designating regions of said image on sai ...


3
Hideki Ishii: Packed semiconductor device with wrap around external leads. Mitsubishi Denki Kabushiki Kaisha, Leydig Voit & Mayer, November 10, 1998: US05835988 (344 worldwide citation)

A semiconductor device with reduced thickness, improved heat radiation, and a stacked structure. Molded resin covers an IC chip wire and part of a die pad. The die pad is exposed from the molded resin. An external lead in the same plane as the exposed surface of the die pad extends to a side of the ...


4
Minoru Nishida, Yoshihiko Utsui, Noriyuki Inoue: Driving environment surveillance apparatus. Mitsubishi Denki Kabushiki Kaisha, Wolf Greenfield & Sacks, December 12, 1995: US05475494 (330 worldwide citation)

A driving environment surveillance apparatus is provided to specify a region where an obstacle is present depending upon an azimuth detected by an obstacle detecting unit so as to derive a two-dimensional image corresponding to the specified region from an image detecting unit, and to extract the ob ...


5
Tadatomo Suga: Interconnect structure for stacked semiconductor device. Oki Electric, Sanyo Electric, Sony Corporation, Kabushiki Kaisha Toshiba, NEC Corporation, Sharp Kabushiki Kaisha, Hitachi, Fujitsu, Matsushita Electronics Corporation, Mitsubishi Denki Kabushiki Kaisha, Rohm, Sonnenschein Nath & Rosenthal, October 15, 2002: US06465892 (278 worldwide citation)

In a multi-layer interconnection structure, the wiring length is to be reduced, and the interconnection is to be straightened, at the same time as measures need to be taken against radiation noise. To this end, there is disclosed a semiconductor device in which plural semiconductor substrates, each ...


6
Yasuhiro Konishi, Takayuki Miyamoto, Takeshi Kajimoto, Hisashi Iwamoto: Synchronous semiconductor memory device. Mitsubishi Denki Kabushiki Kaisha, Lowe Price LeBlanc & Becker, January 24, 1995: US05384745 (277 worldwide citation)

Memory arrays are divided into banks which can be operated independent from each other. Read data storing registers and write data storing registers operating independent from each other are provided for the banks. The memory array is divided into a plurality of small array blocks, local IO lines ar ...


7
Teratani Hiroshi, Inoue Takeo, Kobayashi Toshiyuki: Dispositif a electrode pour le chauffage electrique de gisements dhydrocarbures, Electrode device for electrically heating underground deposits of hydrocarbons. Mitsubishi Denki Kabushiki Kaisha, RICHES MCKENZIE & HERBERT, May 29, 1984: CA1168283 (275 worldwide citation)

M14-25429M/KH/81 ABSTRACT OF THE DISCLOSUREAn electrode device for electrically heating undergrounddeposits of hydrocarbons such as oil sand or oil shale. Pluralwell pipe sections are joined through insulated pipe joints withan electrode connected through one of the insulated pipe jointsto a lower o ...


8
Kazunari Michii: Packaged semiconductor device having tab tape and particular power distribution lead structure. Mitsubishi Denki Kabushiki Kaisha, Leydig Voit & Mayer, October 12, 1993: US05252853 (274 worldwide citation)

A packaged semiconductor device having an LOC structure, a thin body, and good electrical characteristics employs a TAB tape. A semiconductor chip carries ground pads arranged in a row, power pads arranged in another row, and signal pads arranged in two rows on both sides of the rows of ground and p ...


9
Tadatomo Suga: Method for manufacturing an interconnect structure for stacked semiconductor device. Oki Electric, Sanyo Electric, Sony Corporation, Kabushiki Kaisha Toshiba, NEC Corporation, Sharp Kabushiki Kaisha, Hitachi, Fujitsu, Matsushita Electronics Corporation, Mitsubishi Denki Kabushiki Kaisha, Rohm, Sonnenschein Nath & Rosenthal, October 29, 2002: US06472293 (262 worldwide citation)

In a multi-layer interconnection structure, the wiring length is to be reduced, and the interconnection is to be straightened, at the same time as measures need to be taken against radiation noise. To this end, there is disclosed a semiconductor device in which plural semiconductor substrates, each ...


10
Yoshihiro Notani, Takayuki Katoh: Microwave IC package. Mitsubishi Denki Kabushiki Kaisha, Leydig Voit & Mayer, March 15, 1994: US05294897 (258 worldwide citation)

A surface mountable microwave IC package includes a dielectric substrate; a ground conductor disposed on a front surface of a dielectric substrate on which a microwave IC chip is disposed and grounded; and a transmission line for connecting the microwave IC chip to a coplanar line on a package subst ...