1
Rick Lake
Rick C Lake: Microelectronic devices and methods for manufacturing microelectronic devices. Micron Technology, Perkins Coie, January 4, 2011: US07863727 (6 worldwide citation)

Microelectronic devices and methods for manufacturing microelectronic devices are disclosed herein. In one embodiment, a microelectronic device includes a microelectronic die, a plurality of electrical couplers projecting from the die, and a flowable material disposed on the die. The die includes an ...


2
Rick Lake
Swarnal Borthakur, Rick Lake, Andy Perkins, Scott Churchwell, Steve Oliver: Method and apparatus providing an imager module with a permanent carrier. Micron Technology, Dickstein Shapiro, March 25, 2014: US08680634 (2 worldwide citation)

Method and apparatus providing a wafer level fabrication of imager modules in which a permanent carrier protects imager devices on an imager wafer and is used to support a lens wafer.


3
Rick Lake
Swarnal Borthakur, Rick Lake, Andy Perkins, Scott Churchwell, Steve Oliver: Method and apparatus providing an imager module with a permanent carrier. Micron Technology, Dickstein Shapiro, November 1, 2011: US08048708 (2 worldwide citation)

Method and apparatus providing a wafer level fabrication of imager modules in which a permanent carrier protects imager devices on an imager wafer and is used to support a lens wafer.


4
Rick Lake
Rick Lake, Jacques Duparre: Method and apparatus providing combined spacer and optical lens element. Micron Technology, Dickstein Shapiro, May 28, 2013: US08450821 (1 worldwide citation)

A method and apparatus used for forming a lens and spacer combination, and imager module employing the spacer and lens combination. The apparatus includes a mold having a base, spacer section, and mold feature. The method includes using the mold with a blank to create a spacer that includes an integ ...


5
Rick Lake
Rick C Lake, Ross S Dando: Systems and methods for depositing conductive material into openings in microfeature workpieces. Micron Technology, Perkins Coie, December 7, 2010: US07845540

Systems and methods for depositing conductive material into openings in microfeature workpieces are disclosed herein. One particular embodiment of a system for processing microfeature workpieces includes a processing chamber and a solder reservoir in the processing chamber. The solder reservoir incl ...


6
Rick Lake
Warren M Farnworth, Rick C Lake, William M Hiatt: Microfeature workpieces having alloyed conductive structures, and associated methods. Micron Technology, Perkins Coie, January 28, 2014: US08637994

Microfeature workpieces having alloyed conductive structures, and associated methods are disclosed. A method in accordance with one embodiment includes applying a volume of material to a target location of a microfeature workpiece, with the volume of material including at least a first metallic cons ...


7

8
Rick Lake
Lake Rick C, Dando Ross S: Systems and methods for depositing conductive material into openings in microfeature workpieces. Micron Technology, June 19, 2008: KR1020087007211

Systems and methods for depositing conductive material into openings in microfeature workpieces are disclosed herein. One particular embodiment of a system for processing microfeature workpieces includes a processing chamber and a solder reservoir in the processing chamber. The solder reservoir incl ...


9
Rick Lake
Warren M Farnworth, Rick C Lake, William M Hiatt: Microfeature workpieces having alloyed conductive structures, and associated methods. Micron Technology, January 3, 2013: US20130004792-A1

Microfeature workpieces having alloyed conductive structures, and associated methods are disclosed. A method in accordance with one embodiment includes applying a volume of material to a target location of a microfeature workpiece, with the volume of material including at least a first metallic cons ...


10
Tyler A Lowrey, Randal W Chance, David A Cathey: Method for reducing, by a factor or 2.sup.-N, the minimum masking pitch of a photolithographic process. Micron Technology, Angus C Fox III, July 12, 1994: US05328810 (493 worldwide citation)

The process starts with a primary mask, which may be characterized as a pattern of parallel, photoresist strips having substantially vertical edges, each having a minimum feature width F, and being separated from neighboring strips by a minimum space width which is also approximately equal to F. Fro ...



Click the thumbnails below to visualize the patent trend.