1
David A Wroblewski, William C Hill, Timothy P McCandless: Computer display unit with attribute enhanced scroll bar. Microelectronics and Computer Technology Corporation, David M Sigmond, August 16, 1994: US05339391 (217 worldwide citation)

An attribute-enhanced scroll bar is graphically displayed. A selected portion of a stored data file, for example a document, is displayed in a display field, and a scroll bar field including a scroll bar is used to indicate the position of the displayed portion relative to the entire data file. In a ...


2
Alan D Wexelblat, Kim M Fairchild: Method and system for generating dynamic, interactive visual representations of information structures within a computer. Microelectronics and Computer Technology Corporation, Johnson & Gibbs, June 4, 1991: US05021976 (167 worldwide citation)

A method and system for generating dynamic, interactive visual representations of information structures within a computer which enable humans to efficiently process vast amounts of information. The boundaries of the information system containing the information to be processed are established and a ...


3
David H Carey: Methods of forming channels and vias in insulating layers. Microelectronics and Computer Technology Corporation, David M Sigmond, December 22, 1992: US05173442 (146 worldwide citation)

Channels extending partially through and vias extending completely through an insulating layer in an electrical interconnect such as a substrate or integrated circuit can be formed in a relatively few steps with low cost etching and patterning techniques. The channels and vias can then be filled wit ...


4
Dennis J Herrell, David A Gibson: Fluid-cooled integrated circuit package. Microelectronics and Computer Technology Corporation, Fulbright & Jaworski, July 19, 1988: US04758926 (128 worldwide citation)

A package for enclosing, protecting and cooling semiconductor integrated circuit chips. The package includes a generally planar substrate with the chips positioned thereon. Signal connections are provided between at least some of the chips. A heat sink is positioned in contact with the chips and inc ...


5
Nalin Kumar: Method of forming field emitter device with diamond emission tips. Microelectronics and Computer Technology Corporation, David M Sigmond, April 6, 1993: US05199918 (125 worldwide citation)

A field emitter device comprising a conductive metal and a diamond emission tip with negative electron affinity in ohmic contact with and protruding above the metal. The device is fabricated by coating a substrate with an insulating diamond film having negative electron affinity and a top surface wi ...


6
David H Carey, Barry H Whalen: Compact adapter package providing peripheral to area translation for an integrated circuit chip. Microelectronics and Computer Technology Corporation, David M Sigmond, January 3, 1995: US05379191 (117 worldwide citation)

An peripheral to area adapter for an integrated circuit chip. The adapter comprises pads on an upper surface of a support in a pattern corresponding to the terminals on a integrated circuit, planar reroute lines on the upper surface with first ends at the pads, and vertical conductive vias extending ...


7
David H Carey: Flip substrate for chip mount. Microelectronics and Computer Technology Corporation, Fulbright & Jaworski, May 15, 1990: US04926241 (117 worldwide citation)

A substrate for attaching electrical devices having an interconnect wiring structure and a support for the interconnect, the support having a number of vias, or throughholes, extending therethrough and electrically connected to the interconnect. The substrate allows for attachment of the electrical ...


8
Bradley H Nelson: Method of assembling stacks of integrated circuit dies. Microelectronics and Computer Technology Corporation, David M Sigmond, January 15, 1991: US04984358 (112 worldwide citation)

Integrated circuit dies, while still in wafer form, are prepared for stacking without requiring packaging. Holes are made through a wafer having a plurality of integrated circuit dies and are placed between the dies and adjacent the die pads. A layer of insulating material is placed on the wafer and ...


9
Gale L Martin, James A Pittman, Mosfeq Rashid: Pattern recognition neural network with saccade-like operation. Microelectronics and Computer Technology Corporation, Gregory M Howison, March 19, 1996: US05500905 (101 worldwide citation)

A multi-layered pattern recognition neural network (30) is disclosed that comprises an input layer (50) that is operable to be mapped onto an input space that includes a scan window (32). Two hidden layers (54) and (58) map the input space to an output layer (34). The hidden layers utilize a local r ...


10
Ernest R Nolan, Diana C Duane, Todd H Herder, Thomas A Bishop, Kimcuc T Tran, Robert W Froehlich, Randy L German, Richard D Nelson, Chung J Lee, Mark R Breen, Kathryn V Keswick: Compliant electrically connective bumps for an adhesive flip chip integrated circuit device and methods for forming same. Microelectronics and Computer Technology Corporation, Baker & Botts, April 16, 1996: US05508228 (98 worldwide citation)

Compliant electrically connection bumps for an adhesive flip chip integrated circuit device and various methods for forming the bumps include the steps of forming polymer bumps on a substrate or an integrated circuit die and coating the polymer bumps with a metallization layer. The polymer bump form ...